ATSAMD21G16L-MNT - 48MHz Cortex-M0+ MCU 64KB Flash | Microchip
N.º de pieza: ATSAMD21G16L-MNT ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $2.55 | $2,55 |
| 10 | $2.35 | $23,50 |
| 25 | $2.33 | $58,25 |
| 100 | $2.11 | $211,00 |
| 1.000 | $1.97 | $1.970,00 |
| 4.000 | $1.85 | $7.400,00 |
ATSAMD21G16L-MNT Descripción general
A microcontroller (MCU) is a single-chip computer that integrates a processor core, program and data memory, peripherals, and I/O into one package. The Cortex-M0+ is ARM's smallest and most energy-efficient core, optimized for deterministic real-time control in cost- and power-sensitive embedded systems. The SAMD21 family sits in Microchip's mainstream 32-bit MCU portfolio, bridging 8-bit AVR and higher-performance Cortex-M4 parts.
Key features include the Cortex-M0+ core with single-cycle I/O access, full-speed USB 2.0 device/host, up to six SERCOM serial interfaces (configurable as UART, SPI, or I²C), a 12-channel DMA controller and 12-channel Event System for low-overhead peripheral chaining. The device integrates a 12-bit ADC, 10-bit DAC, and analog comparators, plus two-pin Serial Wire Debug (SWD).
Architecturally, the SAMD21G16L uses a pipelined Cortex-M0+ with single-cycle multiplier and a low-power peripheral event system that allows peripherals to communicate without CPU wakeup, enabling SleepWalking and aggressive standby currents in the microamp range. The 64 KB Flash supports in-application programming and is ECC-protected on critical ranges.
Typical applications include LED lighting and horticulture drivers, low-end BLDC motor control, industrial sensor hubs, USB HID peripherals, and battery-powered IoT endpoints. The combination of USB device/host, ample SRAM, and 38 GPIOs makes it a strong fit for Human Interface Devices (HID), wearables, and connected sensor nodes.
Designers should pay attention to the 48-QFN exposed pad, which must be soldered to a sufficient ground copper pour for thermal dissipation and signal return, and should follow Microchip's SAMD21 schematic checklist for decoupling, SWD pull-ups, and crystal load capacitor selection.
This page consolidates distributor pricing, same-package drop-in alternatives, and practical design notes that supplement the manufacturer datasheet for engineers evaluating the ATSAMD21G16L-MNT.
Alternativas directas para ATSAMD21G16L-MNT — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con ATSAMD21G16L-MNT (mismo factor de forma y huella) — difiere en ADC, Package, DAC, Operating Temperature, SRAM.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
ATSAMD21G17L-MNT
✅ Sustitución directa✓ En stock
$1.45 / unidad
Ver hoja de datos →ATSAMD21G18A-MU
✅ Sustitución directa✓ En stock
$3.15 / unidad
Ver hoja de datos →ATSAMD21G16B-MUT
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$2.05 / unidad
Ver hoja de datos →ATSAMD20G18A-MU
✅ Sustitución directa✓ En stock
$3.51 / unidad
Ver hoja de datos →ATSAMD20G16B-MU
✅ Sustitución directa✓ En stock
$1.92 / unidad
Ver hoja de datos →ATSAMD21G16L-MNT Valores máximos y características eléctricas
| Core Architecture | ARM Cortex-M0+ (32-bit) |
| Family | SAM D21G (Functional Safety / FuSa) |
| Maximum CPU Frequency | 48 MHz |
| Flash Memory | 64 KB (64K x 8) |
| SRAM | 8 KB |
| Supply Voltage (VDD) | 1.6 V to 3.6 V |
| Temperatura de funcionamiento | -40 °C to +105 °C |
| Encapsulado | 48-QFN (7x7 mm) with exposed pad |
| Tipo de montaje | Surface Mount |
| Nivel MSL | 3 |
| GPIOs | Up to 38 |
| Communication Interfaces | Up to 6x SERCOM (UART/SPI/I²C), I²S, USB 2.0 FS Device/Host |
| ADC | 12-bit, up to 14 channels |
| DAC | 10-bit, 1 channel |
| Debug Interface | Serial Wire Debug (SWD), 2-pin |
| DMA | 12-channel DMAC + 12-channel Event System |
| Estado RoHS | Compliant |
Guía de configuración de pines de ATSAMD21G16L-MNT 48-qfn (7x7 mm) with exposed pad
Configuración de pines para ATSAMD21G16L-MNT (encapsulado 48-qfn (7x7 mm) with exposed pad). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para ATSAMD21G16L-MNT.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
ATSAMD21G16L-MNT es adecuado para 7 aplicacións: Industrial LED Lighting Drivers, BLDC Motor Control (Small Fans / Pumps), USB HID Peripherals (Keyboards / Custom HID), Battery-Powered IoT Sensor Hubs, Industrial Sensor Hubs and Field I/O, Wearable Fitness and Health Devices, Smart Home Bridges and Zigbee/BLE Edge Nodes.
Industrial LED Lighting Drivers
The ATSAMD21G16L-MNT fits LED lighting drivers because its 48 MHz Cortex-M0+ delivers enough headroom for multi-channel PWM dimming while the six SERCOM channels drive DMX, DALI, or 0-10 V analog interfaces. With 64 KB Flash and 8 KB SRAM, the MCU can host both a dimming control loop and a wireless BLE bridge firmware image. The 1.6–3.6 V supply range accepts direct power from offline LED driver aux rails, and the +105 °C operating range survives enclosed fixture thermal stress.
Recomendado
BLDC Motor Control (Small Fans / Pumps)
For low-power 3-phase BLDC fans and pumps, the ATSAMD21G16L-MNT pairs the Cortex-M0+ with a 12-bit ADC and 12-channel DMA to run sensorless or Hall-sensor commutation loops at up to several kW. The 48 MHz clock sustains 10–20 kHz PWM with centre-aligned mode for low acoustic noise, while the Event System triggers ADC sampling from timer compare events without CPU wakeup. The 48-QFN exposed pad dissipates the ~150 mW dissipation typical at 3.3 V/48 MHz without a heatsink.
Recomendado
USB HID Peripherals (Keyboards / Custom HID)
The ATSAMD21G16L-MNT integrates full-speed USB 2.0 device/host with on-chip transceiver, eliminating external PHY cost for USB HID keyboards, mice, custom interface devices, and game controllers. The 64 KB Flash comfortably holds the USB stack (TinyUSB or ASF) plus HID report descriptors and a small user-configurable firmware overlay. The +105 °C rating supports sealed industrial input devices and outdoor RFID readers.
Recomendado
Battery-Powered IoT Sensor Hubs
The ATSAMD21G16L-MNT's SleepWalking peripherals let the Event System wake DMA and ADC without CPU intervention, dropping average current into the microamp range and enabling multi-year coin-cell operation for IoT sensor nodes. Six SERCOMs cover SPI sensor, I²C sensor, and UART modem connections concurrently, while the 8 KB SRAM buffers data before a BLE/NB-IoT transmit burst. The wide 1.6–3.6 V supply range accepts direct Li-coin or 2xAA power.
Recomendado
Industrial Sensor Hubs and Field I/O
With 38 GPIOs, six SERCOM channels, and a 12-bit ADC with up to 14 channels, the ATSAMD21G16L-MNT acts as a sensor aggregation node for industrial field I/O: reading 4–20 mA loops, RS-485 buses, and digital inputs simultaneously. The +105 °C junction range and 1.6–3.6 V supply suit sealed IP67 enclosures on factory floors. The 64 KB Flash holds Modbus RTU or IO-Link device stacks plus a small safety diagnostics layer.
Recomendado
Wearable Fitness and Health Devices
The 48-QFN 7x7 mm package and 1.6–3.6 V supply make the ATSAMD21G16L-MNT a fit for wearable fitness bands where PCB area is at a premium and a single Li-ion cell powers the system. The Cortex-M0+ executes heart-rate and step-count algorithms while the 12-bit ADC samples PPG and ECG channels, all from 8 KB SRAM. SleepWalking peripherals enable always-on optical heart-rate sensing at average currents under 200 µA.
Recomendado
Smart Home Bridges and Zigbee/BLE Edge Nodes
For smart-home bridges, the ATSAMD21G16L-MNT serves as a host MCU for BLE or Zigbee modules, exposing control to Wi-Fi co-processors over UART or SPI. The six SERCOMs permit concurrent Wi-Fi SPI, BLE UART, and a local I²C user interface. With 64 KB Flash, the MCU can host a small MQTT-SN bridge or Matter fabric client for protocol translation in Matter-over-Thread or BLE mesh networks.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para ATSAMD21G16L-MNT — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | ATSAMD21G17L-MNT | ATSAMD21G18A-MU | ATSAMD21G16B-MUT | ATSAMD20G18A-MU | ATSAMD20G16B-MU |
|---|---|---|---|---|---|---|
| Package | 48-QFN (7x7) | 48-QFN (7x7) - same | 48-QFN (7x7) - same | 48-QFN (7x7) - same | 48-QFN (7x7) - same | 48-QFN (7x7) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | Cortex-M0+ 48 MHz | Cortex-M0+ 48 MHz | Cortex-M0+ 48 MHz | Cortex-M0+ 48 MHz | Cortex-M0+ 48 MHz | Cortex-M0+ 48 MHz |
| Flash | 64 KB | 128 KB (+100%) | 256 KB (+300%) | 64 KB (same) | 256 KB (+300%) | 64 KB (same) |
| SRAM | 8 KB | 16 KB | 32 KB | 8 KB | 32 KB | 8 KB |
| USB | USB 2.0 FS Device/Host | USB 2.0 FS Device/Host | USB 2.0 FS Device/Host | USB 2.0 FS Device/Host | No USB | No USB |
| Operating Voltage | 1.6 V to 3.6 V | 1.6 V to 3.6 V | 1.6 V to 3.6 V | 1.6 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Operating Temperature | -40 °C to +105 °C | -40 °C to +105 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C |
Diferenciadores clave
- Integrated full-speed USB 2.0 device/host on-chip (frente a ATSAMD20G16B-MU)
- Event System and SleepWalking peripherals for low-power designs (frente a ATSAMD20G16B-MU)
- Industrial +105 °C operating temperature range (frente a ATSAMD21G18A-MU)
Notas de diseño
Estimated: at 3.3 V supply and 48 MHz active CPU with all peripherals enabled, the SAMD21G16L draws roughly 7–9 mA (~25–30 mW). The 48-QFN (7x7) with exposed pad has θJA around 30–35 C/W on a 4-layer 1-oz PCB with 1 sq inch thermal copper pour, giving a ~1 °C rise — well within budget. Without the exposed pad soldered to the ground copper pour, junction temperature can climb by 20–40 °C, so always flood the bottom-side ground plane under the EP and stitch with multiple thermal vias.
Place the 1 µF and 100 nF decoupling capacitors as close as possible to each VDD/VDDIO pin pair, with the 100 nF cap closest to the MCU. The exposed pad must be soldered to a continuous ground plane and stitched with at least 9 thermal vias for proper thermal and electrical return. The D+ and D+USB lines require 90 Ω differential impedance and should not be routed near switching rails; place the USB ESD array (e.g. USBLC6-2SC6) within 5 mm of the connector. Source: SAM D21/DA1 datasheet, PCB layout checklist section.
Common pitfalls when designing with the SAMD21G16L include: (1) leaving the SWD pins floating — Microchip recommends 100 kΩ pull-ups on SWDIO and SWCLK; (2) failing to populate the NRST pull-up (10 kΩ to VDDIO) which can cause spurious resets; (3) omitting the 32.768 kHz crystal load capacitors, which breaks RTC accuracy and SleepWalking timing; (4) programming Flash below 1.62 V which triggers ECC errors. Always review the SAMD21 silicon errata (DS80000760) before sign-off, as some revisions require firmware workarounds for the ADC and SERCOM.
Información de cumplimiento
RoHS and REACH compliance per Microchip product page (microchip.com/en-us/product/ATSAMD21G16L). Not AEC-Q100 qualified — for automotive use, consider ATSAMx21E/SAMx21G with -AEC suffix variants.
