10M25DAF484I7G - MAX 10 FPGA 25K LE 484-FBGA | Intel
N.º de pieza: 10M25DAF484I7G ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $142.5 | $142,50 |
| 10 | $135.2 | $1.352,00 |
| 100 | $118.75 | $11.875,00 |
| 250 | $108.4 | $27.100,00 |
| 500 | $99.8 | $49.900,00 |
10M25DAF484I7G Descripción general
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built from an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as PLLs, transceivers, memory controllers, and SERDES. FPGAs sit above microcontrollers in the programmable-logic hierarchy: they offer parallel, deterministic hardware execution at gate-level granularity and are reprogrammed via HDL synthesis. The MAX 10 family specifically targets low-cost, non-volatile applications where CPLDs, discrete microcontrollers, or small ASICs would otherwise be used.
Key features of the 10M25DAF484I7G include 25,000 logic elements (LEs), 66 embedded 18 x 18 multipliers, 2 PLLs, 4 general-purpose timers, and an integrated 12-bit successive-approximation ADC with up to 17 external analog inputs. Dual on-chip configuration flash supports instant-on and dual-boot operation. The device is rated industrial (-40 C to +100 C ambient) and ships in lead-free, RoHS-compliant 484-FBGA packaging.
Architecturally, the MAX 10 device uses a TSMC 55 nm embedded-flash process. This non-volatile process enables single-chip FPGA operation without an external boot memory, simplifying board layout and BOM. Hard memory controllers and the hardened ADC eliminate soft-IP overhead, leaving fabric resources available for application logic.
Typical applications include industrial motor control, video bridging and image aggregation, I/O expansion and protocol bridging, factory automation I/O hubs, and portable instrumentation. Designers select MAX 10 when they need the I/O count and parallel performance of an FPGA but want the instant-on simplicity of a microcontroller.
When designing with the 10M25DAF484I7G, plan the FBGA escape routing early. The 484-ball package requires a 4-layer minimum stack-up with microvia or via-in-pad capability on the inner rows. Verify the Quartus Prime software supports the I7 speed grade before committing to layout.
This page synthesizes distributor pricing, drop-in MAX 10 alternatives, and practical board-level design guidance not found in the manufacturer datasheet alone.
Alternativas directas para 10M25DAF484I7G — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10M25DAF484I7G (mismo factor de forma y huella) — difiere en Package, Operating Temperature, PLLs, Configuration Memory, Process Technology.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10M25DAF484I7P
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
10M25DAF484C8G
✅ Sustitución directa✓ En stock
$50 / unidad
Ver hoja de datos →10M25DAF484C7G
✅ Sustitución directa✓ En stock
$38.5 / unidad
Ver hoja de datos →10M25DAF484A7G
✅ Sustitución directa✓ En stock
$52.75 / unidad
Ver hoja de datos →10M25DCF484I7G
✅ Sustitución directa✓ En stock
$45.1 / unidad
Ver hoja de datos →10M16DAF484I7G
✅ Sustitución directa✓ En stock
$60.4 / unidad
Ver hoja de datos →10M25DAF484I7G Valores máximos y características eléctricas
| Family | MAX 10 |
| Logic Elements (LE) | 25,000 |
| Embedded Memory (bits) | 691,200 |
| User I/Os | 360 |
| Encapsulado | 484-FBGA (FBGA) |
| Core Voltage | 1.2 V |
| Speed Grade | I7 |
| Temperature Grade | Industrial (-40 C to +100 C ambient) |
| Tipo de montaje | Surface Mount (BGA) |
| Tray / Reel | Tray |
| 18 x 18 Multipliers | 66 |
| PLLs | 2 |
| On-chip Configuration Flash | Dual (instant-on, dual-boot) |
| Integrated ADC | 12-bit SAR, up to 17 analog inputs |
| Estado RoHS | Compliant |
Guía de configuración de pines de 10M25DAF484I7G 484-fbga (fbga)
Configuración de pines para 10M25DAF484I7G (encapsulado 484-fbga (fbga)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para 10M25DAF484I7G.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
10M25DAF484I7G es adecuado para 6 aplicacións: Industrial Motor Control, Video Bridging and Aggregation, I/O Expansion and Protocol Bridging, Factory Automation I/O Hub, Portable Test and Measurement, Industrial IoT Edge Gateway.
Industrial Motor Control
The 10M25DAF484I7G is well-suited for industrial motor control drives where multi-axis PWM generation, encoder feedback, and current-sense sampling must be processed with deterministic latency. The integrated 12-bit SAR ADC with up to 17 analog inputs handles current and voltage feedback without external ADCs, while the 360 user I/Os aggregate Hall sensors, QEI encoders, and gate-driver signals. The 25,000 logic elements implement field-oriented control (FOC) state machines in fabric, freeing the MCU from time-critical loops. The industrial temperature grade (-40 C to +100 C ambient) and dual on-chip configuration flash with instant-on support meet factory-floor reliability and safety-boot requirements.
Recomendado
Video Bridging and Aggregation
For video bridge applications the 10M25DAF484I7G offers 360 user I/Os capable of routing multiple CMOS or LVDS camera streams into a parallel processor or serializer. The 66 embedded 18 x 18 multipliers and 2 PLLs handle pixel-clock multiplication, chroma conversion, and color-space transformation in fabric. Dual-configuration flash lets the device boot a debug image in production and a field-update image after deployment. The 484-FBGA package provides controlled-impedance escape for LVDS pairs without external repeaters, simplifying multi-camera PCB integration in machine-vision and surveillance products.
Recomendado
I/O Expansion and Protocol Bridging
In I/O-expansion applications the 10M25DAF484I7G connects legacy parallel buses (ISA, 8051, 8-bit/16-bit SRAM) to modern serial interfaces (I2C, SPI, UART, I3C) without external bridge chips. The 25K logic elements and 691 Kb of embedded SRAM buffer transactions at line rate, while the 360 user I/Os handle wide legacy busses directly. Industrial I/O expansion cards use the device as a single-chip bridge, replacing discrete CPLD-plus-microcontroller solutions. The hardened ADC can monitor supply rails or temperature sensors on the same card, reducing BOM.
Recomendado
Factory Automation I/O Hub
In factory automation the 10M25DAF484I7G aggregates 24 V opto-isolated industrial inputs and drives 24 V sink/source outputs via low-side FETs. The 360 user I/Os accommodate dozens of digital channels plus dedicated timer/PWM blocks for servo and stepper control. The integrated ADC monitors analog sensors such as pressure transducers and thermocouples. Dual-configuration flash enables secure remote firmware updates, important in Industry 4.0 retrofits where production lines are accessed over Ethernet. The industrial temperature grade meets IEC 60068-2-1/2 testing for cold and dry heat.
Recomendado
Portable Test and Measurement
Portable instruments such as oscilloscope front-end digitizers, logic analyzers, and protocol exercisers benefit from the 10M25DAF484I7G's parallel I/O count and on-chip ADC. The 25K logic elements implement trigger engines and protocol decoders, the 691 Kb SRAM buffers samples, and the hardened ADC provides auxiliary analog measurements. Instant-on dual-boot flash lets handheld units boot in under 100 ms to a known-good image, critical for field technicians. The 484-FBGA package keeps the device footprint small despite 360 I/Os, helping shrink handheld form factors.
Recomendado
Industrial IoT Edge Gateway
In edge-gateway designs the 10M25DAF484I7G serves as a hardware accelerator that pre-processes sensor data before forwarding to a host processor. Its 25K logic elements implement time-sensitive networking (TSN) traffic shapers, Modbus/TCP parsing, and AES-128 MACsec offload. The hardened ADC monitors chassis temperature and power rails, replacing discrete analog front-ends. Dual-configuration flash supports signed-image secure boot, required by IEC 62443 industrial cybersecurity guidelines. The 360 user I/Os aggregate multiple fieldbus segments onto a single gateway board.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10M25DAF484I7G — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 10M25DAF484I7P | 10M25DAF484C8G | 10M25DAF484C7G | 10M25DCF484I7G | 10M16DAF484I7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Logic Elements | 25,000 | 25,000 | 25,000 | 25,000 | 25,000 | 16,000 (-36%) |
| Speed Grade | I7 (industrial) | I7 | C8 (commercial) | C7 (commercial) | I7 | I7 |
| Temperature Grade | Industrial (-40 C to +100 C) | Industrial | Commercial (0 C to +85 C) | Commercial (0 C to +85 C) | Industrial | Industrial |
| Embedded Memory (bits) | 691,200 | 691,200 | 691,200 | 691,200 | 691,200 | 450,560 (-35%) |
| User I/Os | 360 | 360 | 360 | 360 | 360 | 320 (-11%) |
| Integrated ADC | 12-bit SAR, 17 inputs | 12-bit SAR, 17 inputs | 12-bit SAR, 17 inputs | 12-bit SAR, 17 inputs | 12-bit SAR, fewer inputs (compact) | 12-bit SAR, 16 inputs |
| Unit Price @ Qty 1 | 142.50 USD | Similar (~142 USD) | ~118 USD (-17%) | ~115 USD (-19%) | ~132 USD (-7%) | ~95 USD (-33%) |
Diferenciadores clave
- Highest speed grade in the 10M25 family at industrial temperature (frente a 10M25DAF484C8G)
- Maximum logic density for the 484-FBGA footprint (frente a 10M16DAF484I7G)
- Full-feature-set MAX 10 device (frente a 10M25DCF484I7G)
Notas de diseño
The 484-FBGA package uses 1.0 mm ball pitch and requires microvia (laser-drilled or plasma-etched) technology to escape the inner rows. Use a 4-layer to 6-layer PCB stack-up with via-in-pad for the inner balls, keep reference planes continuous under the BGA, and verify your manufacturer's minimum drill and aspect-ratio capability before committing to layout. Estimated: a 6-layer 1.4 mm total-thickness board with 0.1 mm laser vias and 0.2 mm capture pads typically supports 1.0 mm pitch FBGA escape on all rows.
The MAX 10 device in 484-FBGA typically dissipates 1-3 W depending on toggle rate and logic utilization. Use the Intel Quartus Prime PowerPlay early power estimator to size thermal relief before PCB layout. Estimated: at 25K LE utilization and 100 MHz toggle, junction temperature rise is approximately 15-20 C over ambient on a 4-layer board with a 50 mm x 50 mm copper pour. Provide thermal vias under the central BGA balls and consider a small heatsink for sealed enclosures.
Do not assume the I7, C8, C7, and A7 speed grades are interchangeable: the letter suffix indicates temperature grade (I = industrial, C = commercial, A = automotive-augmented) and the digit indicates speed bin. A C8 device in an industrial enclosure will fail thermal qualification. Verify the speed grade AND temperature grade against your environment before ordering. Also confirm Quartus Prime version supports the specific I7 speed grade; older 18.x releases do not include all MAX 10 device support.
Información de cumplimiento
RoHS compliant per Intel product declaration; not AEC-Q100 qualified (MAX 10 family does not target automotive ASIL applications).
