MPXA4100AC6U vs MPXA4100A6U Comparación
Comparación detallada lado a lado de MPXA4100AC6U por NXP Semiconductors y MPXA4100A6U por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPXA4100AC6U - 105 kPa Absolute Pressure Sensor | NXP | Automotive MAP
MPXA4100AC6U ✓ Activo
Comparación de especificaciones
| Parámetro | MPXA4100AC6U | MPXA4100A6U |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Pressure Sensors | Pressure Sensors |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $10,75 | $8,64 |
| Pressure Type | Absolute | Absolute (Manifold Absolute Pressure) |
| Operating Pressure Range | 20 kPa to 105 kPa (2.9 PSI to 15.23 PSI) | 20 kPa to 105 kPa (2.9 PSI to 15.23 PSI) |
| Maximum Overpressure | 400 kPa (58.02 PSI) | — |
| Tipo de salida | Analog Voltage, Ratiometric | Analog voltage, ratiometric to Vcc |
| Rango de tensión de salida | 0.3 V to 4.9 V | 0.3 V to 4.9 V |
| Accuracy | ±1.8 %VFSS | [DATA_NEEDED: accuracy %] |
| Tensión de alimentación | 5.0 V typical (ratiometric) | 4.85 V to 5.35 V (5 V typical) |
| Maximum Operating Current | 6 mA | — |
| Temperatura de funcionamiento | -40 °C to +125 °C | -40 C to +125 C |
| Port Size | Male, 0.13" (3.17 mm) tube, top port | — |
| Termination Style | Gull-wing SMD | — |
| Encapsulado | 8-SMD, top port | — |
| Sensing Technology | Piezoresistive MEMS with on-chip ASIC | — |
| Calibration | On-chip temperature compensated and calibrated | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | [DATA_NEEDED: rohs status] |
| Maximum Overload Pressure | — | 16.7 PSI (per distributor listing) |
| Transfer Function | — | 54 mV/kPa |
| Corriente de alimentación | — | [DATA_NEEDED: supply current] |
| Port Style | — | Vertical (axially aligned to package) |
| Encapsulado / Carcasa | — | 8-SMD Module (SOP with port) |
| Technology | — | Piezoresistive (MEMS silicon) |
| On-Chip Signal Conditioning | — | Yes (calibrated and temperature compensated) |