DSPIC33EP16GS202-E/MX - 16-Bit 60 MIPS Digital Power DSC | Microchip
N.º de pieza: DSPIC33EP16GS202-E/MX ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
DSPIC33EP16GS202-E/MX Descripción general
A digital signal controller combines the computational throughput of a DSP core with the peripheral set and ease of use of a microcontroller. Within the power-management hierarchy, a DSC sits above a general-purpose MCU for control-loop tasks: it closes fast feedback loops in switch-mode power supplies where a standard MCU would be too slow, making the dsPIC33EPXXGS202 family a dedicated platform for digital power conversion.
Key features of the GS202 family include a high-speed 16-bit CPU executing DSP instructions, dedicated high-resolution PWM peripherals for switch-mode power conversion, a high-speed ADC pipeline for current- and voltage-loop sampling, on-chip DAC channels, and Functional Safety (FuSa) support as classified by distributors. The exposed-pad UQFN package provides low-inductance ground return and good thermal performance for dense power electronics layouts.
Architecturally, the dsPIC33E core uses separate program and data memory spaces and buses, per the Microchip dsPIC33EPXXGS202 Family Data Sheet (DS70005208E), enabling simultaneous instruction fetch and data access that sustains deterministic control-loop timing. Deterministic interrupt latency is a core requirement when sampling inductor current at switching frequency rates.
Typical applications include AC-DC and DC-DC switch-mode power supplies, AC-DC converters with power factor correction, and general digital power-conversion systems; Microchip's Interleaved PFC reference design (universal input, up to 350W DC output) is built on this controller family.
Design consideration: Flash density of 16KB requires careful code budgeting in C; if control-law code grows, the pin-compatible DSPIC33EP32GS202 in the same family doubles memory without a PCB change.
This page synthesizes distributor data, drop-in alternatives, and design guidance not consolidated in the manufacturer datasheet.
Alternativas directas para DSPIC33EP16GS202-E/MX — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con DSPIC33EP16GS202-E/MX (mismo factor de forma y huella) — difiere en Core, Package, Functional Safety Support, Operating Temperature, Program Memory (Flash).
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
DSPIC33EP32GS202-E/MX
✅ Sustitución directa✓ En stock
$3.05 / unidad
Ver hoja de datos →DSPIC33EP16GS202-I/MX
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
DSPIC33EP32GS202-I/MX
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$2.95 / unidad
Ver hoja de datos →DSPIC33EP64GS202-E/MX
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
DSPIC33EP16GS502-E/MX
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
DSPIC33EP16GS202-E/MX Valores máximos y características eléctricas
| Core | dsPIC33EP 16-bit DSC |
| Max CPU Speed | 60 MIPS |
| Program Memory (Flash) | 16KB (16K x 8) |
| Tensión de alimentación | 3.3 V |
| Rango de temperatura de funcionamiento | -40C to +125C (E grade) |
| Encapsulado | 28-UQFN (6x6 mm), exposed pad |
| Qualification | AEC-Q100 (automotive) |
| Tipo de montaje | Surface Mount |
| Product Family | dsPIC33EPXXGS202 (Digital Power / SMPS DSC) |
| Target Applications | Digital power, SMPS, high-speed ADC, DAC |
| Functional Safety Support | Yes (FuSa classified) |
Guía de configuración de pines de DSPIC33EP16GS202-E/MX 28-uqfn (6x6 mm), exposed pad
Configuración de pines para DSPIC33EP16GS202-E/MX (encapsulado 28-uqfn (6x6 mm), exposed pad). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para DSPIC33EP16GS202-E/MX.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
DSPIC33EP16GS202-E/MX es adecuado para 6 aplicacións: Digital Switch-Mode Power Supplies (SMPS), AC-DC Power Factor Correction (PFC), Automotive Power Conversion, Digital Lighting and LED Driver Control, Solar Micro-Inverters and DC-DC Power Optimizers, Industrial Battery Chargers and BMS Front Ends.
Digital Switch-Mode Power Supplies (SMPS)
The DSPIC33EP16GS202-E/MX is designed specifically for digital SMPS control, combining a 60 MIPS 16-bit DSP core with high-resolution PWM and a high-speed ADC. In a synchronous buck or half-bridge converter, the controller samples output voltage and inductor current each switching cycle and updates the PWM duty cycle within deterministic latency, closing a current-mode loop that analog controllers approximate discretely. The 3.3V supply and AEC-Q100 qualification support both industrial and automotive power stages. Firmware-based control also enables soft-start profiles, nonlinear gain scheduling, and fault logging without extra components. Designers should budget the 16KB Flash carefully, as compensator code plus state machines consume it quickly.
Recomendado
AC-DC Power Factor Correction (PFC)
Microchip's Interleaved PFC reference design - which operates from universal AC input and delivers a high-voltage DC output up to 350W - is built on the GS202 digital-power DSC family. Power factor correction requires a fast inner current loop synchronized to the rectified line and a slower outer voltage loop; the DSPIC33EP16GS202's DSP multiply-accumulate throughput at 60 MIPS executes these compensators in C with headroom for average-current-mode control. The high-speed ADC samples the inductor current and bus voltage, while the digital-power PWM stages drive the boost switches. Digital implementation adapts compensation across the universal input range without hardware changes, a key advantage over fixed analog PFC controllers.
Recomendado
Automotive Power Conversion
With AEC-Q100 qualification, the extended -40C to +125C operating range, and Functional Safety (FuSa) classification, the DSPIC33EP16GS202-E/MX suits automotive auxiliary power supplies, onboard charger sub-modules, and DC-DC converters for 12V/48V architectures. The 28-UQFN 6x6 mm exposed-pad package provides the thermal path needed near power stages, and digital control allows firmware-based protection strategies (overcurrent, overvoltage, brownout responses) that are auditable for safety cases. Engineers should verify the specific AEC-Q100 grade level with Microchip for the target mounting position, and prefer the E-grade over the I-grade variant wherever underhood or high-ambient conditions exist.
Recomendado
Digital Lighting and LED Driver Control
Digitally controlled LED drivers benefit from the GS202's high-resolution PWM and fast ADC: the controller regulates LED current per switching cycle while implementing dimming profiles, temperature derating, and fault shutdowns in firmware. The 60 MIPS core handles constant-current loops for buck or flyback LED drivers, and the on-chip DAC can supply reference or sensor-bias functions, reducing external BOM count. The 3.3V supply integrates with standard auxiliary bias rails, and the small 6x6 mm UQFN fits compact driver boards used in industrial luminaires and commercial lighting. The 16KB Flash accommodates a single-channel driver control stack with communication overhead to spare.
Recomendado
Solar Micro-Inverters and DC-DC Power Optimizers
Photovoltaic power electronics require maximum-power-point tracking (MPPT) plus fast DC-DC conversion - precisely the GS202 family's target. The DSP core runs MPPT algorithms (perturb-and-observe or incremental conductance) at kilohertz rates while the high-speed ADC samples panel voltage, current, and intermediate bus conditions, and the digital PWM stages control the boost or flyback power stage. Firmware control enables per-panel safety profiles and grid-code-aware supervisory logic. The 16KB Flash of the DSPIC33EP16GS202 fits a single-stage optimizer control loop; designs combining MPPT, communication, and isolation supervision typically move to the pin-compatible 32KB or 64KB family members.
Recomendado
Industrial Battery Chargers and BMS Front Ends
Multi-chemistry battery charging benefits from the deterministic control of the DSPIC33EP16GS202-E/MX: CC/CV profiles, termination detection, and thermal foldback execute in firmware on the 60 MIPS core, with the high-speed ADC monitoring current and cell voltage every switching cycle. The AEC-Q100 qualification extends use into traction-adjacent and power-tool charging platforms, and the exposed-pad UQFN dissipates controller heat efficiently inside sealed charger enclosures. Digital control also simplifies implementing charge-log and authentication hooks demanded by modern battery packs. The 16KB Flash is adequate for a single-output charger; multi-port chargers should step up to the DSPIC33EP32GS202 on the same PCB footprint.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para DSPIC33EP16GS202-E/MX — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | DSPIC33EP32GS202-E/MX | DSPIC33EP16GS202-I/MX | DSPIC33EP64GS202-E/MX | DSPIC33EP16GS502-E/MX |
|---|---|---|---|---|---|
| Package | 28-UQFN (6x6 mm), exposed pad | 28-UQFN (6x6 mm) - same | 28-UQFN (6x6 mm) - same | 28-UQFN (6x6 mm) - same | 28-UQFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 16KB (16K x 8) | 32KB | 16KB | 64KB | 16KB |
| Core Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Operating Temperature | -40C to +125C (E grade) | -40C to +125C | -40C to +85C (industrial) | -40C to +125C | -40C to +125C |
| AEC-Q100 Qualification | Yes | Yes (E grade) | No (industrial grade) | Yes (E grade) | Yes (E grade) |
| ADC Architecture | High-speed ADC (digital power optimized) | Same as this product | Same as this product | Same as this product | Dual high-speed ADC (GS502 variant) |
| PCB Footprint Change Required | N/A (reference) | No - drop-in | No - drop-in | No - drop-in | No - drop-in (verify pinout per datasheet) |
Diferenciadores clave
- AEC-Q100 automotive qualification with -40C to +125C range (frente a DSPIC33EP16GS202-I/MX)
- Flash headroom upgrade without PCB change (frente a DSPIC33EP16GS202-I/MX)
- Balanced density for single-loop digital power control (frente a DSPIC33EP64GS202-E/MX)
Notas de diseño
The /MX package is a 28-UQFN (6x6 mm) with exposed pad. Solder the exposed pad to a grounded copper pour with an array of thermal vias - it serves as the primary ground return and heat path for the die. Keep the high-speed ADC sense traces (current-shunt and output-voltage feedback) away from PWM switching nodes and route them as Kelvin connections to the sense resistors. Per the family Flash Programming Specification (70005192B), reserve board access to MCLR, PGD, and PGC for in-circuit serial programming (ICSP).
Flash budget is the most common GS202 pitfall: 16KB fills quickly with a compiled PI compensator, state machine, and communication protocol. Estimate compiled code size early in MCC or MPLAB X, and if the budget exceeds roughly 12KB, move to the pin-compatible DSPIC33EP32GS202 rather than stripping safety features. Also match the temperature suffix: substituting an I-grade part in a design specified for -40C to +125C breaks the AEC-Q100 qualification chain even though the die is identical.
Estimated: the controller itself draws only a small share of system power; the dominant thermal question is its position relative to the power stage. Place the UQFN away from hot power components (MOSFETs, magnetics) to keep junction temperature within the +125C limit - in a 105C-ambient automotive enclosure, the allowed self-heating margin is only about 20C, so verify theta_JA from the datasheet against actual copper area on your board rather than relying on generic values.
Información de cumplimiento
AEC-Q100 automotive qualification confirmed via distributor listings (DigiKey, datasheets.com). RoHS/REACH/lead-free status not stated in the provided data; confirm on the Microchip product page.
