SPC5645SF1VVU vs SPC5644AF0MLU2 Comparación
Comparación detallada lado a lado de SPC5645SF1VVU por NXP Semiconductors y SPC5644AF0MLU2 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
SPC5645SF1VVU - 32-bit MCU, 2MB Flash, 125MHz, 416-PBGA | NXP
SPC5645SF1VVU ✓ ActivoComparación de especificaciones
| Parámetro | SPC5645SF1VVU | SPC5644AF0MLU2 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $27,10 | $12,50 |
| Core Architecture | Power Architecture e200z4d (dual-core lockstep option) | — |
| Ancho del bus de datos | 32-bit | — |
| Frecuencia de reloj máxima | 125 MHz | 120 MHz |
| Program Memory Size | 2 MB Flash | 4 MB (4M x 8) FLASH |
| Program Memory Type | Flash with ECC | — |
| SRAM Size | [DATA_NEEDED: SRAM size in KB] | — |
| Tensión de alimentación | 3.3 V / 5 V tolerant I/O | 1.2 V / 3.3 V / 5 V (family rating) |
| Rango de temperatura de funcionamiento | -40 C to +105 C | — |
| Encapsulado / Carcasa | 416-PBGA (27x27 mm, 1.0 mm pitch) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| AEC-Q100 Qualification | Yes (Automotive Grade) | — |
| Functional Safety | Targeting ASIL-D (dual-core lockstep) | — |
| CAN Controllers | Dual CAN 2.0B (FlexCAN) | — |
| FlexRay | Yes, dual-channel FlexRay module | — |
| Ethernet | [DATA_NEEDED: Ethernet MAC availability] | — |
| Graphics Accelerator | Yes, integrated GFXPU for TFT cluster | — |
| ADC | 12-bit ADC, multi-channel | — |
| Timers | eMIOS unified channels | — |
| Debug Interface | JTAG / Nexus 5001 (Level 3 trace) | — |
| Estado RoHS | Compliant | Lead Free / RoHS Compliant (LQFP lead-free finish per package description) |
| Process Technology | 90 nm CMOS | — |
| JEDEC MSL | MSL3 (per PBGA JEDEC J-STD-020) | — |
| Core Processor | — | e200z4 Power Architecture |
| Core Size | — | 32-bit |
| RAM Size | — | 192 KB |
| Number of I/O | — | 84 |
| Connectivity | — | CANbus, EBI/EMI, LINbus, SCI, SPI |
| Peripherals | — | DMA, POR, PWM, WDT |
| Instruction Set | — | VLE (Variable Length Encoding), superscalar, 2 execution units |
| Temperatura de funcionamiento | — | -40C to +125C |
| Encapsulado | — | 176-LQFP (24 x 24 mm, 0.5 mm pitch, 1.4 mm height) |
| Recuento de pines | — | 176 |
| Grade | — | Automotive Qualified |
| Part Status | — | Active |
| Series | — | MPC56xx Qorivva (SPC5644A) |