DSPIC33EP512GP502-H/SO - 16-bit 60MHz DSC 512KB Flash | Microchip
N.º de pieza: DSPIC33EP512GP502-H/SO ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $6.2 | $6,20 |
| 10 | $5.58 | $55,80 |
| 100 | $4.95 | $495,00 |
| 500 | $4.45 | $2.225,00 |
| 1.000 | $3.98 | $3.980,00 |
DSPIC33EP512GP502-H/SO Descripción general
A Digital Signal Controller combines the control peripherals of a microcontroller with the mathematical throughput of a DSP. In the embedded hierarchy, the DSC sits between general-purpose MCUs and dedicated DSPs, making the dsPIC33E family a natural choice for real-time closed-loop control such as digital power conversion, motor control, and digital filtering, where deterministic interrupt latency and single-cycle MAC operations matter more than raw processing throughput.
Key features include 512 KB of self-programmable Flash with ECC, 48 KB of on-chip RAM, dual on-chip operational amplifiers for analog front-end conditioning, two analog comparators, a high-speed PWM engine suited to power conversion, four DMA channels, five 16-bit timers, and a CAN 2.0B controller for automotive and industrial networking. Fifteen interrupt sources and low-power sleep/idle modes round out the peripheral set.
Architecturally, the dsPIC33E core uses an enhanced Harvard pipeline with DSP instruction extensions, including modulo and bit-reversed addressing for FFTs and FIR/IIR filters. The Peripheral Trigger Generator (PTG) automates peripheral-to-peripheral sequencing with minimal CPU intervention, freeing MIPS for control algorithms. On-chip op amps can directly interface current-sense resistors and sensor bridges, reducing external BOM count.
Typical applications include brushless DC and PMSM motor drives, digitally controlled AC-DC and DC-DC power supplies, CAN-enabled automotive and industrial sensor nodes, and general-purpose control systems requiring embedded analog and DSP filtering.
For design, place VCAP/VDDCORE decoupling per the Microchip reference layout and verify CAN transceiver timing against the system bit rate early in development.
This page synthesizes distributor availability data, drop-in same-package alternatives, pricing tiers, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para DSPIC33EP512GP502-H/SO — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con DSPIC33EP512GP502-H/SO (mismo factor de forma y huella) — difiere en Package, Core Architecture, Operating Temperature, Qualification, RAM.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
DSPIC33EP512GP502-I/SO
✅ Sustitución directa✓ En stock
$3.95 / unidad
Ver hoja de datos →DSPIC33EP256GP502-I/SO
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$3.32 / unidad
Ver hoja de datos →DSPIC33EP256MC502-H/SO
✅ Sustitución directa✓ En stock
$4.38 / unidad
Ver hoja de datos →DSPIC33EP32GP502T-E/SO
✅ Sustitución directa✓ En stock
$3.42 / unidad
Ver hoja de datos →DSPIC33EP128GP502-I/SO
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
DSPIC33EP512GP502-H/SO Valores máximos y características eléctricas
| Core Architecture | 16-bit dsPIC33E DSC core |
| Maximum CPU Speed | 60 MHz |
| Flash Program Memory | 512 KB (170K x 24) |
| RAM | 48 KB |
| Encapsulado | 28-SOIC (7.50 mm width) |
| Recuento de pines | 28 |
| On-chip Op Amps | Yes |
| Comparators | Yes |
| Peripheral Trigger Generator (PTG) | Yes |
| CAN Module | CAN 2.0B controller |
| High-Speed PWM | Yes |
| DMA Channels | 4 |
| Timers | 5 |
| Interrupt Sources | 15 |
| Qualification | AEC-Q100 (automotive) |
| Temperatura de funcionamiento | -40C to +125C (H grade) |
| Tipo de montaje | Surface Mount |
| Estado del ciclo de vida | In Production |
Guía de configuración de pines de DSPIC33EP512GP502-H/SO 28-soic (7.50 mm width)
Configuración de pines para DSPIC33EP512GP502-H/SO (encapsulado 28-soic (7.50 mm width)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para DSPIC33EP512GP502-H/SO.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
DSPIC33EP512GP502-H/SO es adecuado para 6 aplicacións: BLDC and PMSM Motor Control, Digitally Controlled Power Supplies, Automotive CAN Sensor Nodes, Industrial Sensor Conditioners and DAQ, Portable and Embedded Control Panels, Audio and Vibration Signal Processing.
BLDC and PMSM Motor Control
The 60 MHz dsPIC33E core with single-cycle MAC and DSP addressing executes field-oriented control loops at multi-kHz rates while the high-speed PWM engine generates complementary, dead-time-controlled gate signals. On-chip operational amplifiers amplify shunt current measurements, and analog comparators provide cycle-by-cycle overcurrent limiting without CPU latency. Four DMA channels stream ADC results to RAM, keeping the 15 interrupt sources deterministic. The AEC-Q100 qualification and -40C to +125C H-grade range fit automotive pumps, fans, and actuators. Using this DSC reduces external analog components since current conditioning happens on-chip, and the 512 KB Flash leaves ample room for field-updatable control firmware and parameter tables in safety-relevant drives.
Recomendado
Digitally Controlled Power Supplies
In AC-DC and DC-DC converters, the DSPIC33EP512GP502-H/SO closes voltage and current loops in software: the high-speed PWM supports phase-shifted and complementary topologies with hardware dead time, while the comparators implement fast hiccup or cycle-by-cycle current limiting during transients. The 48 KB RAM buffers logging data and compensation state, and the PTG can trigger ADC-to-PWM sequences with minimal CPU load, preserving MIPS for higher-level supervisory logic and communication. The -40C to +125C operating range suits power stages mounted near hot components, and CAN connectivity enables digitally managed power shelves in telecom or server PSU systems to report telemetry on a shared bus.
Recomendado
Automotive CAN Sensor Nodes
With its CAN 2.0B controller and AEC-Q100 qualification, the device serves as an intelligent node on automotive and industrial CAN buses. The on-chip op amps condition resistive bridge and current-sense signals directly, the 10/12-bit ADC digitizes them, and DMA moves samples without CPU intervention, while 512 KB Flash stores calibration tables and multiple firmware profiles. The H-grade -40C to +125C temperature range covers under-hood and near-engine locations. Designers should pair the CAN pins with a qualified transceiver and verify bus-load timing at the target bit rate early, since CAN frame scheduling interacts with the 15-source interrupt structure during heavy network traffic.
Recomendado
Industrial Sensor Conditioners and DAQ
The integrated analog subsystem makes this DSC a compact front-end for industrial measurement: op amps amplify small differential signals from strain gauges, thermocouple conditioning circuits, and pressure bridges, and the ADC plus DMA pipeline samples continuously into the 48 KB RAM. The PTG sequences trigger, sample, and filter operations autonomously, so the 60 MHz core remains available for DSP filtering such as FIR notch and averaging using hardware MAC instructions. The 28-SOIC footprint fits dense terminal-block boards, and the extended -40C to +125C range supports outdoor cabinets and factory-floor enclosures where ambient swings are significant across seasons.
Recomendado
Portable and Embedded Control Panels
For control panels, thermostats, and embedded HMI boards, the part provides enough compute for display refresh, keypad scanning, and control loops in one 28-pin SOIC, conserving PCB area. Remappable RP pins let engineers route UART, SPI, I2C, and PWM signals to the most convenient pads, simplifying single-layer routing on cost-sensitive panels. Sleep and idle low-power modes trim average current in battery-backed or always-on panels. With 512 KB of Flash, the same board can host several product variants and multi-language UI assets. The industrial H temperature range additionally suits rooftop HVAC controllers and refrigeration panels exposed to hot compressor compartments.
Recomendado
Audio and Vibration Signal Processing
The DSP instruction set with modulo and bit-reversed addressing executes FFTs and adaptive filters efficiently, enabling acoustic-echo cancellation, tone detection, vibration signature monitoring, and simple audio effects. The on-chip op amps can bias microphones and line inputs, and DMA keeps ADC and PWM/DAC streams gapless, avoiding clicks and dropouts. At 60 MHz the core sustains moderate sample-rate processing while the 15 interrupt sources manage UI and communication tasks. The 28-SOIC package suits compact audio accessories and condition-monitoring pucks, and 512 KB Flash holds filter coefficient tables and multiple tuning profiles selectable at manufacturing test for product differentiation.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para DSPIC33EP512GP502-H/SO — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | DSPIC33EP512GP502-I/SO | DSPIC33EP256GP502-I/SO | DSPIC33EP256MC502-H/SO | DSPIC33EP32GP502T-E/SO | DSPIC33EP128GP502-I/SO |
|---|---|---|---|---|---|---|
| Package | 28-SOIC (7.50 mm) | 28-SOIC (7.50 mm) - same | 28-SOIC (7.50 mm) - same | 28-SOIC (7.50 mm) - same | 28-SOIC (7.50 mm) - same | 28-SOIC (7.50 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Program Memory | 512 KB | 512 KB | 256 KB | 256 KB | 32 KB | 128 KB |
| Maximum CPU Speed | 60 MHz | 60 MHz | 60 MHz | 60 MHz | 60 MHz | 60 MHz |
| Operating Temperature | -40C to +125C (H grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +125C (H grade) | -40C to +125C (E grade) | -40C to +85C (I grade) |
| Op Amps / Comparators / CAN | Yes / Yes / CAN 2.0B | Yes / Yes / CAN 2.0B | Yes / Yes / CAN 2.0B | Yes / Yes / CAN (MC peripheral set) | Yes / Yes / CAN 2.0B | Yes / Yes / CAN 2.0B |
Diferenciadores clave
- Extended -40C to +125C automotive-grade operation in a low-cost SOIC (frente a DSPIC33EP512GP502-I/SO)
- Maximum Flash density within the same 28-SOIC footprint (frente a DSPIC33EP256GP502-I/SO)
- GP family peripheral balance with op amps plus CAN (frente a DSPIC33EP256MC502-H/SO)
Notas de diseño
Provide a dedicated VCAP/VDDCORE capacitor on pin 11 exactly as specified in the dsPIC33EP512GP502 family datasheet reference design; the internal core regulator is sensitive to this capacitor's value and ESR, and incorrect sizing can cause brown-out resets at 60 MHz operation. Decouple both VDD pins with 100 nF ceramics placed within 2 mm of the pins, plus 4.7-10 uF bulk per supply rail. Estimated: with a typical active current in the tens of mA range at 3.3 V, IR drop across thin traces is negligible, but shared rails with PWM-driven gate drivers can inject noise into the ADC reference.
Keep the analog inputs used with the on-chip op amps away from PWM routing on the 28-SOIC footprint; the 7.50 mm SOIC has 1.27 mm pitch, which leaves limited routing channels, so plan PPS pin assignments before layout. Reserve an ICSP header (MCLR, PGD, PGC, VDD, VSS) for MPLAB Snap programming even in production boards. Route the CAN TX/RX to RP pins with short, matched traces to the transceiver and place the transceiver's split termination near the connector.
Verify the temperature suffix before production placement: DSPIC33EP512GP502-I/SO and -H/SO are electrically identical but the I grade tops out at +85C, which is a silent derating trap in automotive and enclosure designs. Also confirm that your firmware fits the smaller Flash variants if qualifying a second source within the family, and check the Microchip silicon errata for the exact device stepping before relying on specific peripherals such as the PTG or CAN bit-timing features.
Información de cumplimiento
AEC-Q100 qualification confirmed by distributor listing (Hotenda) for this exact MPN. RoHS/REACH/lead-free status was not present in retrieved data - verify on the Microchip product page environmental section.
