SPC5606SF2CLU6 vs SPC5567MZQ80R Comparación
Comparación detallada lado a lado de SPC5606SF2CLU6 por NXP Semiconductors y SPC5567MZQ80R por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
SPC5606SF2CLU6 - 32-bit MCU, 1MB Flash, 64MHz, QFP-176 | NXP
SPC5606SF2CLU6 ✓ ActivoNXP Semiconductors
SPC5567MZQ80R - 32-bit MCU, 80MHz, 2MB Flash, FlexRay | NXP
SPC5567MZQ80R ✓ ActivoComparación de especificaciones
| Parámetro | SPC5606SF2CLU6 | SPC5567MZQ80R |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $8,78 | $51,40 |
| Manufacturer | NXP Semiconductors | NXP Semiconductors (formerly Freescale) |
| Series | MPC560xS (Qorivva) | — |
| Core Architecture | Power Architecture e200z0h | Power Architecture (e200 z6) |
| Core Count | 1 | — |
| Ancho del bus de datos | 32-bit | — |
| Frecuencia de reloj máxima | 64 MHz | — |
| Program Memory Size (Flash) | 1 MB (1024 KB) | — |
| RAM Size | [DATA_NEEDED: SRAM size] | — |
| Tensión de alimentación | 3.3 V / 5 V | — |
| Rango de temperatura de funcionamiento | -40C to +85C | -40C to +125C (Automotive Grade) |
| Encapsulado / Carcasa | 176-LQFP (24x24 mm) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Número de pines | 176 | — |
| Automotive Qualification | AEC-Q100 qualified | AEC-Q100 (per automotive temperature grade) |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Terminal Form | GULL WING | BALL |
| Temperature Grade | INDUSTRIAL (automotive application) | — |
| Peripheral Highlights | FlexCAN, eMIOS, eQADC, SPI, I2C, SCI, LCDC | — |
| Bit Width | — | 32-bit |
| Maximum CPU Frequency | — | 80 MHz |
| On-Chip Flash | — | 2 MB |
| On-Chip RAM | — | [DATA_NEEDED: SRAM size] |
| Encapsulado | — | PBGA-324 |
| Communication Interfaces | — | FlexRay, CAN, SPI, SCI |
| Lockstep / Safety | — | Dual-core lockstep architecture |
| Number of Terminals | — | 324 |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |