DSPIC33CH64MP508-E/PT - Dual-Core 16-bit DSC 80-TQFP | Microchip
N.º de pieza: DSPIC33CH64MP508-E/PT ✓ Activo| Cant. | Precio unitario | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
DSPIC33CH64MP508-E/PT Descripción general
A digital signal controller combines the computational throughput of a digital signal processor (DSP) with the peripheral integration and deterministic control of a microcontroller (MCU). Within the power-management hierarchy of embedded systems, the dsPIC33CH family sits above single-core dsPIC33 devices by pairing two independently clocked dsPIC cores: a high-performance master core for sophisticated algorithms and a slave core dedicated to time-critical loops, enabling clean partitioning of control and communication tasks.
Key features include the dual-core architecture (master core up to 100 MIPS per distributor data, with one source citing a 64 MHz maximum clock for this speed grade), 64 KB of Flash, 20 KB of dual-core RAM (16 KB plus 4 KB), 8 DMA channels, and CAN connectivity. The -E temperature suffix and AEC-Q100 qualification make it suitable for automotive sensor and power-conversion designs that experience wide ambient swings.
Architecturally, the dsPIC33CH cores integrate DSP engine features such as multiply-accumulate instructions, allowing precision digital power, motor control, and filtering algorithms to execute deterministically. The master/slave messaging interface transfers data blocks between cores without CPU overhead on the master.
Typical applications include wireless power transfer, server power supplies, drone flight controllers, automotive sensors, and high-performance digital motor control - all domains cited by Microchip for the dsPIC33CH family.
Design consideration: partition the slave core for the fastest control loop and the master core for supervisory logic, and verify the exact core clock speed grade in the manufacturer datasheet before finalizing timing budgets.
This page synthesizes distributor listings, cross-reference data, and practical selection guidance not consolidated on the manufacturer site alone.
Alternativas directas para DSPIC33CH64MP508-E/PT — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con DSPIC33CH64MP508-E/PT (mismo factor de forma y huella) — difiere en Operating Temperature, Package, Core Architecture, High-Resolution PWM, Program Memory (Flash).
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
DSPIC33CH128MP508-E/PT
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$3.4 / unidad
Ver hoja de datos →DSPIC33CH64MP506T-I/PT
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$2.74 / unidad
Ver hoja de datos →DSPIC33CH128MP506-I/PT
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$5.62 / unidad
Ver hoja de datos →DSPIC33CH256MP508-I/PT
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$5.84 / unidad
Ver hoja de datos →DSPIC33CH512MP508T-I/PT
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$4.22 / unidad
Ver hoja de datos →DSPIC33CH64MP508T-E/PT
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
DSPIC33CH64MP508-E/PT Valores máximos y características eléctricas
| Core Architecture | Dual-core 16-bit dsPIC DSC |
| Program Memory (Flash) | 64 KB |
| RAM | 20 KB (16 KB + 4 KB dual-core) |
| DMA Channels | 8 |
| Connectivity | CAN |
| Tensión de alimentación | 3.3 V |
| Temperatura de funcionamiento | -40C to +125C |
| Encapsulado | 80-TQFP (12x12 mm) |
| Terminal Pitch | 0.5 mm |
| Tipo de montaje | Surface Mount |
| Qualification | AEC-Q100 qualified (automotive) |
| Packaging | Tray |
| Programming Interface | ICSP (multiple PGECx/PGEDx pairs) |
Guía de configuración de pines de DSPIC33CH64MP508-E/PT 80-tqfp (12x12 mm)
Configuración de pines para DSPIC33CH64MP508-E/PT (encapsulado 80-tqfp (12x12 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para DSPIC33CH64MP508-E/PT.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
DSPIC33CH64MP508-E/PT es adecuado para 6 aplicacións: Digital Power Supplies, Wireless Power Transfer, Motor Control, Automotive Sensors, Server Power Supplies, Drones and UAV Flight Control.
Digital Power Supplies
The DSPIC33CH64MP508-E/PT fits digital power supply designs because Microchip explicitly optimizes the dsPIC33CH family for high-performance digital power requiring sophisticated algorithms. Its dual-core architecture lets the slave core execute the fast voltage/current control loop deterministically at up to 100 MHz-class dsPIC throughput while the master core manages telemetry, startup sequencing, and communication. In an LLC or phase-shifted full-bridge converter, the integrated high-speed PWM peripherals generate the switching waveforms and the DSP engine handles compensator math with multiply-accumulate instructions. Unlike analog controllers, firmware-based control allows adaptive gain scheduling and soft shutdown. Trade-off: firmware validation effort is higher than with a fixed-function PWM controller, but design flexibility and feature updates across product generations are substantially greater.
Recomendado
Wireless Power Transfer
Microchip lists wireless power among the target applications of the dsPIC33CH dual-core family. The DSPIC33CH64MP508-E/PT suits this domain because wireless power transmitters and receivers require tight real-time control of resonant switching plus foreign-object detection and protocol handling (e.g., Qi-style negotiation). The slave core can run the frequency/phase control loop for the power stage while the master core implements communication demodulation and safety logic, cleanly isolating hard-real-time and protocol tasks. The 64 KB Flash accommodates the control firmware and protocol stack for mid-range systems. A key benefit is deterministic loop timing, which directly affects transfer efficiency and EMI performance. Designers should budget headroom in Flash if advanced foreign-object detection algorithms are planned.
Recomendado
Motor Control
Precision motor control is a headline application for the dsPIC33CH family per Microchip, which cites high-performance, precision motor control systems. The DSPIC33CH64MP508-E/PT handles field-oriented control (FOC) of PMSM and BLDC motors: the slave core executes the current loop and space-vector PWM generation, while the master core performs speed-loop control, trajectory planning, and fieldbus communication including CAN. The DSP engine's multiply-accumulate capability accelerates the Park/Clarke transforms and PI compensators. The -E automotive temperature rating supports underhood and traction-adjacent motor drives. Compared with a single-core MCU, dual-core partitioning prevents communication interrupts from jittering the current loop, improving torque ripple performance. Confirm ADC sampling and PWM peripheral specifications in the family datasheet for your specific motor topology.
Recomendado
Automotive Sensors
Microchip explicitly targets automotive sensors for the dsPIC33CH dual-core family. The DSPIC33CH64MP508-E/PT is AEC-Q100 qualified and rated -40C to +125C per Microchip USA, matching the environmental envelope of most automotive sensor modules such as position, pressure, and flow sensors. Its CAN interface integrates directly into vehicle networks, while the dual-core split lets one core run the DSP-heavy signal-conditioning chain (filtering, linearization) and the other handle diagnostics and bus communication. The 64 KB Flash suits compact sensor firmware; code growth can be absorbed by the pin-compatible DSPIC33CH128MP508-E/PT without PCB change. Engineers should plan functional-safety analysis (e.g., diagnostic coverage) separately, since AEC-Q100 covers component stress qualification only.
Recomendado
Server Power Supplies
Server power supplies are among the applications Microchip names for the dsPIC33CH dual-core family. The DSPIC33CH64MP508-E/PT supports server PSU designs by running high-frequency digital control of PFC and DC-DC stages: the slave core closes the fast control loops while the master core implements PMBus-style telemetry, fault logging, and ORing/protection logic. Digital control enables adaptive efficiency optimization across load, essential for 80 PLUS Titanium-class targets, and firmware-updatable power curves across product refreshes. The 8 DMA channels offload ADC sampling data movement, preserving CPU cycles for the compensators. Trade-off versus analog control is validation burden; benefit is field-upgradable behavior tuning. Verify exact PWM resolution and ADC specifications in the manufacturer datasheet during architecture selection.
Recomendado
Drones and UAV Flight Control
Microchip lists drones among dsPIC33CH family applications. The DSPIC33CH64MP508-E/PT can serve as an electronic speed controller (ESC) brain or flight-controller co-processor: the slave core runs per-phase motor commutation with sensorless observers, while the master core handles telemetry, safety envelopes, and communication with the flight computer over serial links or CAN. Deterministic dual-core timing keeps commutation immune from higher-layer software jitter, improving throttle response and efficiency. The -E grade supports high-temperature enclosures near power stages. With 64 KB Flash, ESC firmware fits comfortably; sensorless algorithms requiring large tables may need the 128 KB or 256 KB pin-compatible variants. Designers should confirm PWM and ADC timing specs in the family datasheet for their motor pole count and switching frequency.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para DSPIC33CH64MP508-E/PT — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | DSPIC33CH128MP508-E/PT | DSPIC33CH64MP506T-I/PT | DSPIC33CH256MP508-I/PT | DSPIC33CH512MP508T-I/PT | DSPIC33CH128MP506-I/PT |
|---|---|---|---|---|---|---|
| Package | 80-TQFP (12x12 mm) | 80-TQFP (12x12 mm) - same | 80-TQFP (12x12 mm) - same | 80-TQFP (12x12 mm) - same | 80-TQFP (12x12 mm) - same | 80-TQFP (12x12 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Program Memory | 64 KB | 128 KB | 64 KB | 256 KB | 512 KB | 128 KB |
| Operating Temperature | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) |
| Core Architecture | Dual-core 16-bit dsPIC | Dual-core 16-bit dsPIC | Dual-core 16-bit dsPIC | Dual-core 16-bit dsPIC | Dual-core 16-bit dsPIC | Dual-core 16-bit dsPIC |
| CAN Connectivity | Yes | Yes | Yes | Yes | Yes | Yes |
| Packaging | Tray | Tray | Tape & Reel (T suffix) | Tray | Tape & Reel (T suffix) | Tray |
Diferenciadores clave
- Dual-core partitioning at entry-level Flash density (frente a DSPIC33CH128MP508-E/PT)
- Automotive -E temperature grade (frente a DSPIC33CH256MP508-I/PT)
- Lowest-cost 80-pin dsPIC33CH MP508 entry point (frente a DSPIC33CH512MP508T-I/PT)
Notas de diseño
Supply the DSPIC33CH64MP508-E/PT from a clean 3.3 V rail. Decouple each VDD pin with 100 nF ceramic capacitors placed within 2 mm of the pin, plus one bulk 10 uF capacitor near the device. Dual-core devices exhibit simultaneous load-current transitions on both cores, so a low-impedance power distribution network reduces supply droop during core-to-core message transfers. Follow the power-up sequence and voltage-ramp requirements in the manufacturer datasheet, and use the on-chip Brown-out Reset with a threshold appropriate for your supply tolerance.
The 80-TQFP 12x12 mm package with 0.5 mm pitch requires a fine-pitch footprint per the manufacturer land-pattern recommendation. Provide a solid ground plane on layer 2 for return currents and thermal relief. Keep the crystal/oscillator traces short and guard them with ground. For CAN, route the transceiver close to the CAN pins and place a 120-ohm termination at the bus stub. Because multiple PGECx/PGEDx pairs exist for ICSP, bring one complete pair (e.g., PGEC2/PGED2) to a programming header - ICSPCLK and ICSPDAT must come from the same pair per Northern Software's notes.
Two clock-speed figures appear across distributor data for this MPN: Mouser lists 100 MHz dual-core operation while Microchip USA cites a 64 MHz maximum clock for this speed grade. Do not finalize timing budgets or PWM calculations until you confirm the exact core frequency of the DSPIC33CH64MP508 speed grade in the manufacturer datasheet. Also remember that firmware differs from single-core dsPIC33 parts: the slave core must be compiled and loaded separately from the master core image.
Información de cumplimiento
AEC-Q100 qualification stated by Microchip USA for the DSPIC33CH64MP508-E-PT. FindIC lists the part as Automotive grade. RoHS/REACH/lead-free status was not stated in the verified data and must be confirmed from the Microchip product page.