STM32F746ZGT6 vs STM32F745ZGT7 Comparación
Comparación detallada lado a lado de STM32F746ZGT6 por STMicroelectronics y STM32F745ZGT7 por STMicroelectronics. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
STMicroelectronics
STM32F746ZGT6 - 216MHz Cortex-M7 1MB Flash MCU | STMicroelectronics
STM32F746ZGT6 ✓ ActivoSTMicroelectronics
STM32F745ZGT7 - 216MHz Cortex-M7 1MB MCU | STMicroelectronics
STM32F745ZGT7 ✓ ActivoComparación de especificaciones
| Parámetro | STM32F746ZGT6 | STM32F745ZGT7 |
|---|---|---|
| Marca | STMicroelectronics | STMicroelectronics |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Core Architecture | Arm Cortex-M7 (32-bit) | — |
| Frecuencia de reloj máxima | 216 MHz | — |
| Performance | 462 DMIPS / 1082 CoreMark | — |
| FPU | Single-precision (IEEE 754) | — |
| DSP Instructions | Yes (full DSP instruction set) | — |
| Program Memory (Flash) | 1 MB (1M x 8) | — |
| SRAM | 320 KB | — |
| DTCM | 16 KB | — |
| L1 Cache (I/D) | 6 KB / 6 KB | — |
| Operating Voltage | 1.7 V to 3.6 V | — |
| I/O Voltage | 1.7 V to 3.6 V | — |
| Encapsulado | 144-LQFP (20x20 mm) | 144-lead LQFP |
| Temperatura de funcionamiento | -40 C to +85 C | — |
| ADC | 3 x 12-bit, up to 2.4 MSPS | — |
| DAC | 2 x 12-bit | — |
| Communication Interfaces | USB OTG HS/FS, Ethernet MAC (IEEE 1588), 2x CAN 2.0B, SPDIFRX, SDMMC, UART, SPI, I2C | — |
| LCD-TFT Controller | Yes (up to WXGA resolution, capacitive touch support) | — |
| DMA Channels | 16-stream DMA + Chrom-ART Accelerator (DMA2D) | — |
| Tipo de montaje | Surface Mount | Surface mount |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Product Type | — | 32-bit ARM Cortex-M7 microcontroller |
| Processor Core | — | Arm Cortex-M7 |
| Maximum CPU Frequency | — | 216 MHz |
| Instruction Set Width | — | 32-bit RISC |
| Flash Memory | — | 1 MB (1M x 8) |
| RAM Capacity | — | [DATA_NEEDED: RAM capacity] |
| Package Body Size | — | 20 x 20 mm |
| Supply Voltage Options | — | 1.8 V, 2.5 V, or 3.3 V |
| DSP and FPU Capability | — | High-performance DSP and floating-point capability |
| Rango de temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |
| Ethernet Support | — | [DATA_NEEDED: integrated Ethernet support] |
| Number of I/O Pins | — | [DATA_NEEDED: number of I/O pins] |
| External Memory Interfaces | — | [DATA_NEEDED: external memory interface details] |
| ADC Resolution | — | [DATA_NEEDED: ADC resolution] |
| Timer Count | — | [DATA_NEEDED: timer count] |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |