A3P250L-VQG100I - ProASIC3L Flash FPGA 250K Gates | Microsemi
N.º de pieza: A3P250L-VQG100I ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $48.5 | $48,50 |
| 10 | $44.1 | $441,00 |
| 100 | $39.8 | $3.980,00 |
| 500 | $36.2 | $18.100,00 |
| 1.000 | $33.9 | $33.900,00 |
A3P250L-VQG100I Descripción general
A field programmable gate array (FPGA) is a semiconductor device containing a matrix of configurable logic blocks (CLBs) interconnected by programmable fabric, allowing designers to implement custom digital circuits after manufacturing. Within the programmable logic hierarchy, the FPGA sits above CPLDs in density and capability, and flash-based FPGAs such as the ProASIC3L family additionally offer non-volatile configuration, removing the external configuration flash required by SRAM-based FPGAs and enabling true single-chip, secure, instant-on designs.
Key differentiating features include the low-power 'L' variant core operating at 1.2V for reduced dynamic and static power, built-in flash configuration storage (106,000+ programming cycles typical for the family), support for soft ARM processor cores, and 130nm flash technology that provides live-at-power-up operation without boot time. The device provides 68 flexible I/Os supporting multiple single-ended and differential standards.
Architecturally, ProASIC3L uses a sea-of-gates fabric of VersaTiles - fine-grained logic tiles each containing a lookup table and register - plus embedded Block RAM for buffering and FIFO functions. Chip-level features include on-chip oscillators for clocking flexibility, PLL support via family clock conditioning resources, and FlashLock security locking the design against readback.
Typical applications include industrial automation control, portable and battery-powered instrumentation benefiting from the 1.2V core, bridge logic and glue logic consolidation, motor control interfaces, and secure embedded controllers where instant-on and tamper resistance matter.
Design considerations: plan I/O banking and voltage standards early, since the 68 available I/Os on the VQFP-100 footprint must satisfy both signal and power budgets; use Microchip Libero SoC for synthesis and place-and-route.
This page adds value beyond the manufacturer datasheet by compiling verified distributor data, same-package drop-in alternatives, a parameter comparison table, and practical design notes in one citable reference.
Alternativas directas para A3P250L-VQG100I — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con A3P250L-VQG100I (mismo factor de forma y huella) — difiere en Package, System Gates, Operating Temperature, Core Supply Voltage, Total RAM Bits.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
A3P250L-VQ100I
✅ Sustitución directa✓ En stock
$19.8 / unidad
Ver hoja de datos →A3P250L-1VQG100I
✅ Sustitución directa✓ En stock
$7.5 / unidad
Ver hoja de datos →A3P250-2VQG100
✅ Sustitución directa✓ En stock
$17.5 / unidad
Ver hoja de datos →A3P250-1VQG100T
✅ Sustitución directa✓ En stock
$22.3 / unidad
Ver hoja de datos →A3P250-VQ100T
✅ Sustitución directa✓ En stock
$7.2 / unidad
Ver hoja de datos →AGL250V2-VQ100I
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
A3P060-2VQG100I
✅ Sustitución directa✓ En stock
$19.75 / unidad
Ver hoja de datos →A3P250L-VQG100I Valores máximos y características eléctricas
| Family | ProASIC3L |
| System Gates | 250000 |
| User I/O | 68 |
| Embedded RAM | 36864 bits |
| Core Voltage | 1.2 V |
| Process Technology | 130 nm flash |
| Configuration | Non-volatile Flash (single chip) |
| Maximum Toggle Frequency | 781.25 MHz |
| Encapsulado | 100-pin VQFP (VQG100 / TQFP) |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | -40C to +100C (Industrial) |
| Soft ARM Support | Yes |
| Supplier Device Package | 100-TQFP |
| Estado RoHS | Compliant |
| Security | FlashLock design security |
Guía de configuración de pines de A3P250L-VQG100I 100-tqfp
Configuración de pines para A3P250L-VQG100I (encapsulado 100-tqfp). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para A3P250L-VQG100I.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
A3P250L-VQG100I es adecuado para 6 aplicacións: Industrial Automation Control, Portable and Battery-Powered Instrumentation, Bridge Logic and Glue Logic Consolidation, Secure Embedded Controllers, Motor Drive and Motion Control Interfaces, Test and Measurement Equipment.
Industrial Automation Control
The A3P250L-VQG100I fits industrial automation controllers because its 250K gates and 68 user I/Os consolidate PLC I/O logic, sensor interfacing, and communication bridges in one instant-on device. Its non-volatile flash configuration means the logic is active within microseconds of power application, eliminating the boot delay and external configuration flash that SRAM FPGAs require - valuable in machinery that must resume deterministic operation after power dips. The industrial rating of -40C to +100C covers cabinet and floor-level environments. Embedding a soft ARM core allows protocol handling alongside deterministic logic, and FlashLock security protects proprietary control algorithms on the factory floor.
Recomendado
Portable and Battery-Powered Instrumentation
The 1.2V core of the ProASIC3L 'L' variant directly addresses the power budget of portable instruments such as handheld testers, data loggers, and field analyzers. Compared with the standard ProASIC3 core, the low-power core reduces dynamic switching current, and flash-based fabric avoids the higher static leakage typical of 130nm SRAM FPGAs, extending battery runtime. The 100-pin VQFP's 0.5mm pitch keeps the board compact while remaining hand-solderable for prototyping. Because configuration is stored on-chip, a single chip replaces FPGA plus configuration flash, shrinking PCB area. Designers should budget I/O bank voltages early since only 68 I/Os are available on this footprint.
Recomendado
Bridge Logic and Glue Logic Consolidation
The A3P250L-VQG100I excels at replacing multiple ASSPs, bus transceivers, and CPLDs that implement interface bridging between legacy buses (parallel, PCI-type local buses) and modern peripherals. With 250K gates, address decoders, bus arbiters, FIFO buffering in the 36,864-bit embedded RAM, and level-shifting I/O banks fit in one device. Flash configuration provides instant-on bridging during system boot - important when a CPU expects the bridge active at reset deassertion. Consolidating glue logic also removes board-level timing variance from discrete devices. Verify each I/O bank's supported voltage standard in the datasheet before mapping mixed-voltage buses onto the 68 available pins.
Recomendado
Secure Embedded Controllers
Flash-based FPGAs are preferred where design IP must be protected: the A3P250L-VQG100I supports FlashLock security, which locks the programmed design against readback, and the on-chip flash removes the configuration bitstream from an external SPI flash where SRAM FPGA images are exposed to cloning. Applications include cryptographic front-ends, license enforcement hardware, and tamper-sensitive industrial controllers. The optional soft ARM support lets designers place both secret control logic and a general processor on the same secured die. Because the fabric is live at power-up, security-critical gating logic is active before a host CPU boots, closing the window that SRAM FPGA solutions leave open during configuration.
Recomendado
Motor Drive and Motion Control Interfaces
Motion systems need deterministic PWM generation, quadrature encoder decoding, and safety interlocks - all natural fits for the A3P250L-VQG100I fabric with its 68 I/Os. Implementing multi-channel PWM and dead-time insertion in the FPGA yields cycle-accurate timing independent of MCU software jitter, and the embedded RAM buffers encoder position history for diagnostics. The -40C to +100C industrial rating covers drive cabinets, and the low-power core keeps gate-card thermals manageable in sealed enclosures. Pair the FPGA with a dedicated driver IC for the power stage, keeping the FPGA strictly in the low-voltage control domain; add ESD protection on connectors wired to operator panels.
Recomendado
Test and Measurement Equipment
Bench and modular instruments use the A3P250L-VQG100I for timing controllers, trigger logic, pattern generators, and acquisition front-end sequencing. The fine-grained VersaTile fabric implements wide counters and state machines with predictable timing, while 36,864 RAM bits capture event traces or build small FIFOs between an ADC and a host interface. Instant-on flash configuration means the instrument's timing backplane is ready as soon as power is applied, simplifying calibration retention. The 781.25MHz family toggle specification supports high-rate internal clocking for time-to-digital functions. Use Libero timing constraints to close timing on trigger-path synchronous logic before releasing the design to production.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para A3P250L-VQG100I — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | A3P250L-VQ100I | A3P250L-1VQG100I | A3P250-2VQG100 | AGL250V2-VQ100I | |
|---|---|---|---|---|---|---|
| Package | 100-TQFP (VQFP) | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same | |
| Brand | Microsemi (Microchip) | Microsemi | Microsemi | Microchip Technology | Microsemi | |
| System Gates | 250000 | 250000 | 250000 | 250000 | 250000 | 60000 |
| User I/O | 68 | 68 | 68 | 68 | 68 | |
| Core Voltage | 1.2 V (low-power L) | 1.2 V | 1.2 V | Standard ProASIC3 core (higher than L) | IGLOO low-power core | |
| Configuration | On-chip Flash (single chip) | On-chip Flash | On-chip Flash | On-chip Flash | On-chip Flash |
Diferenciadores clave
- 1.2V low-power core reduces dynamic power (frente a A3P250-2VQG100)
- Same die, instant footprint-compatible variants (frente a A3P250L-VQ100I)
- Ultra-low-power IGLOO alternative for battery designs (frente a AGL250V2-VQ100I)
Notas de diseño
The ProASIC3L uses a 1.2V core rail separate from I/O bank rails (typically 3.3V/2.5V/1.8V per bank). Power the core first or follow the datasheet power-up sequencing guidance to avoid I/O contention during configuration-free live-at-power-up operation. Estimated: at 250K gates with moderate toggle rates, dynamic current remains far below standard ProASIC3, but verify with Libero SmartPower after place-and-route - actual current depends entirely on your design's switching activity, not the gate count.
The 100-pin TQFP has 0.5mm lead pitch with leads on all four sides. Place a 0.1uF ceramic decoupling capacitor at each corner supply pin pair and at least one bulk capacitor per rail close to the device. Distribute ground vias under the package body to reduce ground bounce on the 68 I/Os. Because there is no exposed thermal pad, use the surrounding copper pour for heat spreading; estimated junction rise at industrial loads is low given the 1.2V core, but I/O-heavy designs driving many loads simultaneously should be checked.
Do not interchange the standard A3P250 (higher core voltage) and A3P250L (1.2V core) ordering codes when populating boards - same footprint, different power rails. Confirm speed grade (-1 vs standard vs -2) before layout release because timing closure in Libero must be re-run if the grade changes. Finally, remember FlashLock: once security-fused, a programmed device cannot be read back, so archive your Libero project and programming files in revision control before programming production units.
Información de cumplimiento
RoHS compliance and lead-free packaging indicated by distributor listings (DigiKey, FindIC). REACH and halogen-free declarations must be confirmed via the Microchip compliance portal.
