TC222L16F133NACKXUMA1 vs XC2287M104F80LRABKXUMA1 Comparación
Comparación detallada lado a lado de TC222L16F133NACKXUMA1 por Infineon y XC2287M104F80LRABKXUMA1 por Infineon. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Infineon
TC222L16F133NACKXUMA1 - AURIX 32-Bit MCU 133MHz 1MB Flash | Infineon
TC222L16F133NACKXUMA1 ✓ ActivoInfineon
XC2287M104F80LRABKXUMA1 - 16/32-Bit 80MHz 832KB Flash MCU | Infineon
XC2287M104F80LRABKXUMA1 ✓ ActivoComparación de especificaciones
| Parámetro | TC222L16F133NACKXUMA1 | XC2287M104F80LRABKXUMA1 |
|---|---|---|
| Marca | Infineon | Infineon |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $4,95 | $11,10 |
| Core Architecture | TriCore AURIX TC2xx (32-bit) | C166SV2 (CISC + DSP + RISC extensions) |
| Frecuencia de reloj máxima | 133 MHz | 80 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) | 832 KB (832K x 8) |
| SRAM (incl. Cache) | 96 KB | — |
| CAN Nodes | 3 | — |
| ADC | 12-bit, up to 16 channels | — |
| Supply Voltage (Core) | 1.3 V (typ.) | — |
| I/O Voltage | 3.3 V / 5 V (per datasheet) | — |
| Number of I/O | 59 | — |
| Encapsulado | PG-TQFP-80-7 (HTFQFP, exposed pad) | PG-LQFP-144-4 (144-pin LQFP with exposed pad, 20x20 mm) |
| Terminal Form | GULL WING | — |
| Number of Terminals | 80 | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperature Grade | Automotive | — |
| Lead Pitch | 0.5 mm | — |
| Family | AURIX TC22xL Series 1 | — |
| Core Count | Single Core | — |
| Manufacturer | — | Infineon Technologies |
| Series | — | XC2000 / XC22xxM |
| Core Size | — | 16/32-Bit |
| RAM Size | — | 58 KB |
| Supply Voltage Range | — | 3.0 V to 5.5 V |
| Rango de temperatura de funcionamiento | — | -40 °C to +125 °C |
| ADC Resolution | — | 10-bit |
| Number of ADC Inputs | — | [DATA_NEEDED: number of ADC channels] |
| Communication Interfaces | — | MultiCAN (up to 5 nodes), USART, SSC, I2C |
| Estado RoHS | — | Compliant |
| Packing Method | — | Tape & Reel |