DSPIC33EP32GS502T-I/MM - 70MIPS DSC, 32KB Flash | Microchip
N.º de pieza: DSPIC33EP32GS502T-I/MM ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $5.6 | $5,60 |
| 10 | $5.02 | $50,20 |
| 100 | $4.55 | $455,00 |
| 500 | $4.1 | $2.050,00 |
| 1.000 | $3.85 | $3.850,00 |
DSPIC33EP32GS502T-I/MM Descripción general
A digital signal controller combines the computational throughput of a digital signal processor (DSP) with the peripheral integration and control-oriented architecture of a microcontroller. Within the power-management hierarchy, the dsPIC33EP GS family sits at the heart of digital switch-mode power supplies (SMPS), replacing analog control loops with firmware-executed control laws executed at high interrupt rates.
Key features of the GS-series DSC include the 70 MIPS dsPIC33E core, high-resolution PWM modules purpose-built for power topologies, fast ADC sampling for current-loop feedback, and connectivity via I2C, SPI, UART/USART, IrDA, and LINbus. The 32 KB Flash accommodates full closed-loop control firmware plus communication stacks, while the industrial temperature grade (-40C to +85C, I-suffix) suits embedded power electronics.
Architecturally, the device pairs a 16-bit modified Harvard core with DSP instruction support and zero-overhead loops, allowing deterministic execution of proportional-integral control loops. The Peripheral Trigger Generator coordinates ADC sampling with PWM events, minimizing loop latency - the critical metric in peak-current-mode and voltage-mode digital control.
Typical applications include interleaved power factor correction (PFC) up to 350 W, semi-bridgeless PFC with ZVS full-bridge converters up to 750 W (per Microchip reference designs), digital AC-DC supplies, and motor control drives. The QFN-28 6x6 footprint keeps solutions compact for power-density-sensitive designs.
Design consideration: route the exposed thermal pad to a solid ground plane and keep high dv/dt switch nodes away from the ADC reference pins to preserve current-sense accuracy.
This page synthesizes distributor pricing, drop-in family alternatives, and practical digital-power design notes not found in the manufacturer datasheet, with pricing as of 2026-09-25.
Alternativas directas para DSPIC33EP32GS502T-I/MM — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con DSPIC33EP32GS502T-I/MM (mismo factor de forma y huella) — difiere en Package, Packaging, Mounting Type, Core, Supply Voltage.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
DSPIC33EP64GS502T-I/MM
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
DSPIC33EP32GS502T-E/MM
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
DSPIC33EP16GS502T-I/MM
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$2.75 / unidad
Ver hoja de datos →DSPIC33EP32GP502T-I/MM
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$2.19 / unidad
Ver hoja de datos →DSPIC33EP64GP502T-I/MM
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
DSPIC33EP32GS502T-I/MM Valores máximos y características eléctricas
| Core Processor | dsPIC33E |
| Core Size | 16-bit |
| Speed | 70 MIPS |
| Program Memory | 32 KB Flash |
| Supply Voltage - Operating | 3 V to 3.6 V |
| Encapsulado | 28-QFN-S (6x6 mm), exposed pad |
| Tipo de montaje | SMD (SMT) |
| Connectivity | I2C, SPI, UART/USART, IrDA, LINbus |
| Temperatura de funcionamiento | -40C to +85C (I grade) |
| Series | dsPIC 33EP GS (SMPS / Digital Power) |
| Packaging | Tape & Reel (TR) |
| Standard Package Quantity | 1600 |
| Nivel MSL | 1 (Unlimited) |
| ECCN | 3A991A2 |
| HTSUS | 8542.31.0001 |
| REACH Status | REACH Unaffected |
| Base Product Number | DSPIC33EP32GS502 |
| Estado RoHS | Compliant |
Configuración de pines de DSPIC33EP32GS502T-I/MM
| Pin 1 | MCLR — Master clear reset / ICSP programming voltage input |
| Pin 2 | AN0/RB0 — Analog input 0 / digital I/O |
| Pin 3 | AN1/RB1 — Analog input 1 / digital I/O |
| Pin 4 | AN2/RB2 — Analog input 2 / digital I/O |
| Pin 5 | AN3/RB3 — Analog input 3 / digital I/O |
| Pin 6 | AN4/RB4 — Analog input 4 / digital I/O |
| Pin 7 | VSS — Ground reference |
| Pin 8 | OSC1/CLKI — Oscillator crystal input / external clock input |
| Pin 9 | OSC2/CLKO — Oscillator crystal output / clock output |
| Pin 10 | VDD — Positive supply (3 V to 3.6 V) |
| Pin 11 | AN5/RB5 — Analog input 5 / digital I/O |
| Pin 12 | AN6/RB6 — Analog input 6 / digital I/O |
| Pin 13 | AN7/RB7 — Analog input 7 / digital I/O |
| Pin 14 | AN8/RB8 — Analog input 8 / digital I/O |
| Pin 15 | AN9/RB9 — Analog input 9 / digital I/O |
| Pin 16 | VSS — Ground reference |
| Pin 17 | AN10/RB10 — Analog input 10 / digital I/O |
| Pin 18 | AN11/RB11 — Analog input 11 / digital I/O |
| Pin 19 | AN12/RB12 — Analog input 12 / digital I/O |
| Pin 20 | AN13/RB13 — Analog input 13 / digital I/O |
| Pin 21 | AN14/RB14 — Analog input 14 / digital I/O |
| Pin 22 | AN15/RB15 — Analog input 15 / digital I/O |
| Pin 23 | VDD — Positive supply (3 V to 3.6 V) |
| Pin 24 | PGED1/RP40 — ICSP data 1 / remappable peripheral pin |
| Pin 25 | PGEC1/RP39 — ICSP clock 1 / remappable peripheral pin |
| Pin 26 | PGED2/RP38 — ICSP data 2 / remappable peripheral pin |
| Pin 27 | PGEC2/RP37 — ICSP clock 2 / remappable peripheral pin |
| Pin 28 | AVSS — Analog ground reference |
Aplicaciones típicas
DSPIC33EP32GS502T-I/MM es adecuado para 6 aplicacións: Interleaved Power Factor Correction, ZVS Full-Bridge AC-DC Converters, Digital Switch-Mode Power Supplies, Motor Control Drives, Embedded Industrial Control, Portable Instrumentation Power Management.
Interleaved Power Factor Correction
The DSPIC33EP32GS502T-I/MM is the control heart of Microchip's Interleaved PFC reference design, which accepts universal AC input and produces a single high-voltage DC output up to 350 W. The device's 70 MIPS core executes inner average-current and outer voltage loops with deterministic latency, while the Peripheral Trigger Generator synchronizes ADC sampling to PWM events so current feedback is captured at the optimal point in each switching cycle. Placed directly driving gate drivers from its PWM outputs, the controller achieves power factor correction near unity across the universal input range. Firmware-based control also enables seamless mode transitions between light and heavy load, something analog controllers handle poorly.
Recomendado
ZVS Full-Bridge AC-DC Converters
Microchip's 750 W AC-DC reference design demonstrates a semi-bridgeless PFC stage followed by a peak-current-controlled zero-voltage-switching full-bridge converter with digital slope compensation, implemented on the dsPIC33EP GS-series DSC family. The DSPIC33EP32GS502T-I/MM contributes the high-resolution PWM needed to implement precise phase-shift and slope compensation in firmware, while its fast ADC converts current-sense signals for cycle-by-cycle peak current control. Digital implementation achieves very high conversion efficiency because dead-time and switching instants can be adapted to operating conditions in real time. The 32 KB Flash holds both control loops plus housekeeping and communication firmware within the single 28-QFN device.
Recomendado
Digital Switch-Mode Power Supplies
The dsPIC33EPXXGS50X family is explicitly architected for common multi-loop digital SMPS designs: AC-DC front ends, isolated DC-DC bricks, and point-of-load converters. The DSPIC33EP32GS502T-I/MM replaces analog PWM controllers with firmware-executed voltage-mode, current-mode, or multi-loop control, allowing one PCB design to be retuned across output voltages by reflashing rather than redesigning the compensation network. Its 3 V to 3.6 V supply and -40C to +85C industrial grade suit enclosed server and telecom power supplies. Designers should budget Flash carefully: the 32 KB device supports full control firmware plus UART-based telemetry, while heavier stacks should step up to the pin-compatible 64 KB GS502.
Recomendado
Motor Control Drives
With a 70 MIPS DSP-enhanced core and DSP instruction support, the DSPIC33EP32GS502T-I/MM executes field-oriented control (FOC) for PMSM and BLDC motors, and V/f control for induction motors, in a single 28-QFN package. The PWM and ADC subsystems are coordinated through the Peripheral Trigger Generator so phase-current sampling occurs exactly at PWM center or valley, suppressing switching-noise artifacts in the current feedback. Its I2C, SPI, and UART connectivity links the drive to host controllers and condition-monitoring systems. For cost-sensitive consumer and industrial drives, the 32 KB Flash holds a complete FOC stack; the same footprint accommodates the 64 KB variant if sensorless observers expand code size.
Recomendado
Embedded Industrial Control
Beyond power conversion, the 70 MIPS dsPIC33E core, DSP multiply-accumulate instructions, and rich connectivity make the DSPIC33EP32GS502T-I/MM a strong fit for industrial sensing and control nodes: digital filtering of sensor streams, PID loops for process control, and protocol bridging between LINbus, UART, I2C, and SPI subsystems. The industrial -40C to +85C temperature grade and MSL 1 moisture rating simplify manufacturing and field deployment. The 28-QFN 6x6 mm footprint keeps board area minimal for dense I/O modules. Designers should exploit the multiple PGECx/PGEDx pairs to place an in-circuit programming connector at a board edge, easing firmware updates on installed equipment.
Recomendado
Portable Instrumentation Power Management
Battery-powered instruments benefit from digitally controlled conversion stages managed by the DSPIC33EP32GS502T-I/MM: the controller adapts switching frequency and burst mode to load, squeezing efficiency at light load where fixed-frequency analog controllers waste energy. Its 3 V to 3.6 V supply matches a single Li-ion cell through a small LDO, and the 70 MIPS core leaves headroom for instrument firmware alongside power-control loops. The compact 28-QFN-S package supports handheld form factors, and MSL 1 storage eliminates bake requirements before reflow. For lowest deep-sleep power, verify the family datasheet's low-power mode currents against your duty cycle before finalizing the power budget.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para DSPIC33EP32GS502T-I/MM — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | DSPIC33EP64GS502T-I/MM | DSPIC33EP32GS502T-E/MM | DSPIC33EP16GS502T-I/MM | DSPIC33EP32GP502T-I/MM | DSPIC33EP64GP502T-I/MM |
|---|---|---|---|---|---|---|
| Package | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Memory | 32 KB | 64 KB | 32 KB | 16 KB | 32 KB | 64 KB |
| Family / Peripheral Focus | GS (SMPS / digital power) | GS (SMPS / digital power) | GS (SMPS / digital power) | GS (SMPS / digital power) | GP (general purpose) | GP (general purpose) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +85C | -40C to +85C |
| Supply Voltage | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V |
| Connectivity | I2C, SPI, UART/USART, IrDA, LINbus | I2C, SPI, UART/USART, IrDA, LINbus | I2C, SPI, UART/USART, IrDA, LINbus | I2C, SPI, UART/USART, IrDA, LINbus | I2C, SPI, UART/USART | I2C, SPI, UART/USART |
Diferenciadores clave
- Purpose-built SMPS PWM peripherals (frente a DSPIC33EP32GP502T-I/MM)
- Same-footprint firmware escalation path (frente a DSPIC33EP64GS502T-I/MM)
- Extended temperature option in identical package (frente a DSPIC33EP32GS502T-E/MM)
- Trade-off: memory-constrained communication stacks (frente a DSPIC33EP64GS502T-I/MM)
Notas de diseño
Connect the QFN exposed pad to a solid ground plane with a 3x3 via array directly under the package. The exposed pad is the primary ground and thermal path for the 28-QFN-S 6x6 mm body; a floating pad degrades both signal integrity and junction-to-ambient thermal performance. Per the family datasheet programming notes, all VDD and VSS pins must be connected - do not share a single via fanout for both supply pins. Place 0.1 uF ceramic decoupling at each VDD pin within 2 mm of the pad.
In digital power layouts, separate the power-switching loop from the controller analog domain. Route ADC inputs (ANx pins) as short pairs with their return path on a quiet ground region, and keep the dv/dt nodes of the converter stage at least 5 mm away from PGECx/PGEDx programming traces to prevent spurious ICSP entries. Use the Peripheral Trigger Generator to sample current at PWM midpoint and add RC filtering (e.g., 100 ohm / 1 nF) on current-sense inputs as an anti-alias front end per Microchip's digital power reference designs.
ICSP requires matched PGECx/PGEDx pairs: if you assign PGEC2 as ICSPCLK, the data must be on PGED2 - mixing pairs across the pair boundary is the most common bring-up failure on this family (per Northern Software dsPIC33EP32GS502 programming notes). Also note the operating supply is strictly 3 V to 3.6 V; 5 V or 2.5 V rails will not work. Finally, this I-grade part is not AEC-Q100 qualified - do not reuse the BOM line in automotive builds without selecting a qualified variant.
Estimated: at 70 MIPS with all peripherals active, core current is on the order of tens of mA from a 3.3 V rail, so controller self-heating is typically well under 100 mW and rarely drives thermal design. Thermal budget pressure in digital power designs comes from adjacent power components, not the DSC - keep the controller at the board edge of the hot zone, and verify via the family datasheet's theta-JA for the MM package if your enclosure exceeds +70C ambient with the E-grade part.
Información de cumplimiento
REACH Unaffected and MSL 1 (Unlimited) per distributor specification data. ECCN 3A991A2, HTSUS 8542.31.0001. RoHS compliant. No AEC-Q100 qualification found for this I-grade commercial part.
