XC6SLX9-2TQG144C vs XC6SLX9-2FTG256C Comparación
Comparación detallada lado a lado de XC6SLX9-2TQG144C por AMD y XC6SLX9-2FTG256C por AMD. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | XC6SLX9-2TQG144C | XC6SLX9-2FTG256C |
|---|---|---|
| Marca | AMD | AMD |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $11,80 | $27,85 |
| Family | Spartan-6 LX | — |
| Logic Cells | 9152 | — |
| System Gates | 589824 | — |
| Configurable Logic Blocks (CLBs) | 715 | 715 CLB |
| User I/O Count | 102 | — |
| Operating Frequency (max) | 375 MHz | — |
| Clock Management | DCM + PLL | — |
| Block RAM | 64 Kbit per block (16 blocks) | — |
| DSP Slices | DSP48A1 | — |
| Core Voltage (VCCINT) | 1.14 V to 1.26 V | — |
| Process Technology | 45 nm CMOS, 9-metal layer copper | 45 nm low-power CMOS |
| Temperatura de funcionamiento | 0C to +85C (commercial, C grade) | 0 C to 85 C (commercial) |
| Encapsulado | TQFP-144 (TQG144), 20 x 20 mm, 0.5 mm pitch | 256-ball FTBGA (FTG256), 17 x 17 mm, 1.0 mm pitch |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Lead-Free Status | Lead Free | — |
| Estado RoHS | Compliant | Compliant (lead-free FTBGA) |
| Series | — | Spartan-6 LX |
| Device Logic Cells | — | 9,152 LE |
| Adaptive Logic Modules (ALMs) | — | 1,430 ALM |
| Embedded Block RAM | — | 576 Kbits |
| Distributed RAM | — | 32 Kbits |
| DSP / Multiplier Blocks | — | 16 (18 x 18 multipliers) |
| Maximum User I/Os | — | 186 |
| Speed Grade | — | -2 (commercial) |
| Internal Performance | — | Up to 667 MHz |
| Tensión de alimentación | — | 1.2 V core / 1.2 V-3.3 V I/O (per DS160) |
| Configuration Modes | — | SPI, JTAG, BPI, Master Serial |