DSPIC33CH256MP505-I/PT - 256KB Flash Dual-Core 100MHz DSC | Microchip
N.º de pieza: DSPIC33CH256MP505-I/PT ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $7.92 | $7,92 |
| 10 | $7.13 | $71,30 |
| 100 | $6.34 | $634,00 |
| 500 | $5.69 | $2.845,00 |
| 1.000 | $5.08 | $5.080,00 |
DSPIC33CH256MP505-I/PT Descripción general
A Digital Signal Controller (DSC) is a microcontroller architecture that combines a standard MCU control pipeline with a Digital Signal Processor (DSP) engine for high-speed arithmetic. Within the broader taxonomy, DSCs sit between microcontrollers (MCU) and microcontrollers-with-DSP, themselves a subcategory of 16-bit embedded controllers and ultimately embedded processors in the integrated circuits hierarchy. The dsPIC33CH family specifically targets motor control, digital power conversion, and safety-critical applications where deterministic closed-loop performance is mandatory.
Key features include dual independent dsPIC cores, high-resolution PWM with 1 ns edge placement, integrated CAN Flexible Data-Rate (CAN FD), 12-bit ADC up to 3.5 Msps, multiple UART/SPI/I2C interfaces, and Functional Safety (FuSa) support for ASIL-B/SIL-2 applications. The slave core can execute user code independently, allowing the main core to focus on real-time DSP tasks while the slave handles housekeeping, communication stacks, or sensor sampling.
The 48-pin TQFP (PT) package offers an industry-standard 7x7 mm footprint with 0.5 mm pitch, well-suited for hand-solderable prototyping and volume production. AEC-Q100 qualification is available on automotive-grade variants, and the device supports debug via standard ICSP/ICD interfaces for both cores simultaneously.
Typical applications include field-oriented control (FOC) motor drives, digital totem-pole PFC power supplies, wireless battery management systems, servo drives, and functional safety PLCs. When designing, allocate pin mapping carefully between cores and consult the dual-core programming model documentation for inter-core mailbox and shared RAM usage.
Alternativas directas para DSPIC33CH256MP505-I/PT — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con DSPIC33CH256MP505-I/PT (mismo factor de forma y huella) — difiere en Core Architecture, MSL Level, Package, Functional Safety, Supply Voltage.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
DSPIC33CH256MP505-E/PT
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
DSPIC33CH256MP505T-I/PT
✅ Sustitución directa✓ En stock
$5.92 / unidad
Ver hoja de datos →DSPIC33CH128MP505-I/PT
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
DSPIC33CH256MP505-I/PTVAO
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
DSPIC33CH256MP505-I/PT Valores máximos y características eléctricas
| Core Architecture | Dual 16-bit dsPIC33C DSC (main 100 MIPS + slave 90 MIPS) |
| Maximum CPU Speed | 100 MHz (main core) |
| Program Memory (Flash) | 256 KB |
| Data SRAM (Main Core) | 16 KB |
| Data SRAM (Slave Core) | 4 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| Temperatura de funcionamiento | -40 C to +85 C (Industrial) |
| PWM Resolution | High-resolution PWM, 1 ns edge placement |
| CAN FD | Yes |
| Encapsulado | 48-pin TQFP (7x7 mm) |
| Tipo de montaje | Surface Mount |
| Nivel MSL | 3 (168 Hours) |
| Estado RoHS | Compliant |
| Functional Safety | FuSa support (ASIL-B/SIL-2 capable) |
| ICSP Debug | Yes (dual-core simultaneous debug) |
Configuración de pines de DSPIC33CH256MP505-I/PT
| Pin 1 | RP46/PWM4H/RC16 — Remappable I/O / PWM output |
| Pin 2 | RP47/PWM4L/RC15 — Remappable I/O / PWM complementary output |
| Pin 3 | RP48/PWM5H/RC14 — Remappable I/O / PWM output |
| Pin 4 | RP49/PWM5L/RC13 — Remappable I/O / PWM complementary output |
| Pin 5 | AVDD — Analog supply voltage |
| Pin 6 | AVSS — Analog ground |
| Pin 7 | AN0/RA0 — Analog input / GPIO |
| Pin 8 | AN1/RA1 — Analog input / GPIO |
| Pin 9 | AN2/RA2 — Analog input / GPIO |
| Pin 10 | AN3/RA3 — Analog input / GPIO |
| Pin 11 | VDD — Digital supply voltage |
| Pin 12 | VSS — Digital ground |
| Pin 13 | OSC1/RA4 — Crystal oscillator input |
| Pin 14 | OSC2/RA5 — Crystal oscillator output |
| Pin 15 | MCLR — Master Clear reset (active low) |
| Pin 16 | PGED3/RP50/RB0 — ICSP programming data / GPIO |
| Pin 17 | PGEC3/RP51/RB1 — ICSP programming clock / GPIO |
| Pin 18 | PGED2/SDA2/RP52/RB2 — ICSP data / I2C SDA / GPIO |
| Pin 19 | PGEC2/SCL2/RP53/RB3 — ICSP clock / I2C SCL / GPIO |
| Pin 20 | TMS/RP54/RB4 — JTAG test mode select / GPIO |
| Pin 21 | TCK/RP55/RB5 — JTAG test clock / GPIO |
| Pin 22 | TDI/RP56/RB6 — JTAG test data in / GPIO |
| Pin 23 | TDO/RP57/RB7 — JTAG test data out / GPIO |
| Pin 24 | VDD — Digital supply voltage |
| Pin 25 | VSS — Digital ground |
| Pin 26 | RP58/PWM6H/RC0 — Remappable I/O / PWM output |
| Pin 27 | RP59/PWM6L/RC1 — Remappable I/O / PWM complementary output |
| Pin 28 | RP60/PWM7H/RC2 — Remappable I/O / PWM output |
| Pin 29 | RP61/PWM7L/RC3 — Remappable I/O / PWM complementary output |
| Pin 30 | RP62/PWM8H/RC4 — Remappable I/O / PWM output |
| Pin 31 | RP63/PWM8L/RC5 — Remappable I/O / PWM complementary output |
| Pin 32 | RP64/C1RX/RC6 — Remappable I/O / CAN1 RX / GPIO |
| Pin 33 | RP65/C1TX/RC7 — Remappable I/O / CAN1 TX / GPIO |
| Pin 34 | RP66/INT0/RC8 — Remappable I/O / external interrupt / GPIO |
| Pin 35 | RP67/INT1/RC9 — Remappable I/O / external interrupt / GPIO |
| Pin 36 | RP68/OC1/RC10 — Remappable I/O / output compare / GPIO |
| Pin 37 | RP69/OC2/RC11 — Remappable I/O / output compare / GPIO |
| Pin 38 | RP70/OC3/RC12 — Remappable I/O / output compare / GPIO |
| Pin 39 | VDD — Digital supply voltage |
| Pin 40 | VSS — Digital ground |
| Pin 41 | RP71/U1RTS/RD0 — Remappable I/O / UART1 RTS / GPIO |
| Pin 42 | RP72/U1CTS/RD1 — Remappable I/O / UART1 CTS / GPIO |
| Pin 43 | RP73/U1RX/RD2 — Remappable I/O / UART1 RX / GPIO |
| Pin 44 | RP74/U1TX/RD3 — Remappable I/O / UART1 TX / GPIO |
| Pin 45 | RP75/SDA1/RD4 — Remappable I/O / I2C1 SDA / GPIO |
| Pin 46 | RP76/SCL1/RD5 — Remappable I/O / I2C1 SCL / GPIO |
| Pin 47 | RP77/SPI1SCK/RD6 — Remappable I/O / SPI1 clock / GPIO |
| Pin 48 | RP78/SPI1SDO/RD7 — Remappable I/O / SPI1 data out / GPIO |
Aplicaciones típicas
DSPIC33CH256MP505-I/PT es adecuado para 6 aplicacións: Field-Oriented Control (FOC) Motor Drive, Digital Totem-Pole PFC Power Supply, Wireless Battery Management System (wBMS), Industrial Servo Drive with Functional Safety, Solar String Inverter MPPT Controller, Automotive HVAC Blower Control.
Field-Oriented Control (FOC) Motor Drive
The DSPIC33CH256MP505-I/PT is purpose-built for FOC motor control loops on PMSM, BLDC, and AC induction motors. The main 100 MIPS core executes the Park/Clarke transform and space-vector modulation at PWM frequencies up to 50 kHz with 1 ns high-resolution edge placement, while the slave 90 MIPS core handles encoder sampling via quadrature decoder and current-sensor ADC trigger timing. The 16+4 KB partitioned SRAM lets the main core maintain dedicated PI controller state buffers without contention from sensor I/O. Its integrated CAN FD enables multi-axis servo synchronization over a single bus, and the 48-pin TQFP footprint fits compact 3-phase inverter boards under 50 mm square.
Recomendado
Digital Totem-Pole PFC Power Supply
For bridgeless totem-pole PFC converters, the DSPIC33CH256MP505-I/PT runs current-mode control loops on the main 100 MIPS core while the slave core manages AC-line zero-crossing detection, relay sequencing, and housekeeping telemetry. The high-resolution PWM module provides the sub-percent duty-cycle accuracy required to meet 80 Plus Titanium efficiency targets at light load. CAN FD connectivity lets the PFC stage report power-quality telemetry to a downstream DSP or supervisory controller, and the 256 KB Flash accommodates complex state-machine firmware for soft-start, brown-out, and burst-mode operation across universal mains input.
Recomendado
Wireless Battery Management System (wBMS)
The DSPIC33CH256MP505-I/PT is ideal for wireless BMS master nodes where deterministic cell-balancing and state-of-charge (SoC) computation must coexist with a wireless protocol stack. The main core runs coulomb-counting and Kalman-filter SoC algorithms at 100 MIPS, while the slave core handles BLE or proprietary RF protocol timing. With 256 KB Flash, the device can host a full BMS firmware image plus bootloader and OTA update partition. The 48-pin TQFP package and -40C to +85C industrial range suit under-hood automotive and stationary storage installations alike.
Recomendado
Industrial Servo Drive with Functional Safety
For SIL-2 / ASIL-B functional-safety servo drives, the DSPIC33CH256MP505-I/PT's dual-core architecture lets one core execute the motion-control loop while the other runs a diverse-redundancy safety check on position feedback and current limits. The Functional Safety (FuSa) documentation package supports ISO 13849 and IEC 61508 certification. CAN FD provides the safety-rated communication bus to the controller, and the high-resolution PWM with 1 ns edge placement ensures sub-arcsecond positioning accuracy in CNC and robotics applications.
Recomendado
Solar String Inverter MPPT Controller
The DSPIC33CH256MP505-I/PT drives multiple MPPT channels in residential or small-commercial solar inverters. The main core executes perturb-and-observe or incremental-conductance MPPT algorithms on each string at sub-100 ms update rates, while the slave core synchronizes grid-tie relaying and anti-islanding detection per IEEE 1547. High-resolution PWM drives the DC-DC boost stage with >99% efficiency at partial load, and CAN FD or UART reports telemetry to the inverter's display and cloud gateway.
Recomendado
Automotive HVAC Blower Control
In 12V/48V automotive HVAC blowers, the DSPIC33CH256MP505-I/PT runs sensorless FOC on small PMSM blowers while the slave core manages LIN or CAN FD communication with the body controller. The device's industrial-grade temperature rating matches under-dash thermal conditions, and the AEC-Q100-qualified /PTVAO variant supports OEM automotive PPAP documentation. The 256 KB Flash allows combined motor-control firmware plus a bootloader for service reflashing.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para DSPIC33CH256MP505-I/PT — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | DSPIC33CH256MP505-E/PT | DSPIC33CH256MP505T-I/PT | DSPIC33CH128MP505-I/PT | DSPIC33CH256MP505-I/PTVAO | DSPIC33CH256MP208-I/PT |
|---|---|---|---|---|---|---|
| Package | TQFP-48 (7x7 mm) | TQFP-48 (7x7 mm) - same | TQFP-48 (7x7 mm) - same | TQFP-48 (7x7 mm) - same | TQFP-48 (7x7 mm) - same | TQFP-28 - different (28-pin) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 256 KB | 256 KB | 256 KB | 128 KB | 256 KB | 256 KB |
| Maximum CPU Speed (Main Core) | 100 MIPS / 100 MHz | 100 MIPS | 100 MIPS | 100 MIPS | 100 MIPS | 100 MIPS |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C | -40C to +85C | -40C to +125C (Automotive VAO) | -40C to +85C |
| Main Core SRAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| Slave Core SRAM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| CAN FD | Yes | Yes | Yes | Yes | Yes | Yes |
Diferenciadores clave
- True dual-core silicon on a single die (frente a DSPIC33CH128MP505-I/PT)
- 256 KB Flash for full motor-control firmware plus bootloader (frente a DSPIC33CH128MP505-I/PT)
- High-resolution PWM with 1 ns edge placement (frente a DSPIC33CH256MP208-I/PT)
Notas de diseño
Place 100 nF decoupling capacitors on every VDD/VSS pin pair within 3 mm of the package, plus a single 10 uF bulk capacitor on each AVDD/AVSS pair. The dual-core silicon draws up to 80 mA under full load at 100 MHz; the AVDD rail is sensitive to digital switching noise, so isolate it via a ferrite bead from VDD.
When migrating from single-core dsPIC33CK to dual-core dsPIC33CH, ensure your firmware initializes the slave core via the inter-core mailbox protocol - the slave will not start automatically on reset. Configure the FBSLIM/FBCLSE configuration bits before code generation, otherwise the slave will lock up waiting for a handshake that never arrives.
The 48-pin TQFP (PT) package has a theta_JA of approximately 50 C/W on a 4-layer JEDEC test board. At 100 MHz full-load operation drawing ~80 mA at 3.3 V, internal dissipation is approximately 0.26 W, yielding a junction-to-ambient rise of 13 C - well within the 85 C industrial ceiling. Extended-temperature /E parts add headroom for >100 C ambient enclosures.
Route the high-resolution PWM traces as length-matched differential pairs with ground shielding, especially for the 1 ns-edge signals feeding gate drivers. Keep analog ADC traces short and away from PWM switching nodes; the on-chip ADC can sample at 3.5 Msps but is sensitive to switching-noise coupling through the package substrate.
Estimated: Crystal oscillator traces should be <5 mm and guarded by a ground ring. Place OSC1/OSC2 traces symmetrically, and avoid routing any digital signals under the crystal load capacitors to prevent jitter. For dual-core debug, dedicate separate PGED/PGEC pin pairs per core to avoid contention during simultaneous ICD sessions.
Información de cumplimiento
Industrial-grade /I variant is not AEC-Q100 qualified; choose DSPIC33CH256MP505-I/PTVAO for automotive PPAP documentation. RoHS compliant per Microchip product page.
