RTAX2000SL-1CQ352V vs RTAX2000DL-1CQ352V Comparación
Comparación detallada lado a lado de RTAX2000SL-1CQ352V por Microchip Technology y RTAX2000DL-1CQ352V por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
RTAX2000SL-1CQ352V - 2M-Gate Rad-Tolerant FPGA | Microchip
RTAX2000SL-1CQ352V ✓ ActivoMicrochip Technology
RTAX2000DL-1CQ352V - 2M-Gate Rad-Tolerant FPGA | Microchip
RTAX2000DL-1CQ352V ✓ ActivoComparación de especificaciones
| Parámetro | RTAX2000SL-1CQ352V | RTAX2000DL-1CQ352V |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.050,00 | $2.950,00 |
| Family | RTAX-S/SL Radiation-Tolerant FPGA | RTAX-DSP (RTAX2000DL) |
| Equivalent System Gates | 2,000,000 | 2,000,000 (approx.) |
| CLB Count | 21,504 | — |
| Logic Cells | 32,256 | 29,568 |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) | 1.425 V to 1.575 V (nominal 1.5 V) |
| Process Technology | CMOS, antifuse OTP interconnect | — |
| Radiation Tolerance | Radiation-tolerant (space flight grade) | Radiation-tolerant (RTAX-DSP) |
| Configuration | Live at power-up, single chip (antifuse) | Live at power-up, no external boot memory |
| Embedded Memory | Embedded SRAM with built-in FIFO control | — |
| Clocking | Segmentable clock resources, chip-wide highway routing | — |
| Encapsulado | 352-pin ceramic CQFP (CQ352) | CQ352 (352-pin ceramic QFP) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Application Domain | Space flight systems | Space-flight systems |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: Operating Temperature] |
| I/O Supply Voltage | [DATA_NEEDED: I/O bank voltage] | — |
| Total Ionizing Dose (TID) | [DATA_NEEDED: TID rating] | — |
| Nivel MSL | Not applicable (ceramic package) | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS Status] |
| CLBs | — | 19,712 |
| Technology | — | Digital CMOS |
| Programming Technology | — | Antifuse (one-time programmable) |
| Speed Grade | — | -1 |
| Special Features | — | DSP multiply-accumulate blocks (DL variant) |
| Embedded SRAM | — | [DATA_NEEDED: Embedded SRAM capacity] |