XC6SLX75-3FG484I vs XC6SLX75-2FG484C Comparación
Comparación detallada lado a lado de XC6SLX75-3FG484I por AMD y XC6SLX75-2FG484C por AMD. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | XC6SLX75-3FG484I | XC6SLX75-2FG484C |
|---|---|---|
| Marca | AMD | AMD |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Unknown | Unknown |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $0,00 |
| Device Type | FPGA | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX | Spartan-6 LX |
| Logic Cells | 74,637 cells | 74,637 cells |
| Configurable Logic Blocks | 5,831 CLBs | 5,831 CLBs |
| Process Technology | 45 nm CMOS | CMOS |
| Tensión de alimentación | 1.2 V | [DATA_NEEDED: supply voltage] |
| User I/O | 280 I/O | [DATA_NEEDED: user I/O count] |
| Internal Frequency | 667 MHz | 667 MHz |
| Catalog Maximum Frequency | 862 MHz | — |
| Speed Grade | -3 highest-performance family grade | -2 |
| Temperature Grade | Industrial | Commercial |
| Temperatura de funcionamiento | 0°C to 85°C (32°F to 185°F) | 0 to 85 C |
| Encapsulado | FBGA-484 | — |
| Package Dimensions | 23 mm × 23 mm | 23 x 23 mm |
| Package Pitch | 1 mm | 1 mm |
| Terminal Count | 484 balls | — |
| Tipo de montaje | Surface mount | Surface mount ball grid array |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Package Type | — | 484-BBGA, MS-034 FBGA |
| Number of Balls | — | 484 balls |
| Configuration | — | [DATA_NEEDED: configuration architecture] |
| Block RAM | — | [DATA_NEEDED: block RAM] |
| DSP Resources | — | [DATA_NEEDED: DSP resources] |