STM32H747BGT6 vs STM32H755ZIT6 Comparación
Comparación detallada lado a lado de STM32H747BGT6 por STMicroelectronics y STM32H755ZIT6 por STMicroelectronics. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
STMicroelectronics
STM32H747BGT6 - Dual Cortex-M7/M4 MCU, 1MB Flash | STMicroelectronics
STM32H747BGT6 ✓ ActivoSTMicroelectronics
STM32H755ZIT6 - Dual-Core Cortex-M7/M4 MCU, 2MB Flash | STMicroelectronics
STM32H755ZIT6 ✓ ActivoComparación de especificaciones
| Parámetro | STM32H747BGT6 | STM32H755ZIT6 |
|---|---|---|
| Marca | STMicroelectronics | STMicroelectronics |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $17,10 | $16,19 |
| Core Architecture | Dual-core Arm Cortex-M7 + Cortex-M4 | Dual-core Arm Cortex-M7 + Cortex-M4 |
| Cortex-M7 Max Frequency | 480 MHz | 480 MHz |
| Cortex-M4 Max Frequency | 240 MHz | 240 MHz |
| Flash Memory | 1 MB | 2 MB (dual-bank) |
| SRAM | 1 MB | 1 MB (DTCM + AXI + SRAM1/2/3) |
| Operating Voltage Range | 1.62 V to 3.6 V | — |
| Supply Voltage (typical) | 3.3 V | — |
| Rango de temperatura de funcionamiento | -40 °C to +85 °C | — |
| Encapsulado | LQFP-208 (28 x 28 mm) | LQFP-144 (20x20 mm) |
| Recuento de pines | 208 | — |
| On-chip SMPS | Yes (integrated DC-DC step-down) | — |
| Communication Interfaces | Ethernet, USB 2.0 OTG, CAN-FD, I2C, SPI, UART | Ethernet, USB OTG HS/FS, 2x CAN FD, 6x SPI, 4x I2C, USART/UART, SDMMC, SAI |
| Graphics Accelerator | Chrom-ART (DMA2D) | — |
| Hardware Cryptography | AES, Hash, TRNG | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Nivel MSL | 3 | 3 (per JEDEC J-STD-020) |
| Data Cache / I-Cache | Yes (per core) | — |
| GPIO Count | — | 114 |
| Supply Voltage VDD | — | 1.62 V to 3.6 V |
| Temperatura de funcionamiento | — | -40 °C to +85 °C (industrial grade) |
| ADC | — | 3 x 16-bit, up to 3.6 MSPS |
| DAC | — | 2 x 12-bit |
| Graphics | — | Chrom-ART Accelerator, LCD-TFT controller, JPEG codec |
| Crypto Accelerators | — | AES, SHA, RSA, TRNG |
| Internal SMPS | — | Yes (step-down for core) |
| Process Node | — | 40 nm CMOS |