XC7Z100-2FF900I vs XC7Z100-2FFG900I Comparación
Comparación detallada lado a lado de XC7Z100-2FF900I por AMD y XC7Z100-2FFG900I por AMD. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
AMD
XC7Z100-2FFG900I - Zynq-7000 SoC, Kintex-7 FPGA, 444K Logic Cells | AMD
XC7Z100-2FFG900I ✓ ActivoComparación de especificaciones
| Parámetro | XC7Z100-2FF900I | XC7Z100-2FFG900I |
|---|---|---|
| Marca | AMD | AMD |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Device Type | Zynq-7000 Kintex-7 programmable system-on-chip | — |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore | — |
| Processor Clock Rating | 800 MHz | — |
| FPGA Logic Cells | 444K logic cells | — |
| FPGA Family | Kintex-7 | — |
| Encapsulado | 900-FCBGA, 31 mm x 31 mm | 900-ball FCBGA (FFG) 31x31 mm |
| Package Pin Count | 900 pins | — |
| Device Speed Grade | -2 | — |
| Temperature Grade | Industrial | I (Industrial) |
| Tipo de montaje | Surface mount | — |
| Integrated Programmable Logic | 444K Kintex-7 logic cells | — |
| Debug Support | ARM CoreSight debug resources | — |
| Design Toolchain | AMD FPGA and SoC development toolchain; exact version [DATA_NEEDED: design toolchain version] | — |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: minimum and maximum operating temperature] | — |
| Number of High-Speed Transceivers | [DATA_NEEDED: transceiver count] | — |
| Maximum Transceiver Data Rate | [DATA_NEEDED: maximum transceiver data rate] | — |
| Programmable I/O Count | [DATA_NEEDED: programmable I/O count] | — |
| Memory Interface Details | [DATA_NEEDED: memory interface types and supported rates] | — |
| Power Supply Inputs | [DATA_NEEDED: supply rail names and voltage ranges] | — |
| Typical Power Consumption | [DATA_NEEDED: typical and maximum power consumption] | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance declaration] | — |
| REACH Status | [DATA_NEEDED: REACH compliance declaration] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free packaging declaration] | — |
| AEC-Q100 Qualification | Not applicable; this is an FPGA and SoC rather than an automotive-grade discrete component | — |
| Package Thermal Resistance | [DATA_NEEDED: package thermal resistance] | — |
| Device Family | — | Zynq-7000 All Programmable SoC |
| Architecture | — | ARM Cortex-A9 dual-core MPCore + Kintex-7 FPGA |
| Logic Cells (PL) | — | 444K |
| Block RAM | — | 26.5 Mb |
| DSP Slices | — | 1540 (DSP48E1) |
| Processor Cores | — | 2x ARM Cortex-A9 MPCore with CoreSight |
| Max Processor Frequency | — | 800 MHz (up to 1 GHz with -3 speed grade) |
| Transceivers | — | 16x GTX up to 6.25 Gb/s |
| PCIe Hard Blocks | — | 4x Gen2 (Root Complex or Endpoint) |
| Memory Interfaces | — | DDR3, DDR3L, DDR2, LPDDR2 (16-bit and 32-bit; ECC on PS side) |
| Ethernet MACs | — | 2x 10/100/1000 Mbps GEM |
| USB | — | 2x USB 2.0 OTG |
| Security | — | AES, SHA-256, RSA, secure boot, JTAG disable |
| ADC | — | Dual 12-bit 1 MSPS XADC |
| Temperatura de funcionamiento | — | -40C to +100C (Industrial) |
| Speed Grade | — | -2 (mid-performance) |