STM32H757XIH6 vs STM32H753XIH6TR Comparación
Comparación detallada lado a lado de STM32H757XIH6 por STMicroelectronics y STM32H753XIH6TR por STMicroelectronics. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
STMicroelectronics
STM32H757XIH6 - Dual-Core M7/M4 MCU, 2MB Flash, TFBGA-240 | STMicroelectronics
STM32H757XIH6 ✓ ActivoSTMicroelectronics
STM32H753XIH6TR - 480MHz Cortex-M7 MCU 2MB Flash | STMicroelectronics
STM32H753XIH6TR ✓ ActivoComparación de especificaciones
| Parámetro | STM32H757XIH6 | STM32H753XIH6TR |
|---|---|---|
| Marca | STMicroelectronics | STMicroelectronics |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $12,18 | $16,10 |
| Architecture | Arm Cortex-M7 + Cortex-M4 (dual-core, asymmetric multiprocessing) | — |
| Cortex-M7 Max Clock | 480 MHz | — |
| Cortex-M4 Max Clock | 240 MHz | — |
| Flash Memory | 2 MB (dual-bank, read-while-write) | — |
| SRAM | 1 MB (multiple banks incl. DTCM, AXI SRAM, SRAM1-4, Backup SRAM) | — |
| Supply Voltage (VDD) | 1.62 V to 3.6 V | — |
| Encapsulado | TFBGA-240 (14x14 mm, 0.8 mm pitch) plus 25 additional balls (240+25) | 240+25-ball TFBGA 14x14 mm |
| Temperatura de funcionamiento | -40 °C to +85 °C (grade 6) | — |
| Communication Interfaces | 46 com. and analog interfaces incl. Ethernet, USB, CAN-FD, USART/UART, SPI, I2C, SAI | USB OTG FS+HS, 2x CAN 2.0B, Ethernet MAC 10/100, UART/USART, SPI, I2C, SAI, SDMMC |
| Display Interface | MIPI-DSI host controller + TFT-LCD controller | — |
| Crypto Accelerator | AES, hash (SHA-1/SHA-2), TRNG | — |
| Graphics Accelerator | Chrom-ART (2D DMA2D) | — |
| Camera Interface | DCMI (parallel, 8- to 14-bit) | — |
| External Memory Controller | FMC for SDRAM, NOR, NAND, PSRAM | — |
| Internal SMPS | Yes (voltage scaling for core) | — |
| ADCs / DACs | Multiple 12-/16-bit ADCs; DAC channels [DATA_NEEDED: exact count] | — |
| Tipo de montaje | Surface Mount (TFBGA) | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant |
| Core Architecture | — | 32-bit ARM Cortex-M7 with double-precision FPU |
| Frecuencia de reloj máxima | — | 480 MHz |
| DMIPS Performance | — | 1027 DMIPS (2.14 DMIPS/MHz, Dhrystone 2.1) |
| L1 Cache | — | 16 KB instruction + 16 KB data |
| Program Flash | — | 2 MB dual-bank, read-while-write |
| Total SRAM | — | 1 MB (DTCM + AXI-SRAM + SRAM1-4) |
| Supply Voltage Range | — | 1.62 V to 3.6 V |
| Rango de temperatura de funcionamiento | — | -40 C to +85 C (industrial grade) |
| Analog Peripherals | — | ADC up to 3.6 MSPS, DAC, comparators, op-amps |
| Crypto Accelerators | — | AES-256, SHA-1/SHA-2/SHA-3, TRNG, Unique 96-bit ID |
| Timers | — | 16-/32-bit timers, PWM, HRTIM, RTC, SysTick, IWDG, WWDG |
| Storage Interfaces | — | SDMMC 2x (SD 4.1/eMMC), Octo-SPI, FMC/FSMC parallel |
| Display Support | — | TFT-LCD controller, Chrom-ART 2D accelerator, JPEG codec |
| Nivel MSL | — | 3 (per JEDEC J-STD-020) |
| Tape & Reel Option | — | Yes (suffix TR = 7-inch reel, 1000 pcs typical) |