MPX53D vs MPX53GP Comparación
Comparación detallada lado a lado de MPX53D por NXP Semiconductors y MPX53GP por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MPX53D | MPX53GP |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Pressure Sensors | Pressure Sensors |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $9,10 | $6,10 |
| Pressure Type | Differential | Vented Gauge |
| Operating Pressure Range | 0 kPa to 50 kPa (0 PSI to 7.25 PSI) | 0 kPa to 50 kPa (0 to 7.25 PSI) |
| Tipo de salida | Analog Voltage (Wheatstone bridge, uncompensated) | Wheatstone Bridge (analog voltage) |
| Full-Scale Output | 60 mV typical at 3 V supply | 60 mV at 3 V supply |
| Output Range | 0 mV to 60 mV | 20 mV to 80 mV (manufacturer sensitivity window) |
| Tensión de alimentación | 3 V typical | 3 V typical |
| Port Size | Female, 0.136 in (3.4544 mm) | Male - 0.19 inch (4.93 mm) barbed tube |
| Termination Style | Through-Hole PCB (4-SIP) | PCB (Through-Hole) |
| Encapsulado | Unibody 4-SIP (UNIBODY4F, 2.54 mm pitch) | — |
| Package Dimensions | 15.56 mm x 15.56 mm x 5.33 mm | — |
| Tipo de montaje | Through Hole | — |
| Sensor Technology | Silicon piezoresistive (strain-gauge bridge) | — |
| Temperatura de funcionamiento | -40C to +125C (per MPX53 family datasheet) | [DATA_NEEDED: operating temperature range] |
| Compensation | Uncompensated (external TC and signal conditioning required) | — |
| Media Compatibility | Non-corrosive, non-ionic media; see ST app note AN3728 | — |
| Estado RoHS | Compliant (per ST product page) | [DATA_NEEDED: RoHS status from datasheet] |
| Maximum Overpressure | — | 175 kPa (25.38 PSI) |
| Accuracy | — | -0.6% to +0.4% |
| Port Style | — | Barbed |
| Encapsulado / Carcasa | — | 4-SIP Module |
| Mounting Feature | — | Through-Hole Mount |
| Package Shape | — | Circular |