MPXV7025GP vs MPXV7025DP Comparación
Comparación detallada lado a lado de MPXV7025GP por NXP Semiconductors y MPXV7025DP por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPXV7025GP - ±25kPa Compound Pressure Sensor, 8-SMD | NXP Semiconductors
MPXV7025GP ✓ ActivoComparación de especificaciones
| Parámetro | MPXV7025GP | MPXV7025DP |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Pressure Sensors | Pressure Sensors |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $7,50 | $8,05 |
| Pressure Type | Compound (positive and vacuum) | Differential (Dual Port) |
| Operating Pressure Range | ±3.63 PSI (±25 kPa) | — |
| Maximum Overload Pressure | [DATA_NEEDED: maximum overload pressure] | — |
| Tipo de salida | Analog voltage | Analog voltage, ratiometric |
| Rango de tensión de salida | 0.2 V to 4.7 V | 0.2 V to 4.7 V |
| Output Span | 4.5 V (typical) | — |
| Pressure Port | Male - 0.13" (3.18 mm) Tube, Side | — |
| Tensión de alimentación | 5 V typical (ratiometric output) | 5 V DC nominal |
| Corriente de alimentación | [DATA_NEEDED: supply current] | — |
| Accuracy | [DATA_NEEDED: accuracy %FS] | — |
| Temperatura de funcionamiento | -40C to +125C | 0 °C to +85 °C |
| Encapsulado / Carcasa | 8-SMD, Gull Wing, Side Port | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Technology | Piezoresistive MEMS with on-chip ASIC | — |
| Port Style | Single side port with barbed stem | Dual ports, same side, male 0.13" (3.3 mm) tube |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Pressure Range | — | -25 kPa to +25 kPa (-3.63 PSI) |
| Operating Pressure Max | — | ±25 kPa |
| Sensitivity | — | ~90 mV/kPa (at 5 V supply) |
| Linearity | — | ±5 % (over primary range) |
| Storage Temperature | — | -30 °C to +100 °C (per datasheet range) |
| Encapsulado | — | 8-BSOP (SOP-8, 12.06 mm width), surface mount |
| Signal Conditioning | — | On-chip, calibrated and temperature compensated |