STM32MP157DAC3 vs STM32MP157CAC3 Comparación
Comparación detallada lado a lado de STM32MP157DAC3 por STMicroelectronics y STM32MP157CAC3 por STMicroelectronics. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
STMicroelectronics
STM32MP157DAC3 - Dual Cortex-A7 650MHz MPU | STMicroelectronics
STM32MP157DAC3 ✓ Activo
Comparación de especificaciones
| Parámetro | STM32MP157DAC3 | STM32MP157CAC3 |
|---|---|---|
| Marca | STMicroelectronics | STMicroelectronics |
| Categoría | Microcontrollers | Microprocessors |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,92 | $24,20 |
| Core Processor | Arm dual Cortex-A7 + Cortex-M4 | Dual Arm Cortex-A7 + Arm Cortex-M4 |
| Cortex-A7 Core Frequency | 650 MHz | — |
| Cortex-M4 Core Frequency | 209 MHz | — |
| Core Architecture | 2 Core, 32-Bit | — |
| Series | STM32MP1 | STM32MP1 |
| Number of Terminals | 361 | — |
| Package Code | TFBGA | — |
| Package Shape | Square | — |
| Terminal Form | BALL | — |
| Temperature Grade | Industrial | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| CAN FD Interface | Yes | — |
| Display Interface | TFT/MIPI-DSI (per family datasheet) | TFT / MIPI DSI |
| Product Type | Microprocessor, RISC | — |
| Communication Interfaces (family max) | Up to 37 (STM32MP157C/F variants) | — |
| Timers (family max) | Up to 29 (STM32MP157C/F variants) | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Tensión de alimentación | [DATA_NEEDED: supply voltage range] | — |
| Cortex-A7 Max Frequency | — | 650 MHz |
| Cortex-M4 Max Frequency | — | 209 MHz |
| Architecture | — | 32-bit, 2+1 core heterogeneous |
| Ethernet | — | 2x GMAC, 1-Gbps RGMII (IEEE-802.3ab) |
| USB | — | 2x USB 2.0 OTG |
| UART | — | 8x |
| SPI | — | 5x |
| I2C | — | 5x |
| CAN | — | 2x CAN FD |
| GPU | — | 3D GPU (OpenGL ES 2.0) |
| DRAM Controller | — | 16-bit DDR3/DDR3L/LPDDR2/LPDDR3 |
| Security | — | Crypto accelerator (AES, DES, 3DES, SHA-1, SHA-256, MD5), secure boot |
| Temperatura de funcionamiento | — | -40C to +125C |
| Encapsulado | — | 361-TFBGA (12x12 mm) |
| Core Supply Voltage | — | [DATA_NEEDED: core supply voltage] |