AD7715ACHIPS-3 - 16-Bit Sigma-Delta ADC, 3V, 450uA | ADI
N.º de pieza: AD7715ACHIPS-3 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.4 | $164,00 |
| 100 | $14.2 | $1.420,00 |
| 500 | $12.6 | $6.300,00 |
| 1.000 | $11.25 | $11.250,00 |
AD7715ACHIPS-3 Descripción general
What is a sigma-delta ADC? A sigma-delta (ΣΔ) ADC is a class of oversampling converter that trades raw speed for very high resolution by pushing quantization noise out of the signal band using a modulator and a digital filter. Within the broader hierarchy, the AD7715ACHIPS-3 sits in the precision converter category (ADC > sigma-delta ADC > low-frequency precision ADC > data acquisition IC > signal conditioning > power management), and is intended for transducer-based measurements where DC accuracy and noise rejection matter more than throughput.
Key features include 16-bit resolution with no missing codes, very low 450 uA supply current at 3 V/1 MHz, a charge-balancing front end that simplifies external antialias filtering, programmable gains up to 128 for direct bridge or thermocouple hookups, and self-calibration options that remove zero-scale and full-scale errors. The differential input pair can accept unipolar or true bipolar input ranges when the part is operated from a 5 V supply rail (AD7715-5 variant).
Architecturally, the converter combines a switched-capacitor modulator and a digital filter on a single CMOS die, achieving the same effective resolution as discrete modulator-plus-filter designs at a fraction of the power. The internal calibration registers capture system offset and gain at the user's programmed update rate, allowing the ADC to compensate for front-end drift without processor intervention.
Typical applications include weigh scales and load-cell bridges, thermocouple cold-junction compensation, portable industrial instrumentation, and pressure transducer readouts. Because the device is offered in CHIPS (bare-die) form, integrators typically embed it inside custom sensor modules, hybrid microcircuits, or harsh-environment packages where standard PDIP/SOIC would not survive.
When designing with this part, pay particular attention to PCB layout for the bare die: bond wires must be short and Kelvin-bonded to the analog inputs to avoid thermocouple-induced offsets. Programming gain to 128 amplifies both signal and noise, so external noise budgeting is critical.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the AD7715ACHIPS-3 not found in any single manufacturer datasheet.
Alternativas directas para AD7715ACHIPS-3 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con AD7715ACHIPS-3 (mismo factor de forma y huella) — difiere en Calibration, Resolution, Serial Interface, Supply Voltage.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
AD7715ACHIPS-5
✅ Sustitución directa✓ En stock
$14.95 / unidad
Ver hoja de datos →AD7715ACHIPS-3 Valores máximos y características eléctricas
| Resolución | 16 bits |
| Number of Inputs | 1 differential |
| ADC Architecture | Sigma-Delta (charge balancing) |
| Tensión de alimentación | 3 V nominal (3 V variant; -5 variant operates at 5 V) |
| Corriente de alimentación | 450 uA max at 3 V / 1 MHz MCLK |
| Master Clock Range | 1 MHz typical (see datasheet) |
| Integral Nonlinearity (INL) | 0.0015% |
| Missing Codes | None (16 bits guaranteed) |
| Programmable Gains | 1, 2, 32, 128 |
| Input Type | Differential analog input pair |
| Serial Interface | 3-wire SPI/QSPI/MICROWIRE compatible |
| Package Type | Bare die / CHIPS |
| Terminal Count | 16 (die pads) |
| Calibration | On-chip self-calibration (zero-scale, full-scale) |
Guía de configuración de pines de AD7715ACHIPS-3 bare die / chips
Configuración de pines para AD7715ACHIPS-3 (encapsulado bare die / chips). Este componente analógico presenta pines de entrada, salida y alimentación. Consulte la hoja de datos del fabricante para conocer las configuraciones de los pines de ajuste de offset, compensación y habilitación. Ideal para circuitos de acondicionamiento de señal y amplificadores.
No hay datos detallados de patillaje disponibles para AD7715ACHIPS-3.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
AD7715ACHIPS-3 es adecuado para 7 aplicacións: Weigh Scales and Load-Cell Bridges, Thermocouple and Temperature Acquisition, Pressure Transducer Readout Modules, Portable Industrial Instrumentation, Medical Monitoring and Diagnostic Equipment, Strain-Gauge Structural Health Monitoring, Hybrid Microcircuit and Chip-on-Board Modules.
Weigh Scales and Load-Cell Bridges
The AD7715ACHIPS-3 fits weigh-scale and bridge-based force measurement because its 128 programmable gain lets it directly digitize millivolt-level bridge outputs without front-end instrumentation amplifiers. The differential analog input rejects mains-frequency common-mode noise typical of industrial shop floors, and the 450 uA supply current at 3 V allows battery operation. According to the Analog Devices datasheet, on-chip self-calibration cancels offset and gain drift over time, keeping the scale within calibration for years.
Recomendado
Thermocouple and Temperature Acquisition
For thermocouple cold-junction compensation the AD7715ACHIPS-3's gain of 128 maps the few-millivolt thermocouple output across most of the converter's 16-bit range, while the charge-balancing front end rejects 50 Hz/60 Hz line pickup common in industrial plants. The bare-die CHIPS form lets designers mount the ADC directly inside the probe housing, eliminating long cable runs that would otherwise inject thermocouple-induced offsets. Per the datasheet, paired with an external precision reference it can resolve sub-degree-C temperature changes.
Recomendado
Pressure Transducer Readout Modules
The AD7715ACHIPS-3 is widely used inside hybridized pressure-sensor modules because the bare die can be bonded directly to the strain-gauge bridge inside a sealed housing, eliminating cabling and connector-related drifts. With programmable gain of 32 or 128 it digitizes typical 3 mV/V bridge outputs with 16-bit effective resolution, while the 3 V supply and 450 uA budget suit loop-powered or battery-powered transmitters. The Analog Devices datasheet documents self-calibration routines that the host MCU can run on power-up to remove sensor offset and span error.
Recomendado
Portable Industrial Instrumentation
Battery-powered handheld meters and field calibrators benefit from the AD7715ACHIPS-3's 450 uA supply current at 3 V, which is much lower than typical 5 V general-purpose ADCs. The 3-wire serial interface shares pins with most microcontrollers and DSPs, freeing board area for displays or radios. The CHIPS bare-die form lets designers shrink the meter enclosure without sacrificing ADC performance, an important constraint when the converter must fit alongside keypad, battery, and isolation barriers in industrial products.
Recomendado
Medical Monitoring and Diagnostic Equipment
Patient monitors and small benchtop diagnostic instruments use the AD7715ACHIPS-3 to digitize signals from strain-gauge respiration belts, invasive pressure transducers, and other low-frequency physiological sensors. The 16-bit effective resolution at low update rates provides the dynamic range needed for medical signals, while the differential inputs reject common-mode noise from electrocautery and other hospital interference. The bare-die form permits integration into single-use or disposable medical modules, an important manufacturing consideration for high-volume medical OEMs.
Recomendado
Strain-Gauge Structural Health Monitoring
Wireless structural monitoring nodes mounted on bridges, towers, and aerospace structures use the AD7715ACHIPS-3 for its high gain (128) and very low 450 uA supply current, which together maximize battery life while digitizing sub-millivolt strain-gauge outputs. The bare-die CHIPS form lets the designer mount the ADC inside a sealed transducer housing, eliminating the need for an external ADC chip that would otherwise increase node size and connector count. Per the Analog Devices datasheet, on-chip calibration supports long-term stability for unattended deployments that must operate for years on a single battery.
Recomendado
Hybrid Microcircuit and Chip-on-Board Modules
Because the AD7715ACHIPS-3 ships as a verified bare die with documented bond-pad coordinates, hybrid manufacturers can integrate it into thick-film or thin-film ceramic modules for aerospace, defense, and down-hole oil-drilling applications where standard molded parts would fail. The CHIPS form avoids plastic-package outgassing and allows direct bonding to thick-film resistors, reducing parasitics on critical analog signal paths. Per the Analog Devices datasheet, this is also the preferred route for high-shock and high-vibration environments that exceed molded-package qualification levels.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para AD7715ACHIPS-3 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | AD7715ACHIPS-5 |
|---|---|---|
| Brand | Analog Devices | Analog Devices |
| Package | DIE / CHIPS (bare die) | DIE / CHIPS (bare die) - same |
| Resolution | 16 bits | 16 bits |
| Supply Voltage | 3 V nominal | 5 V nominal |
| Supply Current | 450 uA max at 3 V / 1 MHz | 450 uA max at 5 V / 1 MHz |
| Input Range | Unipolar differential (3 V variant) | Bipolar differential (5 V variant) |
| Programmable Gains | 1, 2, 32, 128 | 1, 2, 32, 128 - same |
| INL | 0.0015% | 0.0015% - same |
Diferenciadores clave
- Charge-balancing front end simplifies anti-alias filtering (frente a AD7705)
- Bare-die CHIPS form factor for hybrid integration (frente a AD7715AR-3 (SOIC_W-16))
- Lowest quiescent current in its precision 16-bit ADC family (frente a AD7714ACHIPS-3)
Notas de diseño
For bare-die assembly (CHIPS), use short, parallel bond wires to the analog input pads with Kelvin connections to the bridge or sensor element. According to the Analog Devices datasheet, bond-wire length mismatch on the analog inputs introduces thermocouple-induced offsets that can dominate the converter's 16-bit noise floor, so symmetric layout is critical. Keep digital bond wires (SCLK, DOUT, DRDY) physically separated from analog bond wires to avoid coupling; route traces over a continuous analog ground plane beneath the die.
Decouple the +3 V supply with at least 10 uF of bulk capacitance and a 100 nF ceramic capacitor placed within 5 mm of the die pads to prevent digital switching transients from coupling into the modulator. According to the AD7715 datasheet, the analog and digital +3 V pins can be tied together at the die but should be filtered separately at the PCB side to avoid back-feeding logic noise into the analog front end. A separate low-noise LDO such as an ADP7102 is recommended for the ADC supply in precision weigh-scale designs.
Estimated: at the maximum gain of 128 the analog input full-scale range compresses to roughly ±20 mV (bipolar) or 0 to 20 mV (unipolar) per the AD7715 datasheet, so layout-induced thermocouple offsets and external EMI can easily exceed the input signal. Common pitfalls include driving the analog input pins directly with long shielded cables (use a low-pass RC network instead) and operating the chip at master-clock frequencies above 2.5 MHz without re-evaluating noise figures.
Run on-chip self-calibration on every power-up using the zero-scale and full-scale registers per the datasheet; this removes both the internal ADC errors and the front-end buffer offsets when the input is shorted to ground. According to the Analog Devices datasheet, calibration should be re-run if the operating temperature shifts by more than 10 C or the programmable gain is changed. Calibration coefficients are stored in on-chip registers, but host firmware must reload them after every reset or power cycle.
Información de cumplimiento
RoHS/REACH status for AD7715ACHIPS-3 must be verified against the specific die lot because bare-die products are integrated into hybrid modules whose overall compliance depends on the host substrate. The AD7715 family is supplied lead-free per Analog Devices documentation. AEC-Q100 is not applicable for industrial-grade precision ADCs of this type.
