XC7S50-1CSGA324I vs XC7S50-2CSGA324I Comparación
Comparación detallada lado a lado de XC7S50-1CSGA324I por AMD y XC7S50-2CSGA324I por AMD. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | XC7S50-1CSGA324I | XC7S50-2CSGA324I |
|---|---|---|
| Marca | AMD | AMD |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $98,20 | $43,10 |
| Family | Spartan-7 | — |
| Logic Cells | 52,160 | 52,160 |
| System Gates | 2,764,800 | — |
| DSP Slices | 75 | 120 |
| Block RAM | 2,700 Kb (36 Kb blocks) | — |
| Distributed RAM | 270 Kb | — |
| User I/Os | 210 | — |
| Clock Management Tiles | 4 CMTs (PLL + MMCM) | — |
| Core Voltage (VCCINT) | 0.95 V to 1.05 V (typ. 1.0 V) | — |
| Auxiliary Voltage (VCCAUX) | 1.8 V (typical) | — |
| I/O Voltage (VCCO) | 1.2 V to 3.3 V per bank | — |
| Maximum Internal Clock Frequency | 464 MHz | — |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | -40C to +100C (Industrial, I) |
| Speed Grade | -1 | -2 |
| Encapsulado | 324-ball CSBGA / LFBGA (CSGA324), 15x15 mm | 324-LFBGA / CSGA324 (15 x 15 mm, 0.8 mm pitch) |
| Process Technology | 28 nm CMOS, low-power (HPL) | — |
| Configuration Memory | SPI, BPI, JTAG, Master Serial | SRAM-based, AES-256 bitstream encryption |
| Estado RoHS | Compliant | Compliant |
| Nivel MSL | 3 (per JEDEC J-STD-020) | 3 |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Series | — | Spartan-7 |
| Manufacturer | — | AMD (formerly Xilinx) |
| Block RAM (36 Kb blocks) | — | 75 |
| User I/O Count | — | 210 |
| Process Node | — | 28 nm |
| Clock Management Tiles (CMTs) | — | 6 |
| Configuration Interfaces | — | SPI, BPI, JTAG, SelectMAP |
| Part Status | — | Active |