ATSAM4S2CA-CFU - 120MHz Cortex-M4 MCU 128KB Flash | Microchip
N.º de pieza: ATSAM4S2CA-CFU ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $5.16 | $5,16 |
| 10 | $4.66 | $46,60 |
| 100 | $4.18 | $418,00 |
| 500 | $3.76 | $1.880,00 |
| 1.000 | $3.38 | $3.380,00 |
ATSAM4S2CA-CFU Descripción general
A microcontroller unit (MCU) integrates a processor core, memory, and peripherals on a single chip, forming the compute layer of embedded systems. Within the hierarchy, the SAM4S sits in the 32-bit ARM-based MCU family, above 8-bit MCUs like the PIC16 series and below high-end application processors. The ARM Cortex-M4 core adds a hardware FPU, DSP instructions, and the Thumb-2 instruction set, while the integrated Memory Protection Unit (MPU) supports robust, fault-isolated firmware architectures.
Key features of the ATSAM4S2CA-CFU include the 120 MHz Cortex-M4 with DSP extensions for real-time signal processing, 128 KB Flash with ECC (error-correcting code), Security Bit and Lock Bits for code protection, and industrial temperature operation (-40C to +85C), matching the GREEN IND TEMP MRL A classification listed by Mouser.
Architecturally, the device combines the Cortex-M4 pipeline with a multi-layer bus matrix, enabling parallel access to Flash, SRAM, and peripherals. Flash ECC improves reliability in safety-conscious and high-vibration environments. The 100-ball VFBGA footprint with a 0.8 mm ball pitch saves board area versus 100-pin LQFP equivalents, at the cost of more demanding PCB assembly (BGA reflow and X-ray inspection).
Typical applications include industrial control and automation nodes, consumer and portable devices, motor control and power conversion, and IoT gateways where DSP instruction throughput accelerates filtering and FFT workloads.
Design consideration: BGA packages require careful PCB fanout, controlled soldering profiles, and cannot be hand-reworked easily; confirm your assembly capability before committing to the -CFU VFBGA variant over the pin-compatible LQFP (-AU) versions.
This page synthesizes distributor pricing from Mouser, DigiKey, LCSC and Heisener, drop-in migration options within the Microchip SAM portfolio, and practical design notes not found in the manufacturer datasheet. Pricing references are as of 2026-09-20.
Alternativas directas para ATSAM4S2CA-CFU — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con ATSAM4S2CA-CFU (mismo factor de forma y huella) — difiere en RoHS Status, Core Processor, Core Size, Maximum Clock Frequency, Mounting Type.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
ATSAM4S4CA-CFU
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$3.2 / unidad
Ver hoja de datos →ATSAM4S8CA-CFU
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$5.2 / unidad
Ver hoja de datos →ATSAM4N16CA-CFUR
✅ Sustitución directa✓ En stock
$4.95 / unidad
Ver hoja de datos →ATSAM3S8BA-MUR
✅ Sustitución directa✓ En stock
$5.15 / unidad
Ver hoja de datos →ATSAM3N4BA-MU
✅ Sustitución directa✓ En stock
$3.48 / unidad
Ver hoja de datos →ATSAM4S2CA-CFU Valores máximos y características eléctricas
| Core Processor | ARM Cortex-M4 |
| Core Size | 32-bit |
| Frecuencia de reloj máxima | 120 MHz |
| Flash Memory | 128 KB (128K x 8) |
| SRAM | 64 KB |
| Instruction Set | Thumb-2 |
| DSP Instructions | Yes |
| Memory Protection Unit | Yes (MPU) |
| Flash ECC | Yes (error-correcting code) |
| Security Features | Security Bit, Lock Bits |
| Supply Voltage (Core) | 1.2 V |
| Supply Voltage (I/O) | 3.3 V |
| Temperatura de funcionamiento | -40C to +85C (Industrial) |
| Encapsulado | 100-VFBGA (7x7 mm) |
| Tipo de montaje | Surface Mount |
| Series | SAM4S |
| Pin-to-Pin Compatible Families | SAM4N, SAM3S, SAM3N, SAM7S |
Guía de configuración de pines de ATSAM4S2CA-CFU 100-vfbga (7x7 mm)
Configuración de pines para ATSAM4S2CA-CFU (encapsulado 100-vfbga (7x7 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para ATSAM4S2CA-CFU.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
ATSAM4S2CA-CFU es adecuado para 6 aplicacións: Industrial Control and Automation, Motor Control and Power Conversion, Portable and Consumer Devices, IoT Nodes and Gateways, Test and Measurement Instrumentation, Security-Conscious Embedded Systems.
Industrial Control and Automation
The ATSAM4S2CA-CFU fits industrial control nodes where deterministic 120 MHz Cortex-M4 processing, Flash ECC, and -40C to +85C industrial temperature rating are required. The MPU enables fault-isolated firmware partitions, while DSP instructions accelerate PID filtering and sensor-fusion math in PLC I/O modules and motor controllers. Its 3.3 V I/O rail interfaces directly with standard industrial logic levels. Unlike LQFP alternatives, the 7x7 mm VFBGA frees board area for isolation circuitry and connectors; in return it demands reflow assembly and X-ray inspection on the production line.
Recomendado
Motor Control and Power Conversion
In motor drives and digital power converters, the ATSAM4S2CA-CFU's 120 MHz Cortex-M4 with single-cycle MAC and DSP instructions executes field-oriented control (FOC) transforms and current-loop filters within PWM periods. Flash ECC maintains code integrity against switching noise, and the 3.3 V I/O connects to gate-driver and current-sense front ends. The VFBGA-100 package shortens critical traces between MCU and power stage on dense boards. Designers should budget for the ADC and PWM peripheral configuration per the SAM4S datasheet and verify thermal performance under sustained full-load operation.
Recomendado
Portable and Consumer Devices
The 7x7 mm, 100-ball VFBGA package makes the ATSAM4S2CA-CFU attractive for handheld and battery-powered consumer products where every square millimeter counts. At 1.2 V core and 3.3 V I/O, the SAM4S supports low-power modes for battery budgets while delivering 120 MHz throughput for UI, sensing, and connectivity tasks. Thumb-2 code density keeps the 128 KB Flash footprint small. Compared with LQFP-packaged SAM4S siblings, the BGA shrinks the MCU land pattern by roughly two-thirds, at the cost of requiring professional reflow assembly rather than hand soldering during prototyping.
Recomendado
IoT Nodes and Gateways
For IoT sensor nodes and edge gateways, the ATSAM4S2CA-CFU combines DSP-accelerated preprocessing (FFT, filtering) with enough Flash for communication stacks. The 128 KB Flash with ECC suits firmware-over-the-air update schemes in combination with external storage, or designers can drop in the footprint-identical 256/512 KB SAM4S siblings for dual-bank OTA. The industrial temperature range and RoHS-green packaging support both indoor and harsh-environment deployments. SEGGER J-Link tooling support (per SEGGER's supported-device list) simplifies production programming and in-field diagnostics through the SWD interface.
Recomendado
Test and Measurement Instrumentation
Bench instruments, data-acquisition modules, and sensor front ends benefit from the ATSAM4S2CA-CFU's deterministic Cortex-M4 execution and DSP instructions for calibration math, digital filtering, and protocol handling. The MPU allows isolation of measurement-critical code from communication stacks, improving robustness in long-running instruments. The VFBGA-100 footprint concentrates digital control on compact mixed-signal boards, keeping analog sections clear. Flash ECC protects stored calibration constants against bit rot over product lifetime. Confirm ADC specifications against the SAM4S family datasheet when defining measurement resolution and sampling plans.
Recomendado
Security-Conscious Embedded Systems
The ATSAM4S2CA-CFU addresses IP protection and basic security requirements through Flash Security Bit and Lock Bits, which block external debug and readout of protected code - valuable in products where firmware embodies competitive advantage. Flash ECC and the MPU add defensive layers against corruption and privilege-escalation faults. The industrial temperature range supports access-control, payment-terminal, and surveillance hardware. When a design later needs more code space for cryptographic stacks, the pin-to-pin 256 KB and 512 KB SAM4S VFBGA variants migrate onto the identical PCB without respin.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para ATSAM4S2CA-CFU — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | ATSAM4S4CA-CFU | ATSAM4S8CA-CFU | ATSAM4N16CA-CFUR | ATSAM3S8BA-MUR | ATSAM3N4BA-MU |
|---|---|---|---|---|---|---|
| Package | 100-VFBGA (7x7 mm) | 100-VFBGA (7x7) - same | 100-VFBGA (7x7) - same | 100-VFBGA (7x7) - same | 100-VFBGA (7x7) - same | 100-VFBGA (7x7) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M4 (DSP) | ARM Cortex-M4 (DSP) | ARM Cortex-M4 (DSP) | ARM Cortex-M4 (no DSP/FPU) | ARM Cortex-M3 | ARM Cortex-M3 |
| Max Clock Frequency | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash Memory | 128 KB | 256 KB | 512 KB | 1024 KB | 512 KB | 256 KB |
| Drop-in Compatibility | Reference | Pin-to-pin, same footprint | Pin-to-pin, same footprint | Pin-to-pin (SAM4S/SAM4N cross-family) | Pin-to-pin (SAM4S/SAM3S cross-family) | Pin-to-pin (SAM4S/SAM3N cross-family) |
| Firmware Migration Effort | Reference | Minimal (same family) | Minimal (same family) | Moderate (remove DSP intrinsics) | Moderate (Cortex-M3 retarget) | Moderate (Cortex-M3 retarget) |
Diferenciadores clave
- Cortex-M4 with DSP instructions in a 7x7 mm BGA (frente a ATSAM3S8BA-MUR)
- Flash ECC for code integrity (frente a ATSAM3N4BA-MU)
- Lowest-cost entry point of the VFBGA-100 SAM4S family (frente a ATSAM4S4CA-CFU)
Notas de diseño
The 100-ball VFBGA (7x7 mm, 0.8 mm pitch) requires fanout planning before routing: use via-in-pad or dog-bone fanout on inner ball rows, and reserve at least one internal layer as a solid ground plane referenced by every ball. Bring SWDIO, SWCLK, and RESET to test pads or a header - BGA balls are inaccessible after reflow, and per SEGGER's supported-device documentation the ATSAM4S2CA is J-Link debuggable only via these exposed signals. Confirm your CM can run BGA reflow profiles and X-ray or acoustic inspection before selecting the -CFU over LQFP SAM4S variants.
The SAM4S uses a 1.2 V core rail (via the internal regulator or external supply per configuration) and 3.3 V I/O rail; per the SAM4S family datasheet, decouple each supply ball with 100 nF ceramic capacitors placed within 2 mm of the ball, plus bulk 10 uF near the device. Ensure the 3.3 V rail ramps monotonically and observe the datasheet power-sequencing guidance between VDDCORE and VDDIO to avoid latch-up during brown-out. Estimated: at 120 MHz typical core operation, budget a few tens of mA for the core plus I/O current per pin load (calculated from datasheet typical figures; verify against the electrical characteristics table for your clock configuration).
Do not confuse package suffixes: ATSAM4S2CA-CFU is VFBGA-100 while ATSAM4S2CA-AU is LQFP-100 - they share a die but NOT a footprint and are not interchangeable on one PCB. When migrating across the SAM4S/SAM3S/SAM3N pin-compatible families cited in the Microchip datasheet, note that SAM3N/SAM3S lack the Cortex-M4 DSP instructions and FPU, so DSP-intrinsic code will not compile. Also verify the SAM4S datasheet clock-tree configuration: running the core at 120 MHz requires the correct PLL multiplier settings and Flash wait states; incorrect wait states cause hard faults.
Información de cumplimiento
Mouser lists the part as GREEN IND TEMP MRL A, indicating Microchip green (RoHS-compliant, lead-free) packaging with industrial temperature rating. REACH, halogen-free, and conflict-minerals status should be confirmed on the official Microchip compliance documentation.