XC6SLX45-2FGG676C vs XC6SLX45-2FGG676I Comparación
Comparación detallada lado a lado de XC6SLX45-2FGG676C por AMD y XC6SLX45-2FGG676I por AMD. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | XC6SLX45-2FGG676C | XC6SLX45-2FGG676I |
|---|---|---|
| Marca | AMD | AMD |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $24,50 | $55,80 |
| Device Family | Spartan-6 LX | — |
| Logic Cells | 43,661 | 43,661 |
| Block RAM (bits) | 2,138,112 | — |
| User I/O Count | 358 | — |
| Number of CLBs | 3,411 | — |
| Encapsulado | 676-ball FFG / FBGA, 27 x 27 mm, 1.0 mm pitch | 676-ball FBGA (FGG676), 27 x 27 mm, 1.0 mm pitch |
| Speed Grade | -2 (standard performance) | -2 |
| Process Technology | 45 nm CMOS, low-power copper | 45 nm CMOS |
| Core Voltage (Vccint) | 1.2 V nominal (1.14 V to 1.26 V range) | — |
| Auxiliary Voltage (Vccaux) | 2.5 V nominal | — |
| I/O Bank Voltage (Vcco) | 1.2 V to 3.3 V per bank | — |
| Temperatura de funcionamiento | 0 C to +85 C (commercial, "C" suffix) | — |
| Tipo de montaje | Surface Mount (BGA) | — |
| Nivel MSL | 3 (168 hours) | — |
| Lead Free / REACH | Lead free per MO-275 | — |
| Family | — | Spartan-6 LX |
| Part Number | — | XC6SLX45-2FGG676I |
| Configurable Logic Blocks (CLBs) | — | 3,411 |
| Total Flip-Flops | — | 54,576 |
| Block RAM | — | 2,088 Kbit |
| DSP48A1 Slices | — | 58 |
| User I/Os | — | 358 |
| Number of I/O Banks | — | 4 |
| Core Voltage | — | 1.2 V |
| Internal Frequency | — | 500 MHz |
| Operating Temperature (Industrial) | — | -40 °C to +100 °C |
| Compliance | — | RoHS compliant, Lead Free |