DSPIC33EP64GP502T-I/SS - 16-bit DSC 70MIPS 64KB Flash | Microchip
N.º de pieza: DSPIC33EP64GP502T-I/SS ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $5.12 | $5,12 |
| 10 | $4.63 | $46,30 |
| 100 | $4.11 | $411,00 |
| 500 | $3.72 | $1.860,00 |
| 1.000 | $3.35 | $3.350,00 |
DSPIC33EP64GP502T-I/SS Descripción general
A digital signal controller is a hybrid device that combines the computational power of a digital signal processor (DSP) with the peripheral integration and control-oriented architecture of a microcontroller (MCU). Within the power-management hierarchy of embedded systems, the dsPIC33E family sits above basic 8-bit PIC MCUs and complements 32-bit ARM MCUs, occupying the product class of 16-bit Digital Signal Processors & Controllers - DSP, DSC used in real-time control loops and signal processing.
Key features include the highest-speed 70 MIPS dsPIC33E core with excellent code density, superior ADC performance for analog acquisition, CAN communication for industrial and automotive networking, the Charge Time Measurement Unit (CTMU) for capacitive touch and time-of-flight measurement, and the Peripheral Trigger Generator (PTG) for autonomous, hardware-timed peripheral sequencing. Integrated analog support such as comparators further reduces external component count.
Technically, the device uses a CMOS process with a 24-bit-wide program memory architecture (instruction word) paired with a 16-bit data bus, a DSP engine with barrel shifter for efficient data manipulation, and multiple low-power modes that suit battery-operated designs. The GP (general purpose) family variant emphasizes general-purpose peripherals for high-end general purpose applications.
Typical applications include industrial motor control and power conversion, embedded sensing and measurement systems using CTMU, and general-purpose control nodes that require CAN bus connectivity. The 28-pin SSOP footprint fits compact, cost-sensitive boards.
Design consideration: choose the I-grade (-40C to +85C) part for industrial environments; the E-grade (-40C to +125C) sibling, DSPIC33EP64GP502T-E/SS, is pin-compatible when extended temperature is required. Budget 64 KB of program memory carefully if migrating from larger Flash family members.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para DSPIC33EP64GP502T-I/SS — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con DSPIC33EP64GP502T-I/SS (mismo factor de forma y huella) — difiere en Package, Core Architecture, Operating Temperature, RAM, Supply Voltage.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
DSPIC33EP64GP502T-E/SS
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
DSPIC33EP128GP502T-I/SS
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$2.64 / unidad
Ver hoja de datos →DSPIC33EP32GP502T-I/SS
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$1.65 / unidad
Ver hoja de datos →DSPIC33EP16GP502T-I/SS
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
DSPIC33EP32MC202-I/SS
✅ Sustitución directa✓ En stock
$2.68 / unidad
Ver hoja de datos →DSPIC33EP64GP502T-I/SS Valores máximos y características eléctricas
| Core Architecture | 16-bit dsPIC33E DSC |
| Frecuencia de reloj máxima | 60 MHz |
| Core Performance | 70 MIPS |
| Program Memory (Flash) | 64 KB (22K x 24) |
| RAM | 8 KB |
| Ancho del bus de datos | 16 bit |
| Program Memory Width | 24 bit |
| Encapsulado | 28-SSOP |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | -40C to +85C (I grade) |
| Process Technology | CMOS |
| CAN Communication | Yes (CAN module) |
| CTMU | Yes (Charge Time Measurement Unit) |
| PTG | Yes (Peripheral Trigger Generator) |
| Low Power Modes | Yes |
| Barrel Shifter | Yes (DSP engine) |
| Packaging Option | Tape & Reel (T suffix) |
Guía de configuración de pines de DSPIC33EP64GP502T-I/SS 28-ssop
Configuración de pines para DSPIC33EP64GP502T-I/SS (encapsulado 28-ssop). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para DSPIC33EP64GP502T-I/SS.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
DSPIC33EP64GP502T-I/SS es adecuado para 6 aplicacións: Industrial Motor Control, Digital Power Conversion, Embedded Sensing and CTMU Measurement, CAN Industrial Networking Nodes, Real-Time Signal Processing and Data Acquisition, Portable and Low-Power Control Systems.
Industrial Motor Control
The DSPIC33EP64GP502T-I/SS fits motor control because its 70 MIPS dsPIC33E core executes field-oriented control loops fast enough for typical PWM switching frequencies, and the integrated DSP engine with barrel shifter accelerates the multiply-accumulate and shifting math that FOC demands. The Peripheral Trigger Generator (PTG) autonomously sequences PWM updates and ADC sampling without CPU intervention, reducing loop jitter. In this topology the DSC generates the PWM waveform, samples phase currents through the ADC, and closes the current/speed loop in firmware. The quantified benefit is single-chip integration: CAN, comparators and CTMU remove external glue logic, trimming BOM cost and board area versus a discrete MCU-plus-DSP solution.
Recomendado
Digital Power Conversion
The DSPIC33EP64GP502T-I/SS suits digital power supplies, PFC stages and DC-DC converters because the 70 MIPS core sustains the high sample rates needed for voltage-mode and current-mode control, while the PTG triggers ADC conversions synchronized to the PWM period for cycle-by-cycle regulation. Its superior ADC performance, cited by Microchip as a family hallmark, captures output voltage and current feedback with the precision needed for tight regulation. Deployed between the power stage and the feedback divider, the DSC computes duty-cycle corrections each switching cycle in firmware. The trade-off is that firmware-based control adds development effort, but it enables adaptive compensation and field updates that analog controllers cannot match.
Recomendado
Embedded Sensing and CTMU Measurement
The DSPIC33EP64GP502T-I/SS is a natural fit for capacitive touch and precision timing measurement because of its integrated Charge Time Measurement Unit (CTMU), which Microchip includes in the GP family alongside superior ADC performance. The CTMU measures charge time with sub-nanosecond-class resolution, enabling capacitive touch keys, proximity sensing and time-of-flight ultrasonic flow measurement without an external analog front end. In a typical design, sensor electrodes connect directly to CTMU-capable pins, and firmware calibrates the charge current and acquisition window. The quantified benefit is a reduction in external components and cost per touch channel; the design consideration is careful PCB guard routing to suppress parasitic capacitance and EMI around the CTMU inputs.
Recomendado
CAN Industrial Networking Nodes
The DSPIC33EP64GP502T-I/SS serves industrial fieldbus nodes because Microchip's GP family integrates CAN communication on-chip, removing the need for a standalone CAN controller and its SPI interconnect. Per the Microchip product description, the dsPIC33E GP family combines CAN with high 70 MIPS throughput, so the node can run its local control loop and service the CAN stack concurrently. Placed between the CAN transceiver and the local actuator/sensor circuitry, the DSC filters, processes and responds to bus traffic with deterministic latency. The concrete benefit is one-chip node cost and lower software complexity; designers must still add an external CAN transceiver and proper bus termination (typically 120 ohms) at the physical layer.
Recomendado
Real-Time Signal Processing and Data Acquisition
The DSPIC33EP64GP502T-I/SS handles real-time DSP tasks such as filtering, FFT pre-processing and sensor-fusion math because its core is a true digital signal controller: the DSP engine, 24-bit instruction pipeline and hardware barrel shifter execute shifting and accumulation far faster than generic MCU emulation. Microchip highlights the family's 70 MIPS as the highest speed in this class with excellent code density, and 8 KB of RAM buffers block-based processing adequately for narrowband audio and vibration channels. The device typically streams ADC samples into RAM, applies FIR/IIR filters, and forwards results over UART or CAN. The trade-off is the 16-bit data path: for heavy 32-bit float workloads, a 32-bit MCU may be preferable.
Recomendado
Portable and Low-Power Control Systems
The DSPIC33EP64GP502T-I/SS fits battery-powered instruments because Microchip's dsPIC33E devices support multiple low-power modes, letting the 70 MIPS core sleep between events and wake on peripheral interrupt. CMOS process technology keeps static consumption low, and the compact 28-SSOP package suits space-constrained handheld housings. In a typical portable design, the DSC sleeps in Idle or Doze mode, wakes on timer or sensor interrupt, executes a measurement using the CTMU or ADC, then transmits results before returning to sleep. The quantified benefit is duty-cycled average current far below active-mode consumption; the design consideration is verifying wake-up latency against your sensor sampling schedule.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para DSPIC33EP64GP502T-I/SS — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | DSPIC33EP64GP502T-E/SS | DSPIC33EP128GP502T-I/SS | DSPIC33EP32GP502T-I/SS | DSPIC33EP32MC202-I/SS |
|---|---|---|---|---|---|
| Package | 28-SSOP | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Performance | 70 MIPS at 60 MHz | 70 MIPS at 60 MHz | 70 MIPS at 60 MHz | 70 MIPS at 60 MHz | 70 MIPS at 60 MHz |
| Flash Program Memory | 64 KB (22K x 24) | 64 KB (22K x 24) | 128 KB (44K x 24) | 32 KB (11K x 24) | 32 KB (11K x 24) |
| Operating Temperature | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +85C | -40C to +85C |
| Peripheral Family | GP (general purpose, CAN/CTMU/PTG) | GP - same | GP - same | GP - same | MC (motor control PWM) |
| Lifecycle Status | Active | Active | Active | Active | Active |
Diferenciadores clave
- Largest Flash in the 28-SSOP GP502 industrial-grade group at this price tier (frente a DSPIC33EP32GP502T-I/SS)
- General-purpose peripheral set including CAN, CTMU and PTG (frente a DSPIC33EP32MC202-I/SS)
- Cost-optimized industrial grade for standard environments (frente a DSPIC33EP64GP502T-E/SS)
- Trade-off: not the largest memory option (frente a DSPIC33EP128GP502T-I/SS)
Notas de diseño
Estimated: dsPIC33E-class devices in active operation draw on the order of tens of mA from a 3.3V rail; budget the local 3.3V regulator for at least 100 mA per DSC plus peripheral loads. Place a 0.1 uF ceramic decoupling capacitor at each VDD/VSS pair as close to the pins as possible, plus bulk 10 uF at the board level. Verify exact current figures in the manufacturer datasheet DC Characteristics section before finalizing the regulator, as they depend on clock frequency and active peripherals.
The 28-SSOP has 0.65 mm pin pitch - design the land pattern per the Microchip datasheet mechanical drawing and verify paste aperture to avoid bridging on this fine pitch. Route the oscillator traces (OSC1/OSC2) short and away from CAN_H/CAN_L and PWM outputs to prevent coupling. For CAN operation, keep the transceiver within a few centimeters of the CAN peripheral TX/RX pins and place the 120-ohm termination at the physical bus ends, not at each node.
Do not mix temperature grades in the same BOM line: the I-grade part (this MPN) is limited to +85C while the E/SS variant reaches +125C; a substitution error surfaces only in thermal chamber testing. Also, drop-in alternatives differ in Flash size - a firmware image compiled with 64 KB utilization will not fit the 16 KB or 32 KB variants, so check the map file before qualifying DSPIC33EP32GP502T-I/SS or DSPIC33EP16GP502T-I/SS as substitutes. Always program configuration bits for oscillator source; the DSC will not run from the intended PLL otherwise.
Información de cumplimiento
Compliance status was not stated in the provided verified web data; confirm RoHS/REACH status on the official Microchip product page before procurement.
