RTAX4000D-CQ352E vs RTAX4000D-CQ352EV Comparación
Comparación detallada lado a lado de RTAX4000D-CQ352E por Microsemi y RTAX4000D-CQ352EV por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microsemi
RTAX4000D-CQ352E - 4M Gate Rad-Tolerant FPGA CQFP-352 | Microchip
RTAX4000D-CQ352E ✓ ActivoMicrochip Technology
RTAX4000D-CQ352EV - 4M-Gate Rad-Tolerant FPGA CQFP-352 | Microchip
RTAX4000D-CQ352EV ✓ ActivoComparación de especificaciones
| Parámetro | RTAX4000D-CQ352E | RTAX4000D-CQ352EV |
|---|---|---|
| Marca | Microsemi | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $0,00 |
| Family | RTAX-DSP Radiation-Tolerant FPGA | RTAX-DSP Radiation-Tolerant FPGA |
| System Gates | 4,000,000 | — |
| Logic Cells | 33,600 | 33,600 |
| Process Technology | 0.15 um CMOS | 0.15 um CMOS |
| Core Supply Voltage | 1.5 V | 1.5 V nominal (1.425 V to 1.575 V) |
| Encapsulado | 352-Pin CQFP (CQ352) ceramic, hermetic | 352-Pin Ceramic CQFP |
| Configuration | Live at power-up (antifuse, single-chip) | Live at power-up, single-chip |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic | Embedded SRAM with FIFO control logic |
| Clocking | Segmentable clocks, chip-wide highway routing | — |
| Number of CLBs | [DATA_NEEDED: CLB / AX cell organization count] | — |
| User I/O Count | [DATA_NEEDED: user I/O count for CQ352 package] | — |
| Speed Grade | Standard (no dash-1 speed suffix indicated in CQ352E ordering code) | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | -55C to +125C |
| Radiation Tolerance | Radiation-tolerant, space-flight qualified family (per Microchip RTAX-DSP product page) | Radiation-tolerant (space flight) [DATA_NEEDED: TID/SEE levels] |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | [DATA_NEEDED: RoHS status - hermetic ceramic aerospace package, typically exempt] | [DATA_NEEDED: RoHS status] |
| Design Software | Microsemi/Microchip Libero SoC | — |
| Equivalent System Gates | — | 4,000,000 |
| CLB Organization | — | 36,960 CLBs |
| Combinatorial CLB Delay | — | [DATA_NEEDED: combinatorial CLB delay] |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |