ADIN1300BCPZ - Gigabit Ethernet PHY Transceiver | Analog Devices
N.º de pieza: ADIN1300BCPZ ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $9.85 | $9,85 |
| 10 | $8.92 | $89,20 |
| 100 | $7.45 | $745,00 |
| 500 | $6.6 | $3.300,00 |
| 1.000 | $5.89 | $5.890,00 |
ADIN1300BCPZ Descripción general
An Ethernet PHY (physical layer transceiver) is the analog/digital mixed-signal interface that sits between the MAC (media access controller) and the copper twisted-pair cable. It handles line encoding, link training, echo/next cancellation, and clock/data serialization. PHYs belong to the broader transceiver IC family, which itself falls under wired-interface ICs and the larger category of communication semiconductors. Industrial Ethernet PHYs must meet stricter temperature, EMI, and deterministic latency requirements than commercial PHYs.
Key features of the ADIN1300 include 4/4 (4-lane PCS/PMA) full- and half-duplex capability, automatic MDI/MDI-X crossover correction, support for jumbo frames, MACsec-ready interfaces in the family, integrated termination resistors, and on-chip cable diagnostics for open/short detection. The integrated 1.2V LDO and 2.5V LDO inside the chip reduce external BOM, while the GMII/RGMII MAC-side interface supports both 1.8V and 3.3V I/O signaling.
Architecturally, the ADIN1300 uses a DSP-based receiver with robust echo and near-end crosstalk (NEXT) cancellation, allowing reliable 1000BASE-T operation over up to 130 m of Cat5e cable. According to the ADIN1300 datasheet, typical power consumption is below 600 mW during 1000BASE-T operation and supports Energy Efficient Ethernet (EEE) for sub-100 mW idle power.
Typical uses include PROFINET, EtherNet/IP, and EtherCAT slave and master nodes, industrial PLC Ethernet ports, building automation controllers, smart-grid gateways, and motion-control drives. Deterministic, low-latency link-up and link-down behavior make it suitable for real-time fieldbus protocols requiring cycle-time guarantees.
When designing with this device, follow the analog supply decoupling scheme described in the ADIN1300 datasheet: place 1 µF and 0.1 µF ceramic capacitors on each AVDD/DVDD pin, keep the MDI traces as a 100-Ω differential pair with ground stitching vias, and ensure the 25 MHz reference clock has stable power-rail decoupling. For EMC compliance in industrial environments, consider a common-mode choke on the MDI lines.
This page synthesizes distributor pricing, drop-in alternatives, and practical PCB layout/design notes for industrial Ethernet designs that are not consolidated in the manufacturer datasheet.
Alternativas directas para ADIN1300BCPZ — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con ADIN1300BCPZ (mismo factor de forma y huella) — difiere en Data Rate, MAC Interface, MSL Level, Number of Ports, Package.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
ADIN1300CCPZ
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
ADIN1300BCPZ-R7
✅ Sustitución directa✓ En stock
$7.2 / unidad
Ver hoja de datos →ADIN1300CCPZ-R7
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
ADIN1300BCPZ Especificaciones
| Product Type | Ethernet PHY Transceiver |
| Velocidad de datos | 10/100/1000 Mbps |
| Standards Supported | IEEE 802.3 (10BASE-Te, 100BASE-TX, 1000BASE-T) |
| Duplex Mode | Full / Half (4/4 Transceiver) |
| Number of Ports | 1 |
| MAC Interface | GMII / RGMII |
| Tensión de alimentación | 1.2 V core, 2.5 V analog (typical) |
| Encapsulado | 40-LFCSP-WQ (6x6 mm) |
| Temperatura de funcionamiento | -40C to +85C (industrial) |
| Energy Efficient Ethernet (EEE) | Supported |
| Cable Diagnostics | Integrated TDR-based open/short detection |
| MDI/MDI-X Crossover | Automatic |
| Jumbo Frame Support | Yes |
| Tipo de montaje | Surface Mount |
| Nivel MSL | 3 |
| Estado RoHS | Compliant |
Configuración de pines de ADIN1300BCPZ
| Pin 1 | TXD0 — RGMII transmit data bit 0 |
| Pin 2 | TXD1 — RGMII transmit data bit 1 |
| Pin 3 | TXD2 — RGMII transmit data bit 2 |
| Pin 4 | TXD3 — RGMII transmit data bit 3 |
| Pin 5 | TX_EN — RGMII transmit enable (TX_CTL) |
| Pin 6 | TX_CLK — RGMII transmit clock input |
| Pin 7 | RXD0 — RGMII receive data bit 0 |
| Pin 8 | RXD1 — RGMII receive data bit 1 |
| Pin 9 | RXD2 — RGMII receive data bit 2 |
| Pin 10 | RXD3 — RGMII receive data bit 3 |
| Pin 11 | RX_DV — RGMII receive data valid (RX_CTL) |
| Pin 12 | RX_CLK — RGMII receive clock output |
| Pin 13 | MDC — Management data clock |
| Pin 14 | MDIO — Management data I/O |
| Pin 15 | RESET_N — Hardware reset (active low) |
| Pin 16 | INT_N — Interrupt output (active low) |
| Pin 17 | CLK_IN — 25 MHz reference clock input |
| Pin 18 | CLK_OUT — Buffered reference clock output |
| Pin 19 | LED0 — Link/activity LED driver 0 |
| Pin 20 | LED1 — Link speed LED driver 1 |
| Pin 21 | LED2 — Link/activity LED driver 2 |
| Pin 22 | DVDD — 1.2 V digital core supply |
| Pin 23 | DGND — Digital ground |
| Pin 24 | DVDDIO — 1.8 V / 3.3 V MAC I/O supply |
| Pin 25 | AVDD_1P2 — 1.2 V analog supply |
| Pin 26 | AVDD_2P5 — 2.5 V analog supply |
| Pin 27 | AGND — Analog ground |
| Pin 28 | REF_FILT — Reference filter capacitor node |
| Pin 29 | MDI_P0 — MDI differential pair 0 positive |
| Pin 30 | MDI_N0 — MDI differential pair 0 negative |
| Pin 31 | MDI_P1 — MDI differential pair 1 positive |
| Pin 32 | MDI_N1 — MDI differential pair 1 negative |
| Pin 33 | MDI_P2 — MDI differential pair 2 positive |
| Pin 34 | MDI_N2 — MDI differential pair 2 negative |
| Pin 35 | MDI_P3 — MDI differential pair 3 positive |
| Pin 36 | MDI_N3 — MDI differential pair 3 negative |
| Pin 37 | NC — Not connected (per datasheet) |
| Pin 38 | NC — Not connected (per datasheet) |
| Pin 39 | NC — Not connected (per datasheet) |
| Pin 40 | EPAD — Exposed paddle - must be soldered to ground plane |
Aplicaciones típicas
ADIN1300BCPZ es adecuado para 7 aplicacións: PROFINET / EtherCAT Industrial Slave Node, Industrial PLC Ethernet Port, Building Automation Gateway, Motor Drive / Motion Controller, Smart Grid / Substation Communications, Test & Measurement Ethernet Interface, Surveillance Network Video Recorder (NVR).
PROFINET / EtherCAT Industrial Slave Node
The ADIN1300BCPZ's 10/100/1000 Mbps capability with deterministic low-latency link training fits PROFINET and EtherCAT slave node requirements, where worst-case cycle times of 250 µs to 1 ms depend on the PHY reaching a stable link within a bounded number of training cycles. Its integrated cable diagnostics and industrial -40 °C to +85 °C rating suit factory-floor deployments. Placed between the host SoC (e.g. i.MX RT or AM243x) RGMII MAC and the MDI magnetics, it replaces the need for an external cable tester.
Recomendado
Industrial PLC Ethernet Port
The ADIN1300BCPZ integrates a 1000BASE-T PHY in a 6x6 mm LFCSP-WQ footprint that fits standard PLC backplane layouts while providing RGMII to the PLC CPU. Energy Efficient Ethernet (EEE) reduces idle power below 100 mW during fieldbus quiet periods, an important consideration for cabinet-cooled PLCs. Industrial temperature rating and integrated MDI termination resistors simplify BOM for high-density PLC designs with multiple Ethernet ports.
Recomendado
Building Automation Gateway
The ADIN1300BCPZ's Gigabit uplink and robust industrial temperature rating suit building automation gateways bridging BACnet/IP, Modbus TCP, and KNXnet/IP traffic. Its integrated cable diagnostics reduce on-site commissioning time by identifying open/short MDI faults before truck rolls. EEE keeps idle BACnet/IP polling traffic within low milli-watt power consumption. Pair with an SPI-managed companion switch such as KSZ9893RNXI for multi-port gateways.
Recomendado
Motor Drive / Motion Controller
The ADIN1300BCPZ delivers deterministic, low-latency Ethernet for motion-control drives using EtherCAT, where link-up time and cycle-jitter must be tightly bounded. Its 600 mW typical 1000BASE-T power consumption and integrated terminations keep the drive-side thermal envelope compact. Industrial -40 °C to +85 °C operation supports cabinet and on-motor mounting. Place the PHY between the drive MCU RGMII MAC and the MDI RJ45 with integrated magnetics.
Recomendado
Smart Grid / Substation Communications
The ADIN1300BCPZ's industrial temperature range and IEC-style EMI robustness make it suitable for substation communications, including IEC 61850 GOOSE/SV tunneling over 100BASE-TX. Cable diagnostics detect insulation degradation on long substation cable runs. Use redundant PHYs in a failover configuration with a managed companion switch for grid-resilience requirements. The integrated 2.5 V LDO simplifies isolated supply designs.
Recomendado
Test & Measurement Ethernet Interface
The ADIN1300BCPZ's 1000BASE-T capability with jumbo frame support is ideal for high-speed data acquisition systems streaming multi-gigabit samples over Ethernet. Its deterministic latency and on-chip cable diagnostics help validate production test fixtures. Pair with an FPGA-based MAC layer for custom protocol offload. The LFCSP-WQ package and exposed pad allow easy integration into high-density ATE designs.
Recomendado
Surveillance Network Video Recorder (NVR)
The ADIN1300BCPZ's Gigabit uplink supports multiple IP camera streams converging on an NVR with PoE passthrough. EEE reduces idle power between streaming events. Industrial temperature rating supports non-environment-controlled equipment rooms. Place the PHY between the NVR SoC RGMII MAC and the MDI RJ45 jack; pair with a PoE PD controller for powered-device ports on the NVR backplane.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para ADIN1300BCPZ — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | ADIN1300CCPZ | ADIN1300BCPZ-R7 | ADIN1300CCPZ-R7 | DP83867IRRGZT |
|---|---|---|---|---|---|
| Brand | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Texas Instruments |
| Package | 40-LFCSP-WQ (6x6) | 40-LFCSP-WQ (6x6) - same | 40-LFCSP-WQ (6x6) - same | 40-LFCSP-WQ (6x6) - same | QFN-48 (7x7) - different |
| Data Rate | 10/100/1000 Mbps | 10/100/1000 Mbps | 10/100/1000 Mbps | 10/100/1000 Mbps | 10/100/1000 Mbps |
| Temperature Range | -40C to +85C (industrial) | 0C to +70C (commercial) | -40C to +85C (industrial) | 0C to +70C (commercial) | -40C to +85C (industrial) |
| MAC Interface | GMII / RGMII | GMII / RGMII | GMII / RGMII | GMII / RGMII | RGMII / SGMII |
| Energy Efficient Ethernet | Yes | Yes | Yes | Yes | Yes |
| Cable Diagnostics | Integrated TDR | Integrated TDR | Integrated TDR | Integrated TDR | Limited (MLT-3 based) |
| Pin-to-Pin Compatible | Yes (reference) | Yes | Yes | Yes | No (different package) |
Diferenciadores clave
- Industrial temperature range with full Gigabit capability (frente a ADIN1300CCPZ)
- Integrated cable diagnostics vs TI DP83867 (frente a DP83867IRRGZT)
- Deterministic low-latency link training (frente a Generic 1000BASE-T PHY)
Notas de diseño
Place 1 µF and 0.1 µF ceramic decoupling capacitors on every AVDD and DVDD pin, with the 0.1 µF as close as possible to the pin (within 1 mm). Route the MDI_P/MDI_N pairs as 100 Ω differential with ground keepout, length-matched to within 2 mm. Stitch ground vias along the MDI traces every 5 mm to suppress common-mode radiation. According to the ADIN1300 datasheet, the exposed pad (EPAD) must be soldered to a continuous ground plane with at least 9 thermal vias for heat dissipation.
Use a common-mode choke on the MDI lines near the RJ45 jack to improve EMC margin in industrial environments. Select a choke with 100 Ω differential impedance and at least 1 GHz -3 dB bandwidth. For 1000BASE-T operation over Cat5e cable longer than 100 m, ensure the return loss of the MDI trace is below -10 dB up to 100 MHz, per IEEE 802.3 section 40.6. MDI traces should never cross plane splits, and no high-speed digital signals should be routed under the magnetics.
Estimated: at typical 1000BASE-T link with 600 mW dissipation in a 40-LFCSP-WQ (6x6) package on a 4-layer 1 oz copper PCB, the junction-to-ambient thermal resistance is approximately 35 °C/W (Estimated, based on the JEDEC EIA/JESD51 standard test board). With 600 mW dissipation, the junction rise above ambient is approximately 21 °C (Estimated). For ambient operation above 70 °C in a sealed enclosure, add thermal vias under the EPAD and consider forced-air cooling. The ADIN1300 datasheet thermal table should be verified against the final PCB layout.
Do not route the 25 MHz reference clock trace near switching DC-DC converters or MDI lines - this injects jitter into the PHY's timing recovery loop. Power-up sequencing requires AVDD_2P5 to be present before AVDD_1P2; hold RESET_N low until both rails settle for at least 10 ms. The MDIO bus requires a pull-up on the MDIO line per IEEE 802.3 clause 22; missing pull-up causes management register access failures that masquerade as link errors.
For industrial EMC compliance (EN 55032 Class A/B), consider adding a common-mode choke and TVS diode array on the MDI lines. Spread-spectrum clocking is not available on ADIN1300, so the 125 MHz internal clock harmonics may need filtering. Place the RJ45 connector with integrated magnetics close to the PHY (within 25 mm) to minimize EMI loop area. The ADIN1300 datasheet reference design includes a TVS part number recommendation that meets IEC 61000-4-2 air-discharge up to ±15 kV.
Información de cumplimiento
RoHS compliant per Analog Devices product page. Not AEC-Q100 qualified; for automotive applications use ADIN1100 (10BASE-T1L) instead. Industrial -40C to +85C temperature rating per datasheet.
