BCM5389KFBG - 8-Port Gigabit Ethernet Switch | Broadcom
N.º de pieza: BCM5389KFBG ✓ ActivoBCM5389KFBG Descripción general
An Ethernet switch is a network-semiconductor device that receives Ethernet frames on multiple ports, selects an appropriate destination port, and forwards traffic across the internal switching fabric. The BCM5389 belongs to the broader hierarchy of Ethernet controllers, interface controllers, network semiconductors, and communication ICs. Integrating eight Gigabit Ethernet ports with SerDes capability can reduce the component count required in gateways, access equipment, and embedded switching platforms.
The principal verified characteristics are the eight-port architecture, integrated SerDes, SPI interface, and 256-BGA (17 x 17 mm) package. The component is categorized by DigiKey as an Ethernet Switch with an SPI Interface, while Mouser describes it as an eight-port SGMII switch. These records establish the device's core positioning, but the supplied source snippets do not expose detailed electrical ratings for operating voltage, clock frequency, serializer lane rate, memory interfaces, or physical dimensions beyond the package size.
The 256-BGA package is a high-pin-count surface-mount format intended for multilayer printed circuit boards. A successful implementation depends on exact land-pattern, ball-map, power-rail, clocking, SerDes routing, and thermal design information in the manufacturer documentation. Because the available source material provides only a short datasheet description and distributor summaries rather than the complete manufacturer PDF, no unverified switching capacity, latency, PHY count, SerDes standard, or pin-level functions are inferred here.
Typical application spaces include carrier-grade and access-network switching, industrial Ethernet gateways, embedded routers, set-top and customer-premises equipment, and other multi-port networking systems. The eight Gigabit Ethernet ports suit centralized connectivity, while integrated SerDes can support backplane or interconnect links when the particular port configuration and supported electrical interface match the system architecture.
Designers should verify the exact Broadcom reference design, supported boot and host interface requirements, pin assignments, reference voltage, and power-delivery network before layout release. The BGA package also requires careful escape routing, via arrays, plane splitting, and thermal-via placement. Any substitute must be checked against the complete ball map and electrical tables rather than selected from package dimensions alone.
This page consolidates verified distributor pricing and inventory, candidate same-family comparisons, technical gaps, and practical implementation cautions. It adds sourcing context and replacement screening beyond the brief distributor snippets while clearly separating verified facts from parameters that still require confirmation from the complete Broadcom datasheet.
Alternativas directas para BCM5389KFBG — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con BCM5389KFBG (mismo factor de forma y huella) — difiere en Mounting Type, Package, Product Type, Host Interface, Number of Ethernet Ports.
BCM5389IFBG
✅ Sustitución directaConsulte el precio
Ver hoja de datos →BCM5396KFBG
✅ Sustitución directaConsulte el precio
Ver hoja de datos →BCM53158XMB1KFBG
✅ Sustitución directaConsulte el precio
Ver hoja de datos →BCM5389KFBG Valores máximos y características eléctricas
| Product Type | 8-port Gigabit Ethernet switch |
| Number of Ethernet Ports | 8 ports |
| Integrated SerDes | Integrated |
| Controller Interface | SPI |
| Supported Interface Types | GMII, RGMII, RvMII |
| Encapsulado | 256-BGA (17 x 17 mm) |
| Tipo de montaje | SMD/SMT |
| Ethernet Classification | Gigabit Ethernet |
| Recuento de pines | 256 balls |
Guía de configuración de pines de BCM5389KFBG 256-bga (17 x 17 mm)
Configuración de pines para BCM5389KFBG (encapsulado 256-bga (17 x 17 mm)). Este componente analógico presenta pines de entrada, salida y alimentación. Consulte la hoja de datos del fabricante para conocer las configuraciones de los pines de ajuste de offset, compensación y habilitación. Ideal para circuitos de acondicionamiento de señal y amplificadores.
No hay datos detallados de patillaje disponibles para BCM5389KFBG.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
BCM5389KFBG es adecuado para 6 aplicacións: Carrier Ethernet Access Equipment, Industrial Ethernet Gateway, Embedded Router and CPE Platform, High-Speed Network Backplane, Video and Imaging Network Gateway, Network Appliance with Multiport Ethernet.
Carrier Ethernet Access Equipment
The BCM5389KFBG fits access equipment requiring eight Gigabit Ethernet ports in a compact surface-mount footprint. Its eight-port switch architecture, integrated SerDes, and SPI controller interface provide a foundation for connecting multiple access or aggregation links. The 256-BGA package also supports dense multilayer routing compared with a discrete-port design. Before schematic release, engineers must verify the exact port modes, SerDes lane configuration, management firmware expectations, reference clock, and power rails against the complete Broadcom datasheet.
Industrial Ethernet Gateway
BCM5389KFBG is a candidate for industrial gateways that aggregate several Gigabit Ethernet devices while exposing the switching function to a host processor through SPI. The documented eight-port count and integrated SerDes can simplify system partitioning compared with a collection of discrete Ethernet controllers. Industrial suitability is conditional because the supplied sources do not specify the operating-temperature grade, power-supply limits, isolation, or long-term availability terms. Those parameters, along with EMC and environmental requirements, must be confirmed before deployment.
Embedded Router and CPE Platform
The BCM5389KFBG can serve as the multi-port switching element in an embedded router or customer-premises equipment platform. Eight Gigabit Ethernet ports suit equipment that combines LAN connectivity with one or more uplink or backplane links, while integrated SerDes provides a potential high-speed interconnect path. The SPI interface supports host control of the switch through a processor or embedded controller. Firmware, management features, addressing limits, and boot behavior should be evaluated from the complete manufacturer documentation because they are absent from the verified search excerpts.
High-Speed Network Backplane
Integrated SerDes makes the BCM5389KFBG relevant to backplane-based network equipment in which copper or PCB links connect switching line cards. The eight Gigabit Ethernet ports can coexist with high-speed serial links, allowing a system to combine endpoint-facing traffic with internal line-card connectivity. SerDes lane rates, encoding, impedance, reach, and whether the required protocol combinations are simultaneously supported are not stated in the verified excerpts. Bench-level signal-integrity and interoperability testing is therefore essential after confirming the full datasheet.
Video and Imaging Network Gateway
The BCM5389KFBG may fit a multi-camera or imaging gateway that must combine several Gigabit Ethernet endpoints before forwarding traffic over another uplink. Its eight Gigabit Ethernet ports provide a meaningful connection count for security, industrial inspection, and machine-vision systems, while the SPI interface allows a control processor to supervise switch behavior. The verified material does not guarantee latency, packet-size, or quality-of-service limits, so designers should validate those parameters for real-time video and retain an alternate path if unsupported traffic classes are required.
Network Appliance with Multiport Ethernet
BCM5389KFBG is appropriate for compact network appliances requiring several simultaneous Gigabit Ethernet connections without a high-pin-count leaded package. The 256-BGA surface-mount format is suitable for automated assembly and multilayer PCB construction, and the integrated switch can reduce wiring complexity between service ports and an internal host. The exact PHY integration, media interfaces, management features, power consumption, and thermal limits are not present in the supplied excerpts. These data must be obtained before calculating system power, heatsinking needs, and production BOM cost.
Datos de referencia de ingeniería para BCM5389KFBG — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | BCM5389IFBG | BCM5396KFBG | BCM53158XMB1KFBG |
|---|---|---|---|---|
| Package | 256-BGA (17 x 17 mm) | 256-BGA (17 x 17 mm) | 256-BGA (17 x 17 mm) | 256-BGA (17 x 17 mm) |
| Brand | Broadcom | Broadcom | Broadcom | Broadcom |
| Product Series | BCM5389 | BCM5389 | BCM5396 | BCM53158 |
Diferenciadores clave
- Documented SPI controller access (frente a BCM5396KFBG)
- Verified eight-port positioning (frente a BCM53158XMB1KFBG)
- Verified SGMII-related product description (frente a BCM5389IFBG)
Notas de diseño
Do not release the BGA layout from package dimensions alone. Use the exact Broadcom KFBG ball map, land pattern, via dimensions, and assembly process notes. Reserve continuous escape paths for the high-speed SerDes interfaces and keep the SPI controller signals away from potential clock or SerDes return paths. Confirm the recommended layer stack and via-in-pad restrictions with the complete manufacturer design package.
The supplied excerpts do not provide supply voltages, current consumption, or power-rail sequencing. Therefore, no regulator or capacitor values can be specified reliably. Before schematic design, obtain the complete power table and separate analog, digital, and SerDes rails according to the manufacturer's requirements. Preserve the documented startup order and provide local high-frequency bypass at each supply entry to control package and board-level transients.
A 256-BGA network controller can require substantial plane area and thermal-via arrays, but the verified data does not disclose junction temperature, thermal resistance, or power dissipation. Follow Broadcom's recommended exposed-pad and via-array geometry, provide uninterrupted ground-plane connectivity, and avoid cutting thermal copper beneath the device. Complete a board-level thermal calculation after the actual processor, SerDes activity, and ambient conditions are known.
Do not substitute BCM5389KFBG solely because a candidate also uses a KFBG package. The supplied cross-reference pages identify comparison parts but do not expose complete ball maps or all electrical constraints. Confirm pin assignments, interface mode restrictions, management firmware, clock requirements, SerDes capabilities, operating-temperature grade, and power limits for any proposed replacement before treating it as a drop-in part.
Información de cumplimiento
The supplied search excerpts mention RoHS and REACH fields in comparison pages but do not provide their actual values. No compliance claim is inferred from them.
