RTAX250SL-1CG624V vs RTAX250SL-1LG624E Comparación
Comparación detallada lado a lado de RTAX250SL-1CG624V por Microchip Technology y RTAX250SL-1LG624E por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
RTAX250SL-1CG624V - 250k-Gate Rad-Tolerant FPGA | Microchip
RTAX250SL-1CG624V ✓ ActivoMicrochip Technology
RTAX250SL-1LG624E - 250K Gate Rad-Tolerant FPGA | Microchip
RTAX250SL-1LG624E ✓ ActivoComparación de especificaciones
| Parámetro | RTAX250SL-1CG624V | RTAX250SL-1LG624E |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $2.350,00 |
| Family | RTAX-S/SL Radiation-Tolerant FPGA | RTAX-SL Radiation-Tolerant FPGA |
| Equivalent Gates | 250000 gates | — |
| Logic Cells | 4224 | 4224 |
| CLBs | 2816 | — |
| User I/O Inputs | 248 | — |
| User I/O Outputs | 248 | — |
| Core Supply Voltage | 1.425 V to 1.575 V | 1.5 V |
| Technology | CMOS, antifuse | — |
| Configuration | Live at power-up, single-chip | — |
| Speed Grade | -1 | -1 (fastest) |
| Encapsulado | 624-pin ceramic column grid array (CGA) | 624-Pin LGA (LG624), ceramic |
| Tipo de montaje | Surface Mount | Surface Mount |
| Radiation Tolerance | Radiation-tolerant (space-flight) | — |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: Operating Temperature Range] | — |
| SEU Characterization | SEU-optimized SL fabric generation | — |
| Estado RoHS | [DATA_NEEDED: RoHS Status] | — |
| Equivalent System Gates | — | 250000 |
| Configurable Logic Blocks (CLBs) | — | 2816 |
| Maximum Frequency | — | 649 MHz |
| Process Technology | — | 0.15 um CMOS |
| Temperatura de funcionamiento | — | -55C to +125C |
| Configuration Type | — | One-time programmable, live at power-up |
| Embedded Memory | — | Embedded SRAM with built-in FIFO control logic |
| Clocking | — | Segmentable clocks, chip-wide routable reset |
| Packaging Option | — | Box |
| Target Market | — | Space flight systems |