XC56309VF100A vs DSP56321VF200 Comparación
Comparación detallada lado a lado de XC56309VF100A por NXP Semiconductors y DSP56321VF200 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
XC56309VF100A - 24-bit 100MHz DSP 196-MAPBGA | NXP Semiconductors
XC56309VF100A Nrnd
Comparación de especificaciones
| Parámetro | XC56309VF100A | DSP56321VF200 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | DSP | DSP |
| Estado del ciclo de vida | NRND | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $14,25 | $62,00 |
| Part Number | XC56309VF100A | DSP56321VF200 |
| Manufacturer | NXP Semiconductors (formerly Freescale/Motorola) | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | DSP563xx | — |
| Type | Fixed-Point Digital Signal Processor (DSP) | — |
| Data Word Width | 24-bit | — |
| Clock Rate | 100 MHz | — |
| Throughput | 100 MIPS | — |
| On-Chip RAM | 24 kB | 576 KB |
| Non-Volatile Memory | ROM (576 B) | — |
| Interfaces | Host Interface, SSI, SCI | Host Interface, SSI (Synchronous Serial), SCI (Serial Communications) |
| Encapsulado / Carcasa | 196-LBGA (MAPBGA 15x15 mm) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Temperatura de funcionamiento | -40C to +105C (TJ) | — |
| Packaging | Tray | Tray |
| Estado RoHS | Compliant (per JLCPCB listing) | — |
| Product Type | — | Fixed-Point Digital Signal Processor (DSP) |
| DSP Family | — | DSP56300 family, DSP56000 code-compatible |
| Core Architecture | — | 24-bit fixed-point, single-cycle engine |
| Clock Speed | — | 200 MHz |
| Bootstrap ROM | — | 576 bytes |
| Instruction Cache | — | Yes |
| Coprocessor | — | Enhanced Filter Coprocessor (EFCOP) |
| DMA Channels | — | 6 channels |
| Addressing | — | 24-bit address space, barrel shifter |
| I/O Voltage | — | 3.30 V |
| Encapsulado | — | 196-MAPBGA (15 mm x 15 mm, 1 mm pitch, 1.18 mm body height) |
| Temperatura de unión de funcionamiento | — | -40C to +100C (TJ) |