S9S08SG8E2MSC vs MC9S08SH8MSC Comparación
Comparación detallada lado a lado de S9S08SG8E2MSC por NXP Semiconductors y MC9S08SH8MSC por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | S9S08SG8E2MSC | MC9S08SH8MSC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1,65 | $1,62 |
| Product Type | 8-bit microcontroller | — |
| Core | S08 / HCS08 | HCS08 (S08) |
| Frecuencia de reloj máxima | 40 MHz | — |
| Flash Memory | 8 KB | — |
| Flash Organization | 8K x 8 | — |
| Tensión de alimentación | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| I/O Ports | 4 | — |
| Encapsulado | 8-SOIC | SOIC-8 (SC) 3.9 mm |
| Package Width | 3.90 mm | — |
| Temperatura de funcionamiento | -40°C to +125°C | -40 C to +85 C (industrial) |
| Instruction Set | HCS08 with BGND instruction | HC08 with added BGND instruction |
| Interrupt and Reset Sources | Up to 32 | — |
| Automotive Qualification | Automotive Qualified | — |
| Estado RoHS | RoHS Compliant | [DATA_NEEDED: RoHS status] |
| Process Technology | 0.25 µm | — |
| Operating System Region | General-market and space-constrained applications | — |
| Manufacturer | NXP Semiconductors | — |
| Architecture | — | CISC, 8-bit |
| Program Memory | — | 8 KB Flash |
| RAM | — | [DATA_NEEDED: RAM size] |
| Maximum CPU Frequency | — | 40 MHz |
| ADC | — | 12-channel, 10-bit, 2.5 us conversion time |
| Communication Peripherals | — | I2C, LIN, SCI, SPI |
| Analog Comparator | — | Yes (on-chip) |
| Temperature Sensor | — | Yes (internal) |
| Interrupt Sources | — | Up to 32 |
| Tipo de montaje | — | Surface Mount |
| Background Debug Mode (BGND) | — | Yes |