XC6SLX45-3FG484C vs XC6SLX45-3FG484I Comparación
Comparación detallada lado a lado de XC6SLX45-3FG484C por AMD y XC6SLX45-3FG484I por AMD. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | XC6SLX45-3FG484C | XC6SLX45-3FG484I |
|---|---|---|
| Marca | AMD | AMD |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Device Type | Spartan-6 LX Field Programmable Gate Array (FPGA) | Field Programmable Gate Array (FPGA) |
| Logic Cells | 43,661 cells | — |
| Adaptive Logic Modules | 6,822 ALM | — |
| Embedded Memory | 2.04 Mbit | — |
| User I/O | 316 I/O | — |
| Internal Frequency | 500 MHz | 500 MHz |
| Process Technology | 45 nm CMOS | — |
| Core Supply Voltage | 1.2 V | — |
| Speed Grade | -3 | -3 |
| Temperature Grade | Commercial | Industrial |
| Temperatura de funcionamiento | 0 °C to 85 °C | 0 C to 85 C |
| Encapsulado | 484-BBGA | — |
| Package Dimensions | 15 mm × 15 mm | 15 x 15 mm |
| Package Ball Pitch | 0.80 mm | — |
| Catalog Package Detail | MO-275, CSBGA-324 | — |
| Catalog Pin Count | 324 pins | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Lead-Free Packaging | Lead free | — |
| REACH Status | REACH unaffected | [DATA_NEEDED: REACH status] |
| FPGA Family | — | Spartan-6 LX |
| Number of I/O | — | 316 I/O |
| Package Type | — | 484-BBGA |
| Ball Pitch | — | 0.80 mm |
| Package Ball Count | — | 324 balls |
| Package Outline | — | MO-275 |
| Lead-Free Status | — | Lead Free |
| Logic Resource Count | — | [DATA_NEEDED: logic cell count] |
| Block RAM Capacity | — | [DATA_NEEDED: block RAM capacity] |
| DSP Slice Count | — | [DATA_NEEDED: DSP slice count] |
| Supply Voltage Range | — | [DATA_NEEDED: supply voltage range] |
| Estado RoHS | — | [DATA_NEEDED: RoHS status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification status] |