XC7Z100-2FF900I vs XC7Z045-2FFG900I Comparación

Comparación detallada lado a lado de XC7Z100-2FF900I por AMD y XC7Z045-2FFG900I por Desconocido. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

AMD
XC7Z100-2FF900I XC7Z100-2FF900I - Zynq-7000 444K SoC | AMD Xilinx

XC7Z100-2FF900I - Zynq-7000 444K SoC | AMD Xilinx

XC7Z100-2FF900I ✓ Activo
XC7Z045-2FFG900I XC7Z045-2FFG900I

XC7Z045-2FFG900I

XC7Z045-2FFG900I

Comparación de especificaciones

Parámetro XC7Z100-2FF900I XC7Z045-2FFG900I
Marca AMD —
Categoría FPGA & CPLD —
Estado del ciclo de vida Activo
Device Type Zynq-7000 Kintex-7 programmable system-on-chip —
Processor Subsystem Dual ARM Cortex-A9 MPCore —
Processor Clock Rating 800 MHz —
FPGA Logic Cells 444K logic cells —
FPGA Family Kintex-7 —
Encapsulado 900-FCBGA, 31 mm x 31 mm —
Package Pin Count 900 pins —
Device Speed Grade -2 —
Temperature Grade Industrial —
Tipo de montaje Surface mount —
Integrated Programmable Logic 444K Kintex-7 logic cells —
Debug Support ARM CoreSight debug resources —
Design Toolchain AMD FPGA and SoC development toolchain; exact version [DATA_NEEDED: design toolchain version] —
Rango de temperatura de funcionamiento [DATA_NEEDED: minimum and maximum operating temperature] —
Number of High-Speed Transceivers [DATA_NEEDED: transceiver count] —
Maximum Transceiver Data Rate [DATA_NEEDED: maximum transceiver data rate] —
Programmable I/O Count [DATA_NEEDED: programmable I/O count] —
Memory Interface Details [DATA_NEEDED: memory interface types and supported rates] —
Power Supply Inputs [DATA_NEEDED: supply rail names and voltage ranges] —
Typical Power Consumption [DATA_NEEDED: typical and maximum power consumption] —
Estado RoHS [DATA_NEEDED: RoHS compliance declaration] —
REACH Status [DATA_NEEDED: REACH compliance declaration] —
Lead-Free Status [DATA_NEEDED: lead-free packaging declaration] —
AEC-Q100 Qualification Not applicable; this is an FPGA and SoC rather than an automotive-grade discrete component —
Package Thermal Resistance [DATA_NEEDED: package thermal resistance] —

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