S9S08DZ48F1CLH vs S9S08DZ60F2MLH Comparación
Comparación detallada lado a lado de S9S08DZ48F1CLH por NXP Semiconductors y S9S08DZ60F2MLH por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
S9S08DZ48F1CLH - 8-bit MCU, 48KB Flash, CAN, 64-LQFP | NXP
S9S08DZ48F1CLH ✓ ActivoComparación de especificaciones
| Parámetro | S9S08DZ48F1CLH | S9S08DZ60F2MLH |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,80 | $2,45 |
| Core Processor | HCS08 (8-bit) | S08 (HCS08), 8-bit |
| Core Size | 8-bit | — |
| Maximum CPU Frequency | 40 MHz | — |
| Bus Frequency | 20 MHz | — |
| Flash Memory | 48 KB (48K x 8) | 60 KB (60K x 8) |
| RAM | 3 KB | [DATA_NEEDED: RAM size] |
| EEPROM | Embedded EEPROM | [DATA_NEEDED: EEPROM size] |
| Instruction Set | HC08 with added BGND instruction | — |
| Interrupt/Reset Sources | Up to 32 | — |
| Connectivity | CAN (embedded), SCI, SPI, IIC | — |
| Encapsulado | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Terminal Form | Gull Wing | — |
| Package Shape | Square | — |
| Series | S08 (S08DZ) | — |
| Target Markets | Automotive and Industrial | — |
| On-chip Debug | Yes (background debug mode, on-chip emulation/debug) | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | -40 C to +125 C |
| Tensión de alimentación | [DATA_NEEDED: supply voltage range] | 3.3 V / 5 V |
| Core Architecture | — | CISC |
| Frecuencia de reloj máxima | — | 40 MHz |
| CAN Module | — | msCAN (CAN 2.0 A/B) |
| LCD Driver | — | Integrated (per NXP product page) |
| ADC Resolution | — | 12-bit |
| Qualification | — | Automotive Qualified |
| Packaging | — | Tray |
| Peripherals | — | SCI, SPI, IIC, RTC, PWM |