10AS066H4F34E3LG - Arria 10 SX SoC FPGA 660K LE | Altera | Dual ARM Cortex-A9
N.º de pieza: 10AS066H4F34E3LG ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $2950.6 | $2.950,60 |
| 10 | $2803.07 | $28.030,70 |
| 100 | $2655.54 | $265.554,00 |
| 500 | $2537.52 | $1.268.760,00 |
| 1.000 | $2419.49 | $2.419.490,00 |
10AS066H4F34E3LG Descripción general
A System-on-Chip (SoC) FPGA is an integrated circuit that merges a microprocessor subsystem (typically ARM Cortex-A class) with programmable logic on a single die. The Arria 10 SX SoC sits in the broader taxonomy of programmable logic devices: it is an FPGA, then a SoC FPGA, then specifically a heterogeneous SoC with a hard ARM Cortex-A9 cluster, enabling deterministic real-time control alongside software programmability. Compared with a standalone FPGA plus external processor, an SoC FPGA reduces board area, latency, and BOM while preserving FPGA parallelism for hardware acceleration.
Key features of this 10AS066H4F34E3LG device include 660K logic elements, embedded ARM Cortex-A9 MPCore with CoreSight debug, hard memory controllers for DDR3/DDR4/LPDDR2, multi-gigabit transceivers, variable-precision DSP blocks, and a 256 KB bottom-boot on-chip ROM. The 0.9 V core, 20 nm process technology enables high performance at moderate power. Configuration is via a bottom-boot scheme indicated by the 'BOTTOM' marking, supporting in-system updates and remote bitstream loading. The industrial temperature range and high-I/O count suit embedded compute platforms with extended environmental requirements.
Typical applications include high-performance wireless baseband processing, military radar and secure communications, broadcast video processing, high-end test and measurement, and protocol bridging ASIC prototyping. The dual ARM Cortex-A9 cores handle control-plane and OS workloads while FPGA fabric accelerates DSP and packet processing, enabling a true hardware/software co-design architecture within one chip.
When designing with this device, plan PCB layout for the 1152-ball FCBGA early - escape routing requires HDI microvia stack-up and signal-integrity-aware stack-up design. Thermal management should assume up to 30-40 W TDP depending on utilization, requiring a heatsink or thermal interface material over the top of the BGA. Use the Quartus Prime Arria 10 SoC device family support for compilation, pin planning, and HPS firmware development.
This page synthesizes XAIPART pricing, drop-in alternatives drawn from the same Arria 10 SX family, and practical design notes not found in the manufacturer datasheet, supporting faster engineering decisions.
Alternativas directas para 10AS066H4F34E3LG — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10AS066H4F34E3LG (mismo factor de forma y huella) — difiere en Mounting Type, Package, Process Technology, Family, Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10AS066H4F34E3SG
✅ Sustitución directa✓ En stock
$1920 / unidad
Ver hoja de datos →10AS066H4F34I3LG
✅ Sustitución directa✓ En stock
$3400 / unidad
Ver hoja de datos →10AS066H3F34E3LG
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
10AS066H2F34E3LG
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10AS066H1F34E3LG
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10AS066H4F34E3LG Valores máximos y características eléctricas
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 660,000 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Hard Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| On-Chip ROM | 256 KB (bottom boot) |
| Encapsulado | 1152-FBGA, FC (35x35 mm) |
| Pin / Ball Count | 1152 |
| I/O Count | 492 user I/O |
| Configuration Mode | Bottom boot |
| Tipo de montaje | Surface Mount (FCBGA) |
| Temperature Grade | Industrial / Extended (per OPN suffix) |
| Estado RoHS | Compliant |
| Lead-Free | Yes |
| Memory Interfaces | DDR3 / DDR4 / LPDDR2 hard controllers |
Guía de configuración de pines de 10AS066H4F34E3LG 1152-fbga, fc (35x35 mm)
Configuración de pines para 10AS066H4F34E3LG (encapsulado 1152-fbga, fc (35x35 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 10AS066H4F34E3LG.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
10AS066H4F34E3LG es adecuado para 6 aplicacións: Wireless Baseband Processing, Military Radar and Secure Comms, Broadcast Video Processing, Test and Measurement Instrumentation, ASIC Prototyping and Emulation, Industrial Vision and Machine Learning Inference.
Wireless Baseband Processing
The 10AS066H4F34E3LG's 660K logic elements, dual ARM Cortex-A9 HPS at 1.5 GHz, and multi-gigabit transceivers make it ideal for wireless baseband signal processing, where FPGA fabric accelerates FFT, channel estimation, and FEC while the ARM cores handle MAC and stack layers. The 20 nm Arria 10 process supports high DSP throughput at moderate power, and the 1152-FBGA F34 package provides sufficient I/O for multiple antenna interfaces and CPRI/JESD links. Compared with discrete FPGA+CPU designs, this SoC FPGA reduces board area by 30-50% and tightens latency between baseband and protocol stack.
Recomendado
Military Radar and Secure Comms
Arria 10 SX SoC FPGAs are widely used in military radar front-end processing and secure communications, where the hard ARM Cortex-A9 subsystem runs encrypted control planes and the FPGA fabric processes high-rate ADC samples and FFT pipelines. The 10AS066H4F34E3LG's 1.5 GHz HPS supports secure boot with cryptography accelerators, while the 660K LE fabric handles real-time beamforming and pulse compression. The 1152-FBGA FCBGA package is suitable for conduction-cooled ruggedized modules and aligns with industrial/extended temperature grades required for defense programs.
Recomendado
Broadcast Video Processing
Broadcast video infrastructure (4K/8K UHD up/down/cross-converters, video over IP gateways, and production switchers) benefits from the 10AS066H4F34E3LG's combination of high logic density, hard memory controllers for DDR4 frame buffers, and H.265/AVC pipeline support in FPGA fabric. The dual ARM Cortex-A9 HPS handles control, networking, and IP stack, while the FPGA fabric executes video processing at line rate. With 1152 balls and 492 user I/O, the F34 package supports multiple 12G-SDI links and 25/40/100 GbE network interfaces typical of broadcast studios.
Recomendado
Test and Measurement Instrumentation
High-end oscilloscopes, protocol analyzers, and arbitrary waveform generators leverage the 10AS066H4F34E3LG's real-time DSP capability for waveform processing, FFT analysis, and trigger logic, while the ARM Cortex-A9 HPS runs the instrument UI, Linux stack, and remote management. The 20 nm process gives a favorable performance-per-watt for fan-cooled benchtop instruments, and the 1152-FBGA package provides sufficient high-speed serial I/O for multi-channel ADC/DAC interfacing. Quartus Prime DSP Builder accelerates vectorized filter and FFT IP development for this device.
Recomendado
ASIC Prototyping and Emulation
The 10AS066H4F34E3LG provides 660K logic elements sufficient for prototyping sub-blocks of large ASIC designs, with the dual ARM Cortex-A9 HPS enabling hardware/software co-verification against real OS workloads. Multiple Arria 10 SX devices can be combined on a single prototyping board to scale up to multi-million-ASIC gate counts, sharing JTAG or HPS-controlled bitstream loading. The 1152-FBGA F34 footprint is consistent across the Arria 10 SX family, allowing prototype boards to mix 660K, 480K, and 320K parts without redesigning the BGA land pattern.
Recomendado
Industrial Vision and Machine Learning Inference
Machine vision systems and edge ML inference leverage the 10AS066H4F34E3LG's FPGA fabric for convolutional neural network acceleration (CNN, YOLO, ResNet inference) while the ARM Cortex-A9 HPS runs the application stack, image pre-processing, and Ethernet/IP connectivity. The Arria 10 SX's variable-precision DSP blocks support INT8 and FP16 inference at high throughput, and the hard memory controller sustains DDR4 bandwidth for large activation buffers. The 1152-FBGA package supports multiple MIPI CSI-2 or GigE Vision camera inputs typical of factory automation cells.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10AS066H4F34E3LG — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 10AS066H4F34E3SG | 10AS066H4F34I3LG | 10AS066H3F34E3LG | 10AS066H2F34E3LG | 10AS066H1F34E3LG |
|---|---|---|---|---|---|---|
| Package | 1152-FBGA, FC (35x35 mm) | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 |
| Speed Grade | 4 (highest) | 4 | 4 | 3 | 2 | 1 |
| OPN Suffix (Grade/Handle) | E3LG (Extended, lead-free) | E3SG | I3LG (Industrial, lead-free) | E3LG | E3LG | E3LG |
| Hard Processor Subsystem | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Process / Core Voltage | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V | 20 nm / 0.9 V |
Diferenciadores clave
- Speed grade 4 offers highest Fmax in the Arria 10 SX family (frente a 10AS066H3F34E3LG)
- Extended temperature suffix E3 supports wider thermal envelope than I3 (frente a 10AS066H4F34I3LG)
- Drop-in compatibility across Arria 10 SX family in same F34 footprint (frente a 10AS032H4F34E3LG)
Notas de diseño
The 1152-ball FCBGA F34 package requires an HDI PCB stack-up with microvia escape routing - typically a 1-2-2-2 or 1-2-3-3 layer build with laser-drilled microvias. Ball pitch is 1.0 mm, so use of a 4+ mil trace/space with 8 mil pad is mandatory for signal layer fan-out. Maintain a continuous ground reference plane under the BGA for return-path integrity, and provide stitched ground vias adjacent to high-speed serial and DDR signals. Thermal vias under the package center improve heat dissipation to internal copper planes; typical recommendation is a 3x3 thermal via array at 1.0 mm pitch under the die shadow.
Estimated: at high utilization with all DSP and HPS active, junction power can reach 25-35 W. With theta-JA in the range of 5-8 C/W (typical for 35x35 mm FCBGA with thermal vias and forced airflow), the case-to-ambient rise can be 100-150 C. A heatsink with thermal interface material is required for sustained operation; for conduction-cooled enclosures, mount the heatsink directly to the top of the FCBGA exposed die. Always run the Quartus Prime power estimator (Early Power Estimator or PowerPlay) for your design's exact utilization before sizing the thermal solution.
Common pitfalls with Arria 10 SX SoC FPGAs include: (1) confusing the E3/I3/H3 suffix in OPN - confirm whether 'I' means industrial temperature or 'E' means extended; (2) mismatching the configuration mode (this device uses bottom boot) with the bitstream location in flash; (3) not provisioning separate power rails for HPS and FPGA core - both have independent voltage requirements and must be sequenced per the Arria 10 power management user guide; (4) underestimating HPS DDR controller fly-by routing constraints - follow the Arria 10 External Memory Interface Handbook for write leveling and read deskew calibration.
Place decoupling capacitors in a tight grid around the FCBGA perimeter, with the smallest values (0402, 0.1 uF) closest to the balls and bulk capacitors (22-47 uF) on the second tier. Keep all HPS DDR traces length-matched within the byte lanes and routed on inner stripline layers with ground reference on both sides. High-speed serial transceiver channels should use a 100-ohm differential impedance and be isolated from noisy digital signals by ground-via stitching. Place the JTAG header and configuration flash close to the device to minimize parasitics on programming lines.
Información de cumplimiento
RoHS and lead-free confirmed by OPN suffix 'LG' per Altera/Intel ordering code guide. Not AEC-Q100 qualified (SoC FPGA family is industrial/extended grade, not automotive).