DSPIC33EP64GS806-E/PT - 70 MIPS 16-bit Digital Power DSC | Microchip
N.º de pieza: DSPIC33EP64GS806-E/PT ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $6.5 | $6,50 |
| 10 | $6.1 | $61,00 |
| 100 | $5.6 | $560,00 |
| 500 | $5.2 | $2.600,00 |
| 1.000 | $4.8 | $4.800,00 |
DSPIC33EP64GS806-E/PT Descripción general
A digital signal controller combines a microcontroller's peripherals and flash memory with a digital signal processor's math engine, sitting in the system hierarchy between a standard MCU and a dedicated DSP. In the dsPIC33EPXXGS70X/80X family, this hybrid architecture targets digital switch-mode power supply (SMPS) and power-conversion designs where fast control loops and dense PWM resources matter.
Key features include interconnected high-speed PWM modules, an on-chip ADC with programmable gain amplifier (PGA) and comparators that can be wired internally to the PWM for near-loop-latency current-mode control, plus dual partition flash enabling live firmware updates for field upgrades. A CAN module supports industrial and automotive networking, and the barrel shifter, DSP multiply-accumulate engine and multiple internal bus architectures accelerate control-law computations.
According to Microchip's dsPIC33EPXXXGS70X/80X family datasheet (DS70005258C), these devices support multi-loop digital power topologies such as AC-to-DC converters and interleaved power factor correction. The 70 MIPS core at 60 MHz allows execution of multiple control loops per switching cycle.
Typical applications include AC-DC converters, interleaved PFC front ends, DC-DC modules, solar micro-inverters, automotive power modules and digital lighting ballasts.
Design-wise, leverage the dual partition flash for fail-safe firmware updates, and minimize the ADC-to-PWM trigger latency in layout by keeping sense routing short.
This page synthesizes distributor pricing (LCSC, DigiKey, Mouser), drop-in family alternatives, and practical design guidance not consolidated in the manufacturer datasheet.
Alternativas directas para DSPIC33EP64GS806-E/PT — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con DSPIC33EP64GS806-E/PT (mismo factor de forma y huella) — difiere en Operating Temperature, Package, Boundary Scan, Core Architecture, DSP Features.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
DSPIC33EP128GS806-E/PT
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
DSPIC33EP32GS806-E/PT
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
DSPIC33EP64GS802-E/PT
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
DSPIC33EP64GS806-E/PT Valores máximos y características eléctricas
| Core Architecture | 16-bit dsPIC DSC |
| Maximum Core Speed | 70 MIPS |
| Core Clock | 60 MHz |
| Flash Program Memory | 64 KB |
| RAM | 8 KB |
| Tensión de alimentación | 3.3 V |
| CAN | Yes |
| Dual Partition Flash | Yes |
| On-chip Peripherals | High-speed PWM, ADC with PGA, comparators |
| Qualification | AEC-Q100 qualified |
| Temperatura de funcionamiento | -40C to +125C (E grade) |
| Encapsulado | 64-TQFP (10x10 mm) |
| Tipo de montaje | Surface Mount |
| Packaging | Tray |
| Technology | CMOS |
| DSP Features | Barrel shifter, MAC engine, multiple internal bus architectures |
| Boundary Scan | Yes |
| Estado del ciclo de vida | In Production |
Guía de configuración de pines de DSPIC33EP64GS806-E/PT 64-tqfp (10x10 mm)
Configuración de pines para DSPIC33EP64GS806-E/PT (encapsulado 64-tqfp (10x10 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para DSPIC33EP64GS806-E/PT.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
DSPIC33EP64GS806-E/PT es adecuado para 6 aplicacións: AC-DC Power Supplies, Interleaved Power Factor Correction (PFC), DC-DC Converters and Point-of-Load Modules, Automotive Power Conversion, Solar Micro-Inverters and Renewable Energy Converters, Industrial Lighting and Digital Ballasts.
AC-DC Power Supplies
The DSPIC33EP64GS806-E/PT directly targets AC-to-DC converter control with its interconnected high-speed PWM modules, on-chip ADC with programmable gain amplifier and comparators. The ADC can sample the inductor current and output voltage and update PWM duty cycle within a single switching cycle, while the on-chip comparators provide hardware-level cycle-by-cycle current limiting without CPU intervention. According to Microchip, the dsPIC33EPXXGS70X/80X family explicitly supports common multi-loop digital SMPS architectures, so voltage-mode, current-mode and average-current-mode control schemes are all implementable in firmware. The 70 MIPS core executes the compensation algorithm with predictable latency, and the dual partition flash allows firmware field updates to revise control coefficients after deployment. The 3.3 V single-supply operation simplifies auxiliary power design in enclosed adapter and server PSU platforms.
Recomendado
Interleaved Power Factor Correction (PFC)
Microchip provides an Interleaved PFC reference design based on this DSC family that operates from universal input voltage and produces a single high-voltage DC output up to 350 W. The DSPIC33EP64GS806-E/PT handles both interleaved phase-current balancing and the output voltage loop: each phase's current is sensed through the ADC/PGA path, while the interconnected PWM units keep two converter legs phase-shifted precisely, minimizing input current ripple and EMI filter size. Digital implementation allows adaptive phase shedding at light load to preserve efficiency, something fixed-analog controllers cannot easily do. The on-chip comparators provide fast overcurrent protection per phase, and the 125C-rated E grade suits sealed outdoor power-factor-correction stages in LED drivers and telecom rectifiers.
Recomendado
DC-DC Converters and Point-of-Load Modules
For DC-DC conversion, the DSPIC33EP64GS806-E/PT offers the fast deterministic control loop needed for buck, boost, buck-boost and LLC topologies. The interconnected PWM with dedicated time-base and the ADC with PGA allow sense-amplifier-free current sampling when paired with low-value shunt resistors, reducing BOM cost in compact power modules. Its 70 MIPS throughput supports multi-rail sequencing within one device, replacing several analog controllers in a server or telecom board. Digital telemetry over CAN or UART enables power-management integration, letting a host read voltages, currents and temperature. The dual partition flash supports live firmware updates so efficiency-tuning firmware revisions can ship without recalls. The 10x10 mm TQFP fits within typical brick and POL module footprints.
Recomendado
Automotive Power Conversion
With AEC-Q100 qualification and a -40C to +125C operating range, the DSPIC33EP64GS806-E/PT is specified for automotive digital power applications such as on-board chargers, DC-DC converters in EV power distribution, LED headlight drivers and 48 V accessory power systems. Distributor data explicitly categorizes this MPN as automotive-grade. The integrated CAN interface connects the power controller to vehicle networks for status reporting and fault diagnostics, while the interconnected PWM/ADC architecture delivers the fast loop response required by LLC and phase-shifted full-bridge automotive converters. Designers should apply Microchip automotive functional-safety documentation where ASIL-rated functions are targeted, since AEC-Q100 covers device reliability qualification rather than functional safety certification.
Recomendado
Solar Micro-Inverters and Renewable Energy Converters
Grid-tied micro-inverter and MPPT converter designs benefit from the DSPIC33EP64GS806-E/PT's combination of high-speed PWM, precision ADC/PGA sensing and DSP math acceleration. The 70 MIPS core with multiply-accumulate engine executes maximum-power-point-tracking algorithms alongside the inverter current-control loop, and the digital architecture allows MPPT update rate tuning per irradiance conditions - a flexibility analog MPPT controllers lack. On-chip comparators provide hardware anti-islanding and overcurrent protection paths with microsecond response, independent of software. The extended -40C to +125C temperature grade matches rooftop and outdoor enclosure environments, and CAN or UART telemetry supports fleet monitoring and diagnostics in distributed solar installations.
Recomendado
Industrial Lighting and Digital Ballasts
High-intensity discharge and LED driver ballasts use the DSPIC33EP64GS806-E/PT for resonant and phase-controlled conversion with dimming algorithms implemented digitally. The interconnected PWM supports precise frequency and phase control needed by LLC resonant ballast stages, while the ADC/PGA path samples lamp current for closed-loop brightness regulation at 70 MIPS loop rates. Digital dimming profiles, thermal foldback and DALI-style communication can all reside in the same 64 KB flash image. The dual partition flash enables in-field firmware updates to revise dimming curves, and the 125C rating tolerates enclosed luminaire temperatures. Microchip's digital power family documentation lists lighting power conversion among the target SMPS applications for the GS series.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para DSPIC33EP64GS806-E/PT — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | DSPIC33EP128GS806-E/PT | DSPIC33EP32GS806-E/PT | DSPIC33EP64GS802-E/PT |
|---|---|---|---|---|
| Package | 64-TQFP (10x10 mm) | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Program Memory | 64 KB | 128 KB | 32 KB | 64 KB |
| AEC-Q100 Qualification | Yes | Yes (E grade) | Yes (E grade) | Yes (E grade) |
Diferenciadores clave
- Balanced 64 KB flash optimizes cost (frente a DSPIC33EP128GS806-E/PT)
- Full peripheral set vs reduced sub-variant (frente a DSPIC33EP64GS802-E/PT)
- Extended-temperature automotive grade (frente a Standard (non-E) family variants)
Notas de diseño
The DSPIC33EP64GS806-E/PT runs from a single 3.3 V rail. Decouple each VDD pin with 0.1 uF ceramic capacitors placed within 2 mm of the pin, and provide one bulk 10 uF capacitor near the device. For digital power applications, isolate the DSC's analog supply (AVDD) from switching-node noise using an RC or ferrite filter; the ADC/PGA accuracy of current-sense channels directly determines control-loop quality. Estimated: a 0.1 uF + 10 uF network typically keeps VDD ripple below 50 mV under a 70 MIPS core load.
Minimize the loop latency between current-sense inputs and PWM updates: route shunt/amplifier signals to ADC-dedicated pins with short, guarded traces away from switch nodes, and place the DSC physically close to the gate-driver stage. Trigger the ADC from the PWM module rather than software so sampling aligns with the switching period mid-point (center of off-time for buck-type converters), avoiding switching-edge noise in readings. Use the on-chip comparators wired internally to PWM fault inputs for cycle-by-cycle current limit rather than routing trip signals externally.
Exploit dual partition flash correctly: in field-updatable products, reserve one partition for the running image and the other for updates, but verify your bootloader accounts for the unpartitioned 0x000000-0x00b000 address behavior described in Microchip's device documentation - a mismatch can brick units during OTA. Also, do not assume the /PT tray version suits automated assembly: for volume SMT lines, order the tape-and-reel DSPIC33EP64GS806T-E/PT to avoid tray-handling issues on pick-and-place feeders.
Estimated: at 70 MIPS with multiple PWM and ADC peripherals active, core current is typically in the tens of mA range, keeping self-heating well under the 125C ceiling at moderate ambient temperatures. However, in sealed automotive enclosures where ambient reaches 105C, verify junction temperature using the TQFP theta-JA from the family datasheet and subtract device dissipation; derate maximum MIPS operation if necessary, or improve PCB copper area under the 10x10 mm TQFP thermal pattern.
Información de cumplimiento
Distributor data explicitly identifies the part as automotive AEC-Q100 qualified. RoHS/REACH/lead-free status was not stated in the provided verified web data and must be confirmed on the Microchip product page or datasheet.
