SPC5604BF2VLQ6R vs SPC5516GBMLQ66 Comparación
Comparación detallada lado a lado de SPC5604BF2VLQ6R por NXP Semiconductors y SPC5516GBMLQ66 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
SPC5604BF2VLQ6R - 32-bit MCU, 512KB Flash, 64MHz, Automotive | NXP
SPC5604BF2VLQ6R ✓ ActivoNXP Semiconductors
SPC5516GBMLQ66 - 32-bit Dual-Core 66MHz MCU 1MB Flash | NXP
SPC5516GBMLQ66 ✓ ActivoComparación de especificaciones
| Parámetro | SPC5604BF2VLQ6R | SPC5516GBMLQ66 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $11,20 | $10,40 |
| Core | e200z0h (Power Architecture Book-E) | — |
| Core Size | 32-bit single-core | 32-Bit Dual-Core |
| Frecuencia de reloj máxima | 64 MHz | — |
| Program Memory Size | 512 KB Flash (512K x 8) | 1 MB (1M x 8) FLASH |
| Program Memory Type | Flash with ECC | Flash with ECC |
| Tensión de alimentación | 3.3 V (single supply) | 4.5 V to 5.25 V |
| Rango de temperatura de funcionamiento | -40C to +105C (Automotive Grade) | — |
| Temperature Grade | Industrial / Automotive Grade 2 | — |
| Encapsulado | 144-LQFP (20x20 mm) - LFQFP, gull wing | 144-LQFP (20 x 20 mm, 1.40 mm height) |
| Number of Terminals | 144 | — |
| Terminal Form | GULL WING | — |
| Package Shape | Square | — |
| Series | MPC560xB/C/D Qorivva; SPC5604 sub-family | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Product Category | 32-bit Microcontrollers - MCU | — |
| Architecture Class | Automotive body electronics, industrial control | — |
| Nivel MSL | [DATA_NEEDED: MSL moisture sensitivity level] | [DATA_NEEDED: MSL rating] |
| Estado RoHS | Compliant | Compliant |
| Core Processor | — | e200z0, e200z1 |
| Core Architecture | — | Power Architecture (MPC55xx Qorivva) |
| Maximum Clock Speed | — | 66 MHz |
| RAM Size | — | [DATA_NEEDED: RAM size] |
| Number of I/O | — | 111 |
| Connectivity | — | CANbus, EBI/EMI, I2C, SCI, SPI |
| Peripherals | — | DMA, POR, PWM, WDT |
| Ancho del bus de datos | — | 32-bit |
| Temperatura de funcionamiento | — | -40C to +125C (AEC-Q100 Grade 3) |
| AEC-Q100 Qualified | — | Yes (automotive grade) |