ATXMEGA32C3-MH - 32KB Flash 32MHz 8/16-bit AVR XMEGA MCU | Microchip
N.º de pieza: ATXMEGA32C3-MH ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $3.86 | $3,86 |
| 10 | $3.45 | $34,50 |
| 100 | $3.02 | $302,00 |
| 500 | $2.68 | $1.340,00 |
| 1.000 | $2.41 | $2.410,00 |
ATXMEGA32C3-MH Descripción general
An 8/16-bit microcontroller (MCU) is a single-chip computer built around an 8- or 16-bit data path that integrates a CPU core, non-volatile Flash program memory, volatile SRAM data memory, EEPROM for parameter storage, plus a rich set of on-chip peripherals (timers, ADC/DAC, communication controllers, GPIO). The ATXMEGA32C3 belongs to the XMEGA family in the broader hierarchy: 8/16-bit MCU -> microcontroller -> embedded processor -> semiconductor. It uses the AVR RISC instruction set with hardware multiplier, executes most instructions in a single clock cycle, and is targeted at industrial-grade, low-power embedded designs that need deterministic real-time response.
Key features of the ATXMEGA32C3-MH include four flexible 16-bit Timer/Counter modules, a 12-channel event system, a four-channel DMA controller that moves data without CPU intervention, a 12-bit ADC and 12-bit DAC, USB device support, AES/DES crypto acceleration, and an operating voltage range of 1.6 V to 3.6 V. Its 32 MHz core delivers up to 32 MIPS of throughput, and the integrated PicoPower technology reduces active and sleep-mode current.
Architecturally, the device pairs an event-driven peripheral fabric with the DMA controller, allowing analog conversion, packet transmission, and timer capture to run autonomously while the CPU sleeps. This architecture is well-suited to deterministic, low-latency control applications such as sensor hubs, motor control, and human-interface subsystems.
Typical applications include industrial sensor interfaces, USB-enabled consumer devices, building automation controllers, smart-metering subsystems, and human-machine interface (HMI) panels. The wide 1.6V-3.6V supply range also allows direct battery operation.
When designing with this device, ensure the 64-pin VQFN exposed pad is soldered to a sufficient ground copper pour for thermal and electrical performance. Decouple VDD with at least one 100 nF ceramic capacitor per supply pin placed as close as possible to the package.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a single reference for engineers evaluating the ATXMEGA32C3-MH for new designs.
Alternativas directas para ATXMEGA32C3-MH — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con ATXMEGA32C3-MH (mismo factor de forma y huella) — difiere en Package, ADC, SRAM, DAC, EEPROM.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
ATXMEGA32C3-MHR
✅ Sustitución directa✓ En stock
$3.9 / unidad
Ver hoja de datos →ATXMEGA64C3-MH
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$3.96 / unidad
Ver hoja de datos →ATXMEGA128C3-MH
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
ATXMEGA256C3-MH
✅ Sustitución directa✓ En stock
$4.68 / unidad
Ver hoja de datos →ATXMEGA128D4-MH
✅ Sustitución directa✓ En stock
$3.72 / unidad
Ver hoja de datos →ATXMEGA16D4-MH
✅ Sustitución directa✓ En stock
$2.62 / unidad
Ver hoja de datos →ATXMEGA32C3-MH Valores máximos y características eléctricas
| Core Architecture | AVR XMEGA (8/16-bit RISC) |
| Family | AVR XMEGA C3 |
| Maximum CPU Speed | 32 MHz |
| Program Memory (Flash) | 32 KB (16K x 16) |
| Boot Code Section | 8 KB |
| EEPROM | 2 KB |
| SRAM | 4 KB |
| Operating Voltage | 1.6 V to 3.6 V |
| Supply Voltage (Typ.) | 3.3 V |
| Encapsulado | 64-pin VQFN (9x9 mm) with exposed pad |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | -40C to +85C (Industrial) |
| ADC | 12-bit |
| DAC | 12-bit |
| USB | USB Device (Full-Speed) |
| DMA Channels | 4 |
| Event System Channels | 12 |
| Crypto Engine | AES / DES |
| Estado RoHS | Compliant |
| Lead-Free | Yes |
Configuración de pines de ATXMEGA32C3-MH
| Pin 1 | VCC — Supply voltage |
| Pin 2 | GND — Ground |
| Pin 3 | PA0 — GPIO Port A bit 0 |
| Pin 4 | PA1 — GPIO Port A bit 1 |
| Pin 5 | PA2 — GPIO Port A bit 2 |
| Pin 6 | PA3 — GPIO Port A bit 3 |
| Pin 7 | PA4 — GPIO Port A bit 4 |
| Pin 8 | PA5 — GPIO Port A bit 5 |
| Pin 9 | PA6 — GPIO Port A bit 6 |
| Pin 10 | PA7 — GPIO Port A bit 7 |
| Pin 11 | PB0 — GPIO Port B bit 0 |
| Pin 12 | PB1 — GPIO Port B bit 1 |
| Pin 13 | PB2 — GPIO Port B bit 2 |
| Pin 14 | PB3 — GPIO Port B bit 3 |
| Pin 15 | VCC — Supply voltage (second pin) |
| Pin 16 | GND — Ground (second pin) |
| Pin 17 | PB4 — GPIO Port B bit 4 |
| Pin 18 | PB5 — GPIO Port B bit 5 |
| Pin 19 | PB6 — GPIO Port B bit 6 |
| Pin 20 | PB7 — GPIO Port B bit 7 |
| Pin 21 | PC0 — GPIO Port C bit 0 |
| Pin 22 | PC1 — GPIO Port C bit 1 |
| Pin 23 | PC2 — GPIO Port C bit 2 |
| Pin 24 | PC3 — GPIO Port C bit 3 |
| Pin 25 | PC4 — GPIO Port C bit 4 |
| Pin 26 | PC5 — GPIO Port C bit 5 |
| Pin 27 | PC6 — GPIO Port C bit 6 |
| Pin 28 | PC7 — GPIO Port C bit 7 |
| Pin 29 | PD0 — GPIO Port D bit 0 |
| Pin 30 | PD1 — GPIO Port D bit 1 |
| Pin 31 | PD2 — GPIO Port D bit 2 |
| Pin 32 | PD3 — GPIO Port D bit 3 |
| Pin 33 | PD4 — GPIO Port D bit 4 |
| Pin 34 | PD5 — GPIO Port D bit 5 |
| Pin 35 | PD6 — GPIO Port D bit 6 |
| Pin 36 | PD7 — GPIO Port D bit 7 |
| Pin 37 | PE0 — GPIO Port E bit 0 |
| Pin 38 | PE1 — GPIO Port E bit 1 |
| Pin 39 | PE2 — GPIO Port E bit 2 |
| Pin 40 | PE3 — GPIO Port E bit 3 |
| Pin 41 | PE4 — GPIO Port E bit 4 |
| Pin 42 | PE5 — GPIO Port E bit 5 |
| Pin 43 | PE6 — GPIO Port E bit 6 |
| Pin 44 | PE7 — GPIO Port E bit 7 |
| Pin 45 | PF0 — GPIO Port F bit 0 |
| Pin 46 | PF1 — GPIO Port F bit 1 |
| Pin 47 | PF2 — GPIO Port F bit 2 |
| Pin 48 | PF3 — GPIO Port F bit 3 |
| Pin 49 | PF4 — GPIO Port F bit 4 |
| Pin 50 | PF5 — GPIO Port F bit 5 |
| Pin 51 | PF6 — GPIO Port F bit 6 |
| Pin 52 | PF7 — GPIO Port F bit 7 |
| Pin 53 | AVCC — Analog supply voltage |
| Pin 54 | AGND — Analog ground |
| Pin 55 | AREF — Analog reference voltage |
| Pin 56 | TOSC1 — Timer oscillator pin 1 |
| Pin 57 | TOSC2 — Timer oscillator pin 2 |
| Pin 58 | XTAL1 — Crystal oscillator pin 1 |
| Pin 59 | XTAL2 — Crystal oscillator pin 2 |
| Pin 60 | RESET — Reset input (active low) |
| Pin 61 | D- — USB data minus |
| Pin 62 | D+ — USB data plus |
| Pin 63 | VBUS — USB VBUS sense |
| Pin 64 | NC — Not connected (per datasheet) |
Aplicaciones típicas
ATXMEGA32C3-MH es adecuado para 6 aplicacións: Industrial Sensor Interface, USB-Enabled Consumer Peripheral, Building Automation Controller, Smart Metering Subsystem, Human-Machine Interface (HMI) Panel, Battery-Powered IoT Sensor Node.
Industrial Sensor Interface
The ATXMEGA32C3-MH's 12-bit ADC (with PGA), four-channel DMA controller, and twelve-channel event system make it well-suited to industrial sensor aggregation boards where deterministic, low-latency acquisition is required. The 32 KB Flash holds a typical CAN- or RS-485-based sensor stack with margin, while the 1.6-3.6 V supply range allows operation from 24 V industrial rails after regulation. Compared with switching regulator based designs, the device's 12-bit DAC provides stable analog outputs for transducer excitation, and the event system lets multiple sensors trigger ADC captures without CPU intervention, reducing jitter and overall system power.
Recomendado
USB-Enabled Consumer Peripheral
The integrated USB Full-Speed (12 Mbps) device controller in the ATXMEGA32C3-MH removes the need for an external bridge chip in HID, CDC, or vendor-class peripherals. The 32 MHz core easily runs USB protocol stacks plus application code, while the 32 KB Flash accommodates composite device descriptors and command parsers. The 1.6-3.6 V supply directly powers the device from a USB VBUS rail (after regulation), simplifying BOM. Designers benefit from the AES/DES engine when adding secure firmware update paths, and from PicoPower modes for battery-powered accessories.
Recomendado
Building Automation Controller
For HVAC controllers, smart thermostats, and lighting-control nodes, the ATXMEGA32C3-MH combines 32 KB Flash with 2 KB EEPROM for non-volatile parameter storage (setpoints, schedules, calibration). The four-channel DMA controller autonomously moves ADC samples into SRAM, freeing CPU time for control-loop math, and the 12-bit DAC drives analog actuators with sub-1 LSB monotonic outputs. Operating from 1.6-3.6 V allows direct 3.3 V regulator outputs commonly used in 24 V building-automation backplanes. The wide -40C to +85C industrial temperature range ensures reliable operation in unconditioned enclosures.
Recomendado
Smart Metering Subsystem
The ATXMEGA32C3-MH fits smart electricity, water, and gas metering subsystems that demand deterministic measurement, low standby power, and tamper-resistant firmware. The 12-bit ADC and event-driven capture deliver accurate metrology, while the AES/DES crypto engine accelerates secure communication to concentrators. The 8 KB boot-code section supports secure bootloader schemes, and read-while-write Flash allows OTA firmware updates without service interruption. PicoPower sleep modes keep idle current below typical meter standby budgets.
Recomendado
Human-Machine Interface (HMI) Panel
HMI front-panel controllers benefit from the ATXMEGA32C3-MH's 12-bit DAC (for smooth backlight PWM-free analog dimming), 32 KB Flash (for menu state machines and custom fonts), and the event system for low-latency rotary-encoder or button scanning. The 64-pin VQFN provides enough GPIO to drive segment LCDs, keypads, and LEDs simultaneously. The -40C to +85C industrial temperature range and 1.6-3.6 V supply make it tolerant of wide industrial supply rails.
Recomendado
Battery-Powered IoT Sensor Node
PicoPower technology combined with the ATXMEGA32C3-MH's event system and DMA controller minimizes average current in IoT sensor nodes. The MCU can stay in a sub-microamp sleep state, wake on event-system triggers to perform an ADC conversion via DMA, then return to sleep without CPU intervention - ideal for multi-year coin-cell deployments. The 1.6 V minimum supply allows operation down to near-end-of-discharge of a single Li-primary cell, while AES/DES accelerates secure join procedures. The 32 KB Flash is sufficient for Thread/Zigbee application stacks with margin.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para ATXMEGA32C3-MH — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | ATXMEGA32C3-MHR | ATXMEGA64C3-MH | ATXMEGA128C3-MH | ATXMEGA256C3-MH | ATXMEGA128D4-MH |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin VQFN (9x9 mm) | 64-pin VQFN (9x9 mm) - same | 64-pin VQFN (9x9 mm) - same | 64-pin VQFN (9x9 mm) - same | 64-pin VQFN (9x9 mm) - same | 64-pin VQFN (9x9 mm) - same |
| Flash Memory | 32 KB | 32 KB | 64 KB | 128 KB | 256 KB | 128 KB |
| SRAM | 4 KB | 4 KB | 4 KB | 8 KB | 16 KB | 8 KB |
| Maximum Clock Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| USB | Yes (Full-Speed) | Yes (Full-Speed) | Yes (Full-Speed) | Yes (Full-Speed) | Yes (Full-Speed) | No |
| Operating Voltage | 1.6 V to 3.6 V | 1.6 V to 3.6 V | 1.6 V to 3.6 V | 1.6 V to 3.6 V | 1.6 V to 3.6 V | 1.6 V to 3.6 V |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Diferenciadores clave
- Smallest Flash in C3 family but full peripheral set retained (frente a ATXMEGA256C3-MH)
- Retains USB Full-Speed where D4 family drops it (frente a ATXMEGA128D4-MH)
- More SRAM and DMA-aware peripherals than ATmega328P (frente a ATMEGA328P-AUR)
Notas de diseño
The 64-pin VQFN package has an exposed thermal pad on the underside that must be soldered to a ground copper pour. Use at least four thermal vias in the pad to the inner ground plane to keep theta_JA within the datasheet's 30 C/W envelope. Estimated: at 32 MHz active, internal core dissipation is roughly 30 mW, but I/O switching at full GPIO toggle can add 50-100 mW; without a good thermal pad connection junction temperature can rise 10-15 C above ambient in still air.
Decouple every VCC pin with a 100 nF ceramic capacitor placed within 2 mm of the package pin, and add a single bulk 4.7 uF to 10 uF ceramic on the main 3.3 V rail. The XMEGA C3 family has multiple VCC/AVCC pairs - separate analog and digital supplies when designing with the on-chip ADC to avoid digital switching noise coupling into analog conversions. Brown-out detection at 1.6 V should be enabled in firmware to prevent Flash corruption during supply droops.
Do not exceed the 3.6 V absolute maximum on any pin, including during in-circuit programming. When using the USB module, place 22 ohm series resistors on D+ and D- as close to the MCU pins as possible, and ensure the VBUS pin is connected to a voltage divider for proper detection (the XMEGA USB module requires a 3.3 V-aware sense input). Avoid driving XTAL2 when using the internal oscillator unless external crystal mode is explicitly configured in the fuse bytes.
Keep the analog reference traces (AREF, AVCC, AGND) short and routed away from digital switching signals and clock traces. Place the ADC decoupling cap adjacent to AVCC/AGND. For USB designs, maintain 90-ohm differential impedance on the D+/D- pair and avoid routing near high-current switching nodes. The 32 MHz oscillator traces should be guarded by ground on both sides to minimize radiated EMI.
Información de cumplimiento
RoHS compliant and lead-free per Microchip product page; not AEC-Q100 qualified - not recommended for automotive safety-critical applications without further qualification
