ATSAM3S2BA-MUR - 64MHz Cortex-M3 MCU 128KB Flash | Microchip
N.º de pieza: ATSAM3S2BA-MUR ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $5.22 | $5,22 |
| 10 | $4.98 | $49,80 |
| 100 | $4.68 | $468,00 |
| 500 | $4.42 | $2.210,00 |
| 1.000 | $4.1 | $4.100,00 |
ATSAM3S2BA-MUR Descripción general
A microcontroller (MCU) is a single-chip integrated circuit that combines a processor core, program memory, data memory, and a rich set of peripherals into one package. Within the embedded-systems hierarchy, the SAM3S sits in the mid-range 32-bit MCU class, positioned above 8-bit PIC and AVR devices and below high-performance Cortex-M4/M7 families, targeting cost-sensitive applications that still require 32-bit compute throughput and USB connectivity.
Key features include the 64 MHz Cortex-M3 core with a 3-stage pipeline and Thumb-2 instruction set, 128 KB of self-programmable Flash with a dedicated flash controller, and an integrated USB 2.0 Full-Speed Device port. The device also integrates a 12-bit ADC with 16 channels, a 2-channel 12-bit DAC, a capacitive-touch support peripheral, PWM channels, USART/SPI/TWI serial interfaces, and an internal 1.8V/3.3V operating regime supplied from 1.62V to 3.6V.
Technically, the SAM3S implements Microchip (Atmel) SMART ARM-based architecture with a multi-layer bus matrix, DMA-capable peripheral event system, and power management controller offering sleep, wait, and backup modes with low quiescent consumption for battery-powered designs. The exposed-pad QFN package improves thermal dissipation and ground return paths for mixed-signal performance.
Typical applications include industrial control panels, consumer appliances, USB-connected sensors and dataloggers, and battery-powered metering products where the combination of Cortex-M3 performance, USB device connectivity, and integrated analog reduces total bill-of-materials cost.
For design, plan the VDDCORE/VDDIO decoupling network per the manufacturer datasheet and use the exposed pad as the main ground connection; flash wait-state configuration relative to the 64 MHz clock also affects efficiency.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not consolidated in the manufacturer datasheet.
Alternativas directas para ATSAM3S2BA-MUR — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con ATSAM3S2BA-MUR (mismo factor de forma y huella) — difiere en RoHS Status, Package, Flash Memory, Packaging, Peripherals.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
ATSAM3S4BA-MUR
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
Consulte el precio
Ver hoja de datos →ATSAM3S1BA-MUR
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$3.35 / unidad
Ver hoja de datos →ATSAM3S2AA-MUR
✅ Sustitución directa✓ En stock
$3.49 / unidad
Ver hoja de datos →ATSAM3N4BA-MU
✅ Sustitución directa✓ En stock
$3.48 / unidad
Ver hoja de datos →ATSAM3S2BA-AU
✅ Sustitución directa✓ En stock
$4.66 / unidad
Ver hoja de datos →ATSAM3S2BA-MUR Valores máximos y características eléctricas
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| Frecuencia de reloj máxima | 64 MHz |
| Flash Memory | 128 KB (128K x 8) |
| Supply Voltage Range | 1.62 V to 3.6 V (1.8V/3.3V operation) |
| Encapsulado | 64-QFN (9x9 mm) with Exposed Pad |
| Número de pines | 64 |
| USB | USB 2.0 Full-Speed Device |
| ADC Resolution | 12-bit |
| DAC Resolution | 12-bit |
| Temperatura de funcionamiento | -40C to +85C (Industrial) |
| Tipo de montaje | Surface Mount |
| Series | SAM3S |
| Peripherals | DMA, PWM, WDT, Capacitive Touch |
| Communication Interfaces | USART, SPI, TWI (I2C), USB |
| Estado RoHS | Compliant (Green package per Mouser listing) |
Guía de configuración de pines de ATSAM3S2BA-MUR 64-qfn (9x9 mm) with exposed pad
Configuración de pines para ATSAM3S2BA-MUR (encapsulado 64-qfn (9x9 mm) with exposed pad). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para ATSAM3S2BA-MUR.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
ATSAM3S2BA-MUR es adecuado para 6 aplicacións: Industrial Control Panels, USB Sensors and Dataloggers, Battery-Powered Metering, Consumer Appliances, Medical Monitoring Devices, Capacitive Touch Human Interfaces.
Industrial Control Panels
The ATSAM3S2BA-MUR fits industrial control and HMI panel designs because its 64 MHz Cortex-M3 core delivers deterministic interrupt handling for real-time I/O scanning, while 128 KB Flash accommodates protocol stacks such as Modbus and firmware update code. The 12-bit ADC with 16 channels reads analog sensor inputs directly, and the capacitive-touch support enables modern buttonless front panels without dedicated touch controllers. Multiple USART, SPI, and TWI ports link the MCU to PLC expansion modules, displays, and actuators. Industrial -40C to +85C rating matches panel environments, and DMA channels offload serial transfers to keep CPU load low.
Recomendado
USB Sensors and Dataloggers
The integrated USB 2.0 Full-Speed Device controller makes the ATSAM3S2BA-MUR a strong fit for USB-connected sensors and data loggers, since it removes the need for a separate USB interface chip and implements vendor-class or CDC-ACM virtual COM enumeration using the on-chip SAM-BA ROM bootloader for field firmware updates. The 12-bit ADC samples sensor channels at up to 2 Msps-class rates with DMA into 32 KB SRAM buffering, while low-power Wait modes conserve energy when running from an internal battery between USB sessions. Supply range of 1.62V to 3.6V supports bus-powered or battery-powered topologies.
Recomendado
Battery-Powered Metering
Smart meters and sub-metering products benefit from the ATSAM3S2BA-MUR's combination of low-power operating modes and measurement peripherals. The power management controller provides Sleep, Wait, and Backup modes that cut average current to microamp levels between measurement intervals, critical for ten-year battery-life targets. The 12-bit ADC with 16 channels samples current and voltage channels, and RTC/RTT timers maintain timekeeping in Backup mode. The 64-pin QFN footprint integrates enough GPIO for LCD driver expansion and communication ports for RS-485 (USART) or IR interfaces, all within a single 3.3V rail.
Recomendado
Consumer Appliances
White goods, small appliances, and climate-control products use the ATSAM3S2BA-MUR for motor control and user interface consolidation. PWM channels drive BLDC or brushed motor drivers, while the 12-bit ADC reads temperature sensors (NTC) and user controls, and the capacitive-touch capability implements sleek glass-panel interfaces without mechanical buttons. The 64 MHz Cortex-M3 handles control loops and UI rendering concurrently, and RoHS-compliant green packaging meets consumer environmental requirements. The 9x9 mm QFN exposed-pad package provides the thermal path needed near motor driver circuitry at moderate dissipation.
Recomendado
Medical Monitoring Devices
Portable medical monitors such as pulse oximeters, blood-pressure units, and vitals dataloggers leverage the ATSAM3S2BA-MUR's low-noise 12-bit ADC and low-power profile. Battery operation from a 3.3V rail with Sleep/Wait modes extends usage between charges, while the USB Full-Speed Device port transfers recorded sessions to clinic PCs without proprietary cables. The Cortex-M3 core executes digital filtering and baseline algorithms on sampled data, and 128 KB Flash stores calibration tables plus logging firmware. The industrial temperature range and RoHS compliance align with typical medical-device component requirements for -40C to +85C transport environments.
Recomendado
Capacitive Touch Human Interfaces
The ATSAM3S2BA-MUR integrates Microchip's peripheral touch controller support, enabling capacitive buttons, sliders, and wheels directly on the MCU using only PCB copper electrodes, which eliminates dedicated touch ICs and lowers BOM cost. Designers implement touch channels on the 16 ADC channels while simultaneously running display serial interfaces and motor or relay outputs on PWM/GPIO. Microchip's QTouch library provides auto-tuning against humidity and temperature drift, and 128 KB Flash holds both the touch tuning tables and the application. The 3.3V operation and 64-QFN package with exposed pad improve sensing stability via a low-impedance ground.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para ATSAM3S2BA-MUR — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | ATSAM3S4BA-MUR | ATSAM3S1BA-MUR | ATSAM3N4BA-MU | ATSAM3S2BA-AU |
|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) EP | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | LQFP64 - different package (die-equivalent) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Speed | Cortex-M3, 64 MHz | Cortex-M3, 64 MHz | Cortex-M3, 64 MHz | Cortex-M3, 64 MHz | Cortex-M3, 64 MHz |
| Flash Memory | 128 KB | 256 KB | 64 KB | 128 KB | 128 KB |
| USB Device | Yes (Full-Speed) | Yes (Full-Speed) | Yes (Full-Speed) | No | Yes (Full-Speed) |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Diferenciadores clave
- Integrated USB Full-Speed Device controller (frente a ATSAM3N4BA-MU)
- Balanced 128 KB Flash density (frente a ATSAM3S4BA-MUR)
- Full analog integration (frente a ATSAM3S1BA-MUR)
Notas de diseño
The 64-QFN (9x9 mm) exposed pad is the primary ground and thermal connection. Create a solder-mask-defined landing pad on the PCB with a via array (5x5 minimum, 0.3 mm vias) under the exposed pad to tie it to internal ground planes; this minimizes ground bounce for the 12-bit ADC and improves EMI. Follow the Microchip SAM3S hardware design application note for pad geometry and stencil aperture recommendations (typically 50-70% coverage).
The SAM3S integrates an internal regulator generating VDDCORE from the main supply; per the datasheet, decouple VDDCORE, VDDIO, VDDIN, and VDDUSB each with 100 nF ceramics placed within 2 mm of the pins, plus bulk capacitance per power domain. Because the device operates down to 1.62V, ensure the 3.3V rail stays above 1.9V under brownout to keep the internal regulator in specification, or configure the supply-monitor/brownout detector accordingly.
Flash wait states must be configured for the selected clock frequency; running the core at 64 MHz with incorrect flash wait states causes hard faults during code execution. Also, when using the USB Full-Speed port, the 480 MHz-class internal PLL must be configured to the exact 48 MHz USB clock requirement - use the PMC USB clock divider, not a fractional approximation. Finally, the SAM-BA bootloader only activates if the GPNVM boot-bit configuration allows it; erase-all can restore it if locked out.
Estimated: at 64 MHz active mode the SAM3S dissipates on the order of 100 mW (typical core current in the tens of mA at 3.3 V). With the exposed pad well soldered, junction rise is negligible (<5C) and no heatsinking is required. Concern only arises if high GPIO drive loads or external circuitry pull large currents through the package; in that case compute P_total = VDD x I_total and verify against theta_JA from the manufacturer datasheet.
Información de cumplimiento
RoHS-compliant green QFN package per Mouser listing (QFN GREEN IND TEMP). REACH, halogen-free, and conflict-minerals status to be confirmed against Microchip material declarations.
