MPX5700GP vs MPX5700GP1117 Comparación
Comparación detallada lado a lado de MPX5700GP por NXP Semiconductors y MPX5700GP1117 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPX5700GP - 700 kPa Gauge Pressure Sensor | NXP Semiconductors
MPX5700GP ✓ ActivoComparación de especificaciones
| Parámetro | MPX5700GP | MPX5700GP1117 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Pressure Sensors | Pressure Sensors |
| Estado del ciclo de vida | Activo | Activo |
| Pressure Type | Vented Gauge | Vented Gauge |
| Operating Pressure Range | 0 kPa to 700 kPa (0 PSI to 101.53 PSI) | 0 kPa to 700 kPa (0 to 101.53 PSI) |
| Maximum Overpressure | [DATA_NEEDED: maximum overpressure rating] | — |
| Supply Voltage (Vcc) | 4.75 V to 5.25 V (typ. 5.0 V) | — |
| Corriente de alimentación | [DATA_NEEDED: typical supply current] | 10 mA typical |
| Rango de tensión de salida | 0.2 V to 4.7 V | 0.2 V to 4.7 V (at 5 V supply) |
| Full-Scale Span | 4.5 V (typ.) | — |
| Offset (Zero Pressure) | 0.2 V (typ.) | — |
| Accuracy | ±2.5 % full scale (0 to 85 °C) | ±2.5% (0°C to 85°C) |
| Temperatura de funcionamiento | -40 °C to +125 °C | -40°C to +125°C |
| Storage Temperature | -40 °C to +125 °C | — |
| Response Time | [DATA_NEEDED: response time] | 1 ms typical |
| Port Size | 0.19 in (4.93 mm) Tube Male | — |
| Encapsulado / Carcasa | 6-SIP Module | — |
| Tipo de montaje | Through-Hole (ported) | Through-Hole (vertical port) |
| Tipo de salida | Analog, ratiometric | Analog voltage, ratiometric |
| Estado RoHS | [DATA_NEEDED: RoHS compliance] | Compliant |
| Maximum Overload Pressure | — | 2100 kPa |
| Tensión de alimentación | — | 4.75 V to 5.25 V (5 V typical) |
| Compensated Temperature | — | 0°C to 85°C |
| Port Style | — | GP - vertical port with 4.93 mm (0.19 in) tube |
| Encapsulado | — | 6-SIP through-hole module |
| Signal Conditioning | — | On-chip amplified, temperature compensated |
| Calibration | — | On-chip laser-trimmed |