RTAX4000DL-CQ352E vs RTAX4000D-CQ352V Comparación
Comparación detallada lado a lado de RTAX4000DL-CQ352E por Microchip Technology y RTAX4000D-CQ352V por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
RTAX4000DL-CQ352E - 4M-Gate Rad-Tolerant FPGA | Microchip
RTAX4000DL-CQ352E ✓ ActivoMicrochip Technology
RTAX4000D-CQ352V - 4M-Gate Rad-Tolerant FPGA | Microchip Technology
RTAX4000D-CQ352V ✓ ActivoComparación de especificaciones
| Parámetro | RTAX4000DL-CQ352E | RTAX4000D-CQ352V |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $0,00 |
| Manufacturer | Microchip Technology (Actel/Microsemi) | — |
| Family | RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs | RTAX-S/SL and RTAX-DSP radiation-tolerant FPGAs |
| Equivalent System Gates | 4,000,000 gates | 4,000,000 gates |
| Logic Cells | 55,440 | 55,440 |
| CLBs | 36,960 | — |
| Process Technology | CMOS | — |
| Programmability | Antifuse (live-at-power-up) | — |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic | Embedded SRAM with built-in FIFO control logic |
| DSP Resources | Dedicated multiply-accumulate blocks (RTAX-DSP variant) | — |
| Clocking | Segmentable clocks, chip-wide highway routing | Segmentable clocks, chip-wide highway routing |
| Arithmetic Support | Carry logic | — |
| Encapsulado | CQ352 ceramic column package, 352 pins | CQ352 ceramic column grid array |
| Tipo de montaje | Surface Mount | Surface Mount |
| Application Domain | Space-flight systems | Space flight systems (radiation-tolerant) |
| Radiation Tolerance | Radiation-tolerant (TID and SEE qualified per family datasheet) | [DATA_NEEDED: TID and SEE ratings] |
| Configuration | True single-chip form factor | — |
| Estado RoHS | [DATA_NEEDED: RoHS Status] | [DATA_NEEDED: RoHS status] |
| CLB Organization | — | 36,960 CLBs |
| Number of User I/Os | — | 166 |
| Technology | — | Digital, CMOS |
| Programmability Type | — | Antifuse (OTP), live at power-up |
| Operating Temperature Min | — | -55 C |
| Operating Temperature Max | — | +125 C |
| Core Supply Voltage | — | [DATA_NEEDED: core voltage] |