XC3S50-4CPG132C vs XC3S50-4CPG132I Comparación

Comparación detallada lado a lado de XC3S50-4CPG132C por AMD y XC3S50-4CPG132I por AMD. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

AMD
XC3S50-4CPG132C XC3S50-4CPG132C - 4-Speed Spartan-3 FPGA | AMD

XC3S50-4CPG132C - 4-Speed Spartan-3 FPGA | AMD

XC3S50-4CPG132C ✓ Activo

Comparación de especificaciones

Parámetro XC3S50-4CPG132C XC3S50-4CPG132I
Marca AMD AMD
Categoría FPGA & CPLD FPGA & CPLD
Estado del ciclo de vida Activo Unknown
Device Type Spartan-3 Field Programmable Gate Array (FPGA) —
Manufacturer AMD —
Original Product Line Xilinx Spartan-3 —
Speed Grade -4 —
Temperature Grade Commercial (C suffix) Industrial
User I/O Count 89 I/O —
Logic Resource Value 73728 (distributor-listed value; exact resource definition requires data-sheet confirmation) —
Secondary Logic Feature Value 1728 (distributor-listed value; exact feature definition requires data-sheet confirmation) —
Package Type 132-TFBGA —
Total Terminals 132 terminals —
Package Shape Square —
Terminal Form Ball —
Mounting Technology Surface Mount —
Programmability User-programmable digital logic and interconnect —
Configuration Interface [DATA_NEEDED: configuration interface type] —
Internal Block RAM [DATA_NEEDED: internal block RAM capacity] —
Rango de temperatura de funcionamiento [DATA_NEEDED: commercial-grade ambient temperature range] —
Core Supply Voltage [DATA_NEEDED: core supply voltage] —
I/O Supply Voltage [DATA_NEEDED: supported I/O supply voltage] —
Estado RoHS unknown unknown
REACH Status unknown unknown
AEC-Q100 Qualification not_applicable —
Product Type — Spartan-3 field-programmable gate array (FPGA)
Logic Elements / Cells — 1,728 cells
Logic Array Blocks / Configurable Logic Blocks — 192 LABs/CLBs
Total RAM — 73,728 bits
User I/O — 89 I/O
Tensión de alimentación de funcionamiento — 1.14 V to 1.26 V
Junction Temperature Range — -40°C to 100°C
Encapsulado — 132-TFBGA, CSPBGA
Package Pin or Ball Count — 132 balls
Tipo de montaje — Surface mount
Device Technology — 90 nm CMOS
Performance Grade — -4
Product Series — Spartan-3
Configuration Memory — [DATA_NEEDED: configuration memory type and capacity]
Frecuencia de reloj máxima — [DATA_NEEDED: verified maximum operating clock frequency]
Core Operating Voltage — 1.2 V nominal
I/O Standard — [DATA_NEEDED: supported I/O standards]
Lead-Free Status — unknown

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