STM32F745IGT6 vs STM32F746IGK7 Comparación
Comparación detallada lado a lado de STM32F745IGT6 por STMicroelectronics y STM32F746IGK7 por STMicroelectronics. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | STM32F745IGT6 | STM32F746IGK7 |
|---|---|---|
| Marca | STMicroelectronics | STMicroelectronics |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Product Type | 32-bit ARM Cortex-M7 microcontroller | 32-bit Arm Cortex-M7 microcontroller |
| Processor Core | Arm Cortex-M7 | — |
| Instruction Set | 32-bit RISC | 32-bit RISC |
| Maximum CPU Frequency | 216 MHz | 216 MHz |
| Flash Memory | 1 MB (1M x 8) | 1 MB (1M x 8) |
| RAM Memory | 340 KB | — |
| Tensión de alimentación | 3.3 V | — |
| Encapsulado | 176-LQFP (24 x 24 mm) | 176+25 UFBGA (10x10) |
| Recuento de pines | 176 pins | — |
| Tipo de montaje | Surface mount | Surface mount ball-grid array |
| Series | STM32F7 Series | — |
| Device Family | STM32F745 | — |
| Flash Organization | 1M x 8 bits | — |
| Memory Category | High-performance embedded control | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| REACH Status | [DATA_NEEDED: REACH status] | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| External Interface Details | [DATA_NEEDED: external interfaces] | — |
| Manufacturer | — | STMicroelectronics |
| CPU Core | — | Arm Cortex-M7 |
| Core Configuration | — | Single-core |
| DSP and FPU Support | — | DSP and floating-point unit |
| Cache | — | L1 cache |
| External Memory Interfaces | — | SDRAM support |
| Display Support | — | TFT support |
| Hardware Acceleration | — | Art Accelerator |
| Package Body Size | — | 10 mm x 10 mm |
| Number of Device Balls | — | 176 balls plus 25 additional balls |
| RAM Capacity | — | [DATA_NEEDED: RAM capacity] |
| Operating Voltage Range | — | [DATA_NEEDED: operating voltage range] |
| AEC-Q100 Status | — | [DATA_NEEDED: AEC-Q100 qualification status] |