S912XEQ512J2MAA vs MC9S12XDT512MAA Comparación
Comparación detallada lado a lado de S912XEQ512J2MAA por NXP Semiconductors y MC9S12XDT512MAA por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
S912XEQ512J2MAA - 16-bit 50MHz 512KB MCU | NXP | Automotive (Tape & Reel)
S912XEQ512J2MAA ✓ ActivoComparación de especificaciones
| Parámetro | S912XEQ512J2MAA | MC9S12XDT512MAA |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $8,60 | $0,00 |
| Core Processor | HCS12X (S12X) | HCS12X |
| Core Size | 16-bit | 16-Bit |
| Frecuencia de reloj máxima | 50 MHz | — |
| Flash Memory | 512KB (512K x 8) | — |
| RAM | [DATA_NEEDED: RAM size] | — |
| EEPROM | [DATA_NEEDED: EEPROM size] | — |
| Tensión de alimentación | 1.8V / 2.8V / 5V | [DATA_NEEDED: supply voltage range] |
| Temperatura de funcionamiento | -40C to +125C | -40C to +125C (TA) |
| Encapsulado | 80-QFP (14x14 mm), PQFP-80 | 80-QFP (14x14 mm), Square, Gull Wing |
| Tipo de montaje | Surface Mount | Surface Mount |
| Number of I/O | [DATA_NEEDED: number of I/O] | 59 |
| Communication Interfaces | [DATA_NEEDED: CAN/LIN/SPI/SCI configuration] | — |
| Qualification | Automotive AEC-Q100 Qualified | — |
| Packaging | Tape & Reel (T/R) | — |
| Lifecycle Stage | Active | — |
| Terminal Form | Gull Wing | — |
| Terminal Count | 80 | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | — |
| Maximum Clock Speed | — | 80 MHz |
| Program Memory Size | — | 512KB (512K x 8) |
| Program Memory Type | — | FLASH |
| RAM Size | — | 20KB |
| EEPROM Size | — | 4KB |
| Connectivity | — | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| ADC Resolution | — | 10-bit, 8-channel |
| Packaging Method | — | Tray |
| Sin halógenos | — | Compliant |
| ECCN | — | 3A991.a.2 |
| Estimated EOL Date | — | 2028 |