10CL010ZM164I8G - Cyclone 10 LP FPGA 10K LE 164-MBGA | Intel
N.º de pieza: 10CL010ZM164I8G ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $29.8 | $2.980,00 |
| 500 | $26.4 | $13.200,00 |
| 1.000 | $23.1 | $23.100,00 |
10CL010ZM164I8G Descripción general
A Cyclone 10 LP FPGA is a member of the SRAM-based programmable logic family, sitting in the broader taxonomy of programmable logic devices (CPLD -> low-density FPGA -> mid-range FPGA -> high-end SoC FPGA). It is the lowest-power member of the Cyclone 10 generation, designed specifically for parallel processing, glue-logic replacement, and I/O expansion in cost-sensitive industrial, automotive driver-assist, video processing, and consumer equipment. Compared with a CPLD, a Cyclone 10 LP FPGA offers far greater logic density, embedded multipliers, and on-chip RAM blocks at the cost of needing a configuration image.
Key features of the 10CL010ZM164I8G include up to 10,320 logic elements, 46 embedded 18x18 multipliers (for DSP), 423 Kbits of embedded SRAM, configuration via passive serial (PS), fast passive parallel (FPP), or JTAG, integrated phase-locked loops (PLLs), and support for external memory interfaces such as DDR2/DDR3/LPDDR2 via soft IP. The device operates from a 1.0 V core with separate bank I/O voltages selectable per bank, and includes LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards.
Architecturally, the 10CL010ZM164I8G is built around LAB (Logic Array Block) tiles, M9K embedded memory blocks, and 18x18 multiplier blocks, all stitched together by a multi-tier routing fabric. Configuration bitstream is stored in on-chip SRAM and loaded at power-up from external flash or a microcontroller, after which the device behaves as a fixed-function ASIC equivalent until reconfigured.
Typical applications include industrial machine vision cameras, motor control and drive interfaces, LED video walls and display controllers, software-defined radio front-ends, low-cost protocol bridges (I2C/SPI/UART/CAN to Ethernet), and I/O expansion for microcontrollers in IoT edge nodes. The 164-ball MBGA package provides 101 usable user I/Os with multiple banks for mixed-voltage interfacing.
When designing with this device, plan for an external configuration flash (typically EPCQ or compatible serial NOR), a clean 1.0 V core supply, and proper decoupling per Intel's pin connection guidelines. Note that I8G denotes the industrial temperature grade and tray packaging; design tooling should target the Quartus Prime Lite or Standard Edition for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing, drop-in Cyclone 10 LP variants, and practical design notes not found in the manufacturer datasheet alone.
Alternativas directas para 10CL010ZM164I8G — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10CL010ZM164I8G (mismo factor de forma y huella) — difiere en Package, Embedded Memory, Core Voltage, Process Technology, PLLs.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10CL010YM164I7G
✅ Sustitución directa✓ En stock
$9.45 / unidad
Ver hoja de datos →10CL010YM164C8G
✅ Sustitución directa✓ En stock
$12.1 / unidad
Ver hoja de datos →10CL010YM164C6G
✅ Sustitución directa✓ En stock
$11.4 / unidad
Ver hoja de datos →10CL010YM164A7G
✅ Sustitución directa✓ En stock
$21.1 / unidad
Ver hoja de datos →10CL006ZM164I8G
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
10CL010ZE144I8G
✅ Sustitución directa✓ En stock
$19.6 / unidad
Ver hoja de datos →10CL010ZM164I8G Valores máximos y características eléctricas
| Family | Cyclone 10 LP |
| Logic Elements | 10,320 |
| Embedded Memory | 423,936 bits (414 Kbits) |
| Embedded 18x18 Multipliers | 46 |
| Maximum User I/O | 101 |
| Encapsulado | 164-ball MBGA (FineLine BGA, M164) |
| Temperatura de funcionamiento | -40C to +100C (Industrial) |
| Process Technology | 60 nm low-power CMOS |
| Core Voltage | 1.0 V (typical), 1.2 V I/O banks |
| Configuration Modes | PS, FPP, JTAG |
| I/O Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| External Memory Support | DDR2, DDR3, LPDDR2 (via soft IP) |
| Estado RoHS | Compliant |
| Packaging | Tray (I8G suffix) |
Guía de configuración de pines de 10CL010ZM164I8G 164-ball mbga (fineline bga, m164)
Configuración de pines para 10CL010ZM164I8G (encapsulado 164-ball mbga (fineline bga, m164)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 10CL010ZM164I8G.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
10CL010ZM164I8G es adecuado para 6 aplicacións: Industrial Machine Vision, Motor Control and Drive Interfaces, LED Video Wall Display Controllers, Software-Defined Radio Front-Ends, Industrial Protocol Bridging, IoT Edge Sensor Aggregation.
Industrial Machine Vision
The 10CL010ZM164I8G suits industrial machine vision pipelines where parallel pixel processing and deterministic latency matter more than raw throughput. Its 46 embedded 18x18 multipliers enable real-time Sobel, Laplacian, and convolution kernels on VGA to 720p streams at 30-60 fps, while the 423 Kbits of embedded M9K SRAM act as line buffers without external memory. The industrial -40C to +100C temperature rating and 164-MBGA's 101 user I/Os accommodate Camera Link, MIPI CSI-2, or LVDS sensor interfaces alongside Ethernet and USB bridges. Quartus Prime reference designs for image preprocessing demonstrate sub-100 us end-to-end latency, ideal for inline defect-detection conveyor systems.
Recomendado
Motor Control and Drive Interfaces
Cyclone 10 LP FPGAs including the 10CL010ZM164I8G are widely deployed as field-oriented control (FOC) coprocessors for PMSM, BLDC, and stepper motor drives. The 46 hardware multipliers accelerate Clarke/Park transforms and PID loops with deterministic cycle counts well within 10 kHz PWM periods, while the LVDS-capable I/Os interface directly to high-resolution encoders (EnDat, BiSS, SSI) without external translators. The industrial temperature grade suits factory-floor cabinet environments, and the 164-MBGA's multiple I/O banks allow mixed 3.3 V logic and 5 V tolerant signals to coexist on the same device.
Recomendado
LED Video Wall Display Controllers
The 10CL010ZM164I8G's 101 user I/Os in a compact 164-MBGA package make it well suited as a sub-controller in LED video wall cabinets, where many parallel high-speed LVDS or CMOS pairs drive scan-board shift registers. The 423 Kbits of embedded SRAM buffer pixel data between input links and output panels, while 46 multipliers handle gamma correction and color-space conversion on the fly. Compared with discrete shift-register designs, a Cyclone 10 LP centralizes refresh timing, hot-swap detection, and brightness calibration in a single reconfigurable device, reducing BOM and easing firmware updates.
Recomendado
Software-Defined Radio Front-Ends
In low-cost software-defined radio (SDR) platforms the 10CL010ZM164I8G functions as the digital preprocessing stage between an ADC and a host processor. The 46 embedded 18x18 multipliers implement digital down-conversion (DDC), filtering, and FFT butterflies for narrowband signals up to several MHz of bandwidth, while the 164-MBGA provides ample LVDS pairs for high-speed ADC data capture. Quartus Prime DSP Builder accelerates IP integration, and the Cyclone 10 LP's low static power keeps thermal dissipation manageable in compact enclosure designs such as handheld radios or industrial IoT gateways.
Recomendado
Industrial Protocol Bridging
The 10CL010ZM164I8G is frequently used as a multi-protocol bridge between industrial fieldbuses and Ethernet, translating between Profibus, CAN, RS-485, I2C, SPI, and Modbus TCP on a single programmable device. The 10,320 LEs and 46 multipliers implement soft MAC and PHY adaptation layers, while the 164-MBGA's multiple I/O banks support mixed 3.3 V and 5 V signalling without level shifters. Industrial temperature grade and long-term Intel availability make the part attractive for factory-automation gateways that must operate reliably for 10+ years.
Recomendado
IoT Edge Sensor Aggregation
IoT edge nodes using the 10CL010ZM164I8G aggregate data from multiple low-speed sensors (I2C temperature, SPI IMU, UART GPS) and preprocess it locally before forwarding over Ethernet or wireless links. The 101 user I/Os comfortably host 10+ simultaneous sensor buses, while 46 multipliers support on-device FFT for vibration or acoustic analysis. The industrial temperature rating allows deployment in outdoor enclosures, and the MBGA package's small footprint suits compact edge-gateway hardware. Compared with microcontroller-based designs, the FPGA delivers deterministic sub-microsecond response for time-critical control loops.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10CL010ZM164I8G — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 10CL010YM164I7G | 10CL010YM164C8G | 10CL010YM164C6G | 10CL010YM164A7G | 10CL006ZM164I8G | 10CL010ZE144I8G |
|---|---|---|---|---|---|---|---|
| Package | 164-ball MBGA (M164) | 164-ball MBGA (M164) - same | 164-ball MBGA (M164) - same | 164-ball MBGA (M164) - same | 164-ball MBGA (M164) - same | 164-ball MBGA (M164) - same | 164-ball MBGA (M164) - same die, E144 EQFP footprint differs |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 10,320 | 10,320 | 10,320 | 10,320 | 10,320 | 6,272 (-39%) | 10,320 |
| Embedded Memory (bits) | 423,936 | 423,936 | 423,936 | 423,936 | 423,936 | 276,480 (-35%) | 423,936 |
| 18x18 Multipliers | 46 | 46 | 46 | 46 | 46 | 28 (-39%) | 46 |
| Maximum User I/O | 101 | 101 | 101 | 101 | 101 | 101 | 101 |
| Speed Grade | Z (fastest) | Y | Y | Y C6 | Y A7 (slowest) | Z | Z |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Commercial (0C to +85C) | Commercial | Industrial | Industrial | Industrial |
| Approx. Unit Price @ 1000 | $23.10 | Lower (Y-grade cost advantage) | Lower (commercial grade) | Lower (C6 speed grade) | Lowest (slowest speed grade) | Lower (lower density) | Similar (different package) |
Diferenciadores clave
- Z-speed grade offers fastest timing closure in the 164-MBGA package (frente a 10CL010YM164I7G)
- Industrial -40C to +100C temperature range (frente a 10CL010YM164C8G)
- Higher logic density than the 10CL006 family (frente a 10CL006ZM164I8G)
Notas de diseño
The Cyclone 10 LP 10CL010ZM164I8G requires a clean 1.0 V core supply and per-bank I/O voltages (typically 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V). Intel's pin connection guidelines recommend a Pi filter on each supply rail and bulk decoupling of at least 100 uF plus 0.1 uF + 1 nF high-frequency ceramics per power pin group. Estimated core current at full utilization: roughly 100-300 mA depending on toggle rate - validate with the Quartus Prime PowerPlay analyzer before finalizing the power tree.
The 164-ball MBGA package uses a 0.5 mm ball pitch and requires microvia or laser-drilled PCB technology for reliable fan-out. Follow Intel's Cyclone 10 LP board design guidelines for trace impedance (50 ohm single-ended, 100 ohm differential) and via-in-pad recommendations. Keep configuration clock and data traces short and well-isolated from switching I/O to avoid CRC errors during bitstream load. Estimated minimum PCB layer stack: 6 layers with dedicated ground and power planes.
Do not confuse the I8G OPN suffix with separate 'I' (industrial) and '8G' (packaging) qualifiers - the suffix is a single ordering code per Intel's OPN decoder. The configuration scheme must match the selected mode (PS, FPP, or JTAG); a misconfigured MSEL strap will prevent bitstream load. The nCONFIG, nSTATUS, and CONFIG_DONE pins require 4.7 kohm pull-ups to VCCIO of the configuration bank. Plan for a configuration flash (EPCQ or compatible serial NOR) sized at least 30% larger than the compressed bitstream.
Although the Cyclone 10 LP family is designed for low power, sustained high toggle rates on 100+ I/Os can still produce noticeable self-heating. Use the MBGA's thermal pad and connect it to a grounded copper pour with at least 4 thermal vias (0.3 mm drill) for heat spreading. Estimated junction-to-ambient thermal resistance (theta_JA) for the 164-MBGA on a 4-layer JEDEC test board is approximately 30-35 C/W - derate accordingly if your design drives many LVDS or SSTL outputs at high frequency.
Información de cumplimiento
RoHS and lead-free per Altera/Intel product page; halogen-free status inferred from Intel FPGA packaging policy but not explicitly stated in verified data (verify on datasheet). Not AEC-Q100 qualified - choose an automotive-grade Cyclone 10 LP variant for vehicle applications.
