DSPIC33EP64MC502-I/SP - 16-bit 70 MIPS Motor Control DSC | Microchip
N.º de pieza: DSPIC33EP64MC502-I/SP ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $4.72 | $4,72 |
| 10 | $4.25 | $42,50 |
| 100 | $3.78 | $378,00 |
| 500 | $3.35 | $1.675,00 |
| 1.000 | $2.98 | $2.980,00 |
DSPIC33EP64MC502-I/SP Descripción general
A digital signal controller is a hybrid device that merges the deterministic control structure of a microcontroller with the mathematical throughput of a digital signal processor. Within the power management and embedded hierarchy, a DSC sits between a general-purpose MCU and a dedicated DSP, making it the natural choice for closed-loop systems that need both fast multiply-accumulate operations and rich control peripherals.
Key features of the DSPIC33EP64MC502-I/SP include a 16-bit pipeline core executing at 60 MHz (70 MIPS), a dedicated Motor Control PWM (MCPWM) module for complementary and center-aligned PWM generation, a Quadrature Encoder Interface (QEI) for position feedback, and CMOS technology with a 3.0 V to 3.6 V supply range per distributor datasheet summaries.
Technically, the dsPIC33EP family integrates DSP instructions, a high-speed PWM with dead-time control, and enhanced analog peripherals. The 28-pin PDIP package makes this variant especially popular for prototyping, educational platforms, and through-hole production assemblies where rework must be simple.
Typical applications include brushless DC motor control, permanent magnet synchronous motor drives, digital power supplies, and sensorless FOC systems. The integrated MCPWM and QEI peripherals directly serve precision motion products.
Design consideration: the supply must be held within the 3.0 V to 3.6 V window, and the through-hole package adds lead inductance compared to surface-mount siblings, so decoupling capacitors should be placed very close to VDD pins.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para DSPIC33EP64MC502-I/SP — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con DSPIC33EP64MC502-I/SP (mismo factor de forma y huella) — difiere en Package, Operating Temperature, Supply Voltage, SRAM, Core Architecture.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
DSPIC33EP64MC202-I/SP
✅ Sustitución directa✓ En stock
$3.1 / unidad
Ver hoja de datos →DSPIC33EP64GP502-I/SP
✅ Sustitución directa✓ En stock
$3.55 / unidad
Ver hoja de datos →DSPIC33EP64MC502-I/SS
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
DSPIC33EP64MC502-I/SO
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
DSPIC33EP64MC502-E/SP
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
DSPIC33EP64MC502-I/SP Valores máximos y características eléctricas
| Core | dsPIC33E 16-bit DSC core |
| Max MIPS | 70 MIPS |
| Clock Speed | 60 MHz |
| Program Memory (Flash) | 64 KB (22K x 24) |
| SRAM | 8 KB |
| Tensión de alimentación | 3.0 V to 3.6 V |
| Temperatura de funcionamiento | -40C to +85C |
| Encapsulado | 28-pin SPDIP (SP), through-hole |
| Tipo de montaje | Through-Hole |
| Technology | CMOS |
| Special Peripherals | MCPWM, QEI |
| Product Family | dsPIC33EP64MC502 |
| Ancho del bus de datos | 16 bit (core); distributor summaries list 8-bit ROM organization - see datasheet |
| Lifecycle Stage | ACTIVE |
Guía de configuración de pines de DSPIC33EP64MC502-I/SP 28-pin spdip (sp), through-hole
Configuración de pines para DSPIC33EP64MC502-I/SP (encapsulado 28-pin spdip (sp), through-hole). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para DSPIC33EP64MC502-I/SP.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
DSPIC33EP64MC502-I/SP es adecuado para 6 aplicacións: BLDC Motor Control, PMSM / FOC Servo Drives, Digital Power Supplies, Sensorless Motor Control, Industrial Embedded Control, Prototyping and Education.
BLDC Motor Control
Brushless DC motor drives are the primary design target of the dsPIC33EP64MC502. The 70 MIPS dsPIC core executes commutation and current-loop control with cycle-level determinism, while the dedicated Motor Control PWM (MCPWM) module generates the three-phase complementary PWM signals with programmable dead-time insertion, protecting the inverter half-bridges from shoot-through. The Quadrature Encoder Interface (QEI) decodes position feedback from incremental encoders without software overhead, and 8 KB of SRAM holds control states and current-sampling buffers. Placed between the gate-driver stage and the host system, the DSC closes speed and current loops at tens of kilohertz; unlike general-purpose MCUs, the hardware PWM and QEI remove timing jitter that would otherwise cause torque ripple and acoustic noise.
Recomendado
PMSM / FOC Servo Drives
Permanent magnet synchronous motor drives using field-oriented control benefit directly from the DSP multiply-accumulate capability of the dsPIC33EP core. The 70 MIPS throughput supports Clarke/Park transforms, PI current regulators, and a space-vector PWM modulator within a single PWM period at switching frequencies typical of servo drives. The MCPWM module's center-aligned mode minimizes current ripple and works with the QEI to supply rotor angle at high resolution. The 64 KB Flash of the /SP variant stores FOC code plus position tables and communication stacks; the 8 KB SRAM holds observer states for sensorless extensions. The trade-off versus larger dsPIC33EP parts is peripheral count - 28 pins limit auxiliary I/O, so PMSM designs should reserve pins for encoder, current sense, and protection inputs.
Recomendado
Digital Power Supplies
Switching power converters such as LLC, buck, and PFC stages are well served by the DSPIC33EP64MC502-I/SP. The high-speed MCPWM module produces precise, phase-shiftable PWM edges with nanosecond-class resolution, enabling zero-voltage-switching timing in LLC converters, and the fast core closes voltage and current loops digitally. The 3.0 V to 3.6 V supply and CMOS process keep controller power modest, while the 60 MHz clock provides timing resolution adequate for kHz-range converter switching. Firmware stored in the 64 KB Flash can implement soft-start, fault handling, and telemetry without analog compensation networks. Compared with dedicated digital-power ASICs, this DSC gives full firmware flexibility for multi-protocol designs, at the cost of requiring careful software verification for safety-critical converters.
Recomendado
Sensorless Motor Control
Sensorless BLDC and PMSM drives use back-EMF or observer-based position estimation instead of encoders, and the dsPIC33EP64MC502-I/SP supports this with its DSP core and high-speed PWM. Sliding-mode or MRAS observers run at the PWM frequency in the 8 KB SRAM, using the multiply-accumulate instructions of the 70 MIPS core, while the MCPWM module injects the brief floating-phase sampling windows needed for back-EMF detection. The 64 KB Flash accommodates the observer code, startup sequencing, and protection logic simultaneously. This variant suits cost-sensitive fans, pumps, and appliances where eliminating the encoder saves bill-of-material cost; designs needing extreme low-speed torque should instead budget for the QEI and an encoder, which this same part supports without hardware change.
Recomendado
Industrial Embedded Control
General industrial nodes - pumps, actuators, conveyors, and process sensors - use the DSPIC33EP64MC502-I/SP where deterministic real-time response matters more than raw megahertz. The industrial -40C to +85C rating of the -I suffix matches factory floor conditions, and the 28-pin SPDIP through-hole package simplifies prototyping, field repair, and low-volume hand assembly in legacy-friendly equipment. The dsPIC33EP peripheral set handles UART, SPI, and I2C communication with supervisory PLCs alongside real-time control loops. The 64 KB Flash retains firmware plus configuration tables and logging; the CMOS process keeps standby power low. Compared with a general-purpose PIC16/18, the DSP capability accelerates filtering and control mathematics, and compared with a full PLC module, the single-chip solution cuts cost per node substantially.
Recomendado
Prototyping and Education
The 28-pin SPDIP package makes the DSPIC33EP64MC502-I/SP the natural dsPIC33EP choice for breadboards, university labs, and hobby motor-control projects. Through-hole leads accept solderless breadboards and machined-pin sockets, enabling quick peripheral experiments with MCPWM, QEI, ADC, and communication modules before committing to a PCB. Programming uses standard ICSP via any PGECx/PGEDx pair (kept as a matched pair per Microchip documentation) with PICkit-class tools and MPLAB X IDE with the XC16 compiler, all free of charge. The identical die across /SP, /SO, /SS, and /MM package variants means prototype firmware transfers unchanged to production packages, eliminating a common porting risk. The 64 KB Flash provides generous room for learner code, and the 70 MIPS core demonstrates real DSP techniques on affordable hardware.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para DSPIC33EP64MC502-I/SP — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | DSPIC33EP64MC202-I/SP | DSPIC33EP64GP502-I/SP | DSPIC33EP64MC502-I/SS | DSPIC33EP64MC502-I/SO | DSPIC33EP64MC502-E/SP |
|---|---|---|---|---|---|---|
| Package | 28-pin SPDIP | 28-pin SPDIP - same | 28-pin SPDIP - same | 28-pin SSOP (surface-mount) | 28-pin SOIC (surface-mount) | 28-pin SPDIP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Program Memory | 64 KB (22K x 24) | 32 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Core Performance | 70 MIPS at 60 MHz | 70 MIPS at 60 MHz | 70 MIPS at 60 MHz | 70 MIPS at 60 MHz | 70 MIPS at 60 MHz | 70 MIPS at 60 MHz |
| Motor Control Peripherals | MCPWM + QEI | MCPWM + QEI | General-purpose set (no dedicated MCPWM/QEI focus) | MCPWM + QEI | MCPWM + QEI | MCPWM + QEI |
| Operating Temperature | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | Extended (E) temperature range - see datasheet |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
Diferenciadores clave
- Largest Flash in the 28-pin SPDIP motor-control group (frente a DSPIC33EP64MC202-I/SP)
- Dedicated motor-control peripherals (frente a DSPIC33EP64GP502-I/SP)
- Through-hole SPDIP package for prototyping and field service (frente a DSPIC33EP64MC502-I/SS)
Notas de diseño
Power the DSPIC33EP64MC502-I/SP strictly within its 3.0 V to 3.6 V window per distributor datasheet summaries. Use a 3.3 V LDO or buck with at least 100 mA headroom and place a 0.1 uF ceramic capacitor at each VDD pin plus one bulk 4.7 uF to 10 uF capacitor near the device. Because the SPDIP through-hole leads add inductance, keep the decoupling loop short - mount the ceramics on the MCU side of the board directly at the socket pins. Motor-control designs should isolate the analog supply of the ADC from the noisy gate-driver supply with an RC filter or ferrite to preserve current-sampling accuracy.
ICSP programming uses the PGECx/PGEDx pairs, and per Microchip programming documentation any pair may be used, but pins within a pair must be used together: if PGEC2 carries ICSPCLK, PGED2 must carry ICSPDAT. Sharing these pins with application circuitry (for example an encoder or UART) is allowed but can block programming if the load is heavy - add series resistors of around 100 to 470 ohms on shared nets. Also ensure all VSS and VDD pins are connected during programming, and reserve a header exposing the pair chosen for production programming before layout freeze.
In motor-control layouts, route the MCPWM outputs to gate drivers away from the QEI encoder inputs to prevent PWM switching edges from corrupting position counts; ground guard traces or ground-plane separation help. Keep ADC current-sense traces short and paired with a quiet ground return, and sample synchronously with MCPWM using the ADC trigger feature rather than free-running sampling to avoid switching-noise contamination. For SPDIP prototypes on sockets, verify socket contact resistance is low on the oscillator pins, since high-impedance contacts can cause crystal startup failures at 60 MHz operation with a PLL.
Información de cumplimiento
Compliance attributes were not stated verbatim in the verified web data. Microchip standard production of this active part is typically RoHS/lead-free; confirm on the Microchip product page compliance certificate before export shipments.
