THS1209CDAG4 vs TSA1005-40IFT Comparación
Comparación detallada lado a lado de THS1209CDAG4 por Texas Instruments y TSA1005-40IFT por STMicroelectronics. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Texas Instruments
THS1209CDAG4 - 12-Bit 8 MSPS Dual-Channel ADC, 32-TSSOP | TI
THS1209CDAG4 ✓ ActivoSTMicroelectronics
TSA1005-40IFT - 10-Bit 40MSPS Dual ADC | STMicroelectronics
TSA1005-40IFT ✓ ActivoComparación de especificaciones
| Parámetro | THS1209CDAG4 | TSA1005-40IFT |
|---|---|---|
| Marca | Texas Instruments | STMicroelectronics |
| Categoría | ADC/DAC | ADC/DAC |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $6,05 | $10,25 |
| Resolución | 12 bit | 10 bit |
| Frecuencia de muestreo | 8 MSPS | — |
| Number of Channels | 2 (single-ended) / 1 (differential) | 2 (dual) |
| Architecture | Pipelined ADC with simultaneous sampling | Pipelined |
| Input Configuration | 2 single-ended or 1 differential | — |
| Data Interface | Parallel (DSP/microprocessor-compatible) | — |
| Channel Autoscan | Yes | — |
| Analog Supply Voltage | 5 V | 2.5 V single supply |
| Digital Supply Voltage | 3.3 V or 5 V | — |
| Internal Reference Voltages | 1.5 V and 3.5 V | — |
| External Reference Support | Yes | — |
| Encapsulado / Carcasa | 32-TSSOP (DA, 6.10 mm width) | — |
| Temperatura de funcionamiento | 0C to 70C (commercial grade) | 0 °C to 85 °C (commercial) |
| Packaging | Tube | — |
| Estado RoHS | Compliant | Compliant (per ST product page) |
| Recuento de pines | 32 | — |
| Sample Rate (max) | — | 40 MSPS |
| Sample Rate (typ) | — | 20 / 40 MSPS (selectable) |
| Analog Input Bandwidth | — | 1 GHz |
| Digital Output Supply | — | 2.5 V or 3.3 V (independent) |
| Track-and-Hold | — | Integrated per channel |
| Channel Clocking | — | Common clock (synchronous dual) |
| Output Mode | — | Multiplexed digital CMOS |
| Process Technology | — | 0.25 µm deep sub-micron CMOS |
| Encapsulado | — | 48-LQFP / TQFP (7x7 mm), 0.5 mm pitch |
| Tipo de montaje | — | Surface Mount |
| Terminal Form | — | Gull wing |