DSPIC33EV256GM106T-I/MR - 16-bit 70 MIPS 5V DSC 256KB | Microchip
N.º de pieza: DSPIC33EV256GM106T-I/MR ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $5.35 | $5,35 |
| 10 | $4.86 | $48,60 |
| 100 | $4.42 | $442,00 |
| 500 | $4.05 | $2.025,00 |
| 1.000 | $3.72 | $3.720,00 |
DSPIC33EV256GM106T-I/MR Descripción general
A digital signal controller combines the computational horsepower of a DSP core with the peripheral integration and ease of use of a microcontroller. Within the power-management hierarchy of embedded systems, a DSC such as the dsPIC33EV family sits between general-purpose MCUs and dedicated DSPs, providing deterministic control loops plus digital signal processing in a single chip. The dsPIC33EV is Microchip's 5V-tolerant DSC generation, purpose-built for harsh electrical environments.
Key features include the 5V operating range that eliminates level shifting to automotive and industrial sensors, ECC (error-correcting code) Flash for functional-safety-oriented designs, up to 70 MIPS instruction throughput, and integrated analog and motor-control peripherals including PWM, SENT, and on-chip op amps. The device belongs to the Functional Safety (FuSa) supported dsPIC33EV line.
Architecturally, the dsPIC DSC core uses a modified Harvard bus structure with multiple internal buses, enabling single-cycle MAC and DSP-class math while retaining deterministic interrupt latency for real-time control. Flash program memory is 256KB organized as 24-bit instruction words, with 16KB of SRAM data memory.
Typical applications include automotive body and powertrain-adjacent modules, appliance motor control, industrial automation nodes, and electric power steering and pump controllers where 5V sensor interfaces and SENT connectivity are required.
Design consideration: the 64-VQFN exposed pad must be soldered to a grounded copper pour for thermal and signal-integrity performance; also budget decoupling capacitors at every VDD pin pair per the manufacturer datasheet.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para DSPIC33EV256GM106T-I/MR — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con DSPIC33EV256GM106T-I/MR (mismo factor de forma y huella) — difiere en Package, Operating Temperature, RAM, Core Architecture, Product Family.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
DSPIC33EV256GM106-I/MR
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →DSPIC33EV256GM106-E/MR
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
DSPIC33EV256GM106-H/MR
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
DSPIC33EV128GM106-I/MR
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$3.3 / unidad
Ver hoja de datos →DSPIC33EV256GM006-I/MR
✅ Sustitución directa✓ En stock
$4.1 / unidad
Ver hoja de datos →DSPIC33EV256GM106T-I/MR Valores máximos y características eléctricas
| Core | dsPIC 16-bit DSC |
| CPU Speed | 70 MIPS |
| Tensión de alimentación | 5 V |
| Flash Program Memory | 256 KB (85.5K x 24) |
| RAM | 16 KB |
| Flash ECC | Yes (ECC Flash) |
| Encapsulado | 64-VQFN (9x9 mm) exposed pad |
| Temperatura de funcionamiento | -40C to +85C |
| Tipo de montaje | Surface Mount |
| Peripherals | PWM, SENT, Op Amps, advanced analog |
| Product Family | dsPIC33EV, Functional Safety (FuSa) |
| Bus Architecture | Multiple internal bus |
| Packaging Type | Tape & Reel (T suffix) |
| Estado RoHS | unknown |
| AEC-Q100 | unknown |
Guía de configuración de pines de DSPIC33EV256GM106T-I/MR 64-vqfn (9x9 mm) exposed pad
Configuración de pines para DSPIC33EV256GM106T-I/MR (encapsulado 64-vqfn (9x9 mm) exposed pad). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para DSPIC33EV256GM106T-I/MR.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
DSPIC33EV256GM106T-I/MR es adecuado para 6 aplicacións: Automotive Body and Sensor Modules, Appliance Motor Control, Industrial Automation Nodes, Electric Pump and Compressor Controllers, Power Conversion and Digital Power Supplies, Sensor Signal Acquisition Systems.
Automotive Body and Sensor Modules
The DSPIC33EV256GM106T-I/MR fits automotive-adjacent modules because its native 5V supply interfaces directly with 12V-domain sensor conditioning and the integrated SENT peripheral decodes SAE J2716 sensor streams in hardware, offloading the CPU. The 70 MIPS core executes closure-rate and diagnostic algorithms with margin, while 256KB ECC Flash protects code integrity against electrical noise typical of vehicle harnesses. Designers typically map SENT and LIN-capable UART pins via Peripheral Pin Select, and the -40C to +85C range covers cabin and engine-bay-adjacent electronics. The Functional Safety (FuSa) supported product line further eases ISO 26262-adjacent documentation work.
Recomendado
Appliance Motor Control
For washing machines, fans, and compressors, the DSPIC33EV256GM106T-I/MR provides high-resolution PWM outputs for inverter drive stages and on-chip op amps that condition shunt-resistor current feedback without external amplifier ICs. The 70 MIPS 5V core runs sensorless FOC or six-step algorithms with fast interrupt service, and ECC Flash maintains code integrity through noisy motor commutation transients. A typical design uses the DSC to generate complementary PWM pairs with dead-time, sample phase currents via the internal ADC and op amps, and communicate with the appliance main controller over UART - all from the single 5V rail common in appliance boards, eliminating level-shifting circuitry.
Recomendado
Industrial Automation Nodes
In factory equipment, the DSPIC33EV256GM106T-I/MR serves as a compact control node: its 5V tolerance connects directly to legacy industrial sensor levels, PWM outputs drive actuators and heater stages, and remappable UART/SPI ports link to RS-485 transceivers via Peripheral Pin Select. The 256KB Flash accommodates protocol stacks plus application logic, while the 70 MIPS core handles concurrent PID loops at kilohertz rates. The -40C to +85C rating suits unconditioned cabinets, and the 64-VQFN 9x9 footprint fits dense I/O boards. ECC Flash reduces field-failure risk in installations where firmware corruption from EMI is a known service cost.
Recomendado
Electric Pump and Compressor Controllers
Pump and compressor drives benefit from the DSC's combination of deterministic control and signal processing: the 70 MIPS core executes current-loop and speed-loop interrupts within microseconds, the high-resolution PWM drives the inverter with precise dead-time, and on-chip op amps amplify shunt signals for overcurrent protection in hardware-referenced thresholds. The 5V domain matches standard Hall and pressure sensor outputs. With 256KB ECC Flash, developers can include fault logging, parameter storage, and communication stacks without external memory. The exposed-pad 64-VQFN package provides the thermal path needed near power stages when proper PCB copper area is applied.
Recomendado
Power Conversion and Digital Power Supplies
Digital power supplies and DC-DC converters use the DSPIC33EV256GM106T-I/MR for voltage-mode and current-mode control: the fast core closes compensation loops at switching frequencies in the hundreds of kilohertz, PWM peripherals generate phase-shifted or interleaved drive signals, and the 5V logic directly drives many gate-driver ICs. The 256KB Flash holds multiple operating profiles plus firmware-update routines, and ECC protection guards control firmware whose corruption would be catastrophic in a power stage. On-chip op amps can scale feedback dividers, reducing external component count in compact 64-VQFN implementations with high mixed-signal density.
Recomendado
Sensor Signal Acquisition Systems
Multi-sensor acquisition front ends leverage the DSC's on-chip op amps for gain and filtering, its ADC for digitization, and the SENT peripheral for direct digital sensor input - three acquisition paths in one 5V chip. The 70 MIPS core performs background calibration, linearization, and diagnostics while 256KB Flash stores lookup tables and self-test firmware required in safety-conscious measurements. Peripheral Pin Select lets designers optimize the 64-pin pinout so analog traces stay short and digital buses exit on the opposite package side, improving noise performance. Typical deployments include pressure, flow, and position sensing in industrial and vehicular equipment.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para DSPIC33EV256GM106T-I/MR — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | DSPIC33EV256GM106-I/MR | DSPIC33EV256GM106-E/MR | DSPIC33EV256GM106-H/MR | DSPIC33EV128GM106-I/MR | DSPIC33EV256GM006-I/MR |
|---|---|---|---|---|---|---|
| Package | 64-VQFN (9x9) | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / MIPS | 16-bit dsPIC, 70 MIPS | 16-bit dsPIC, 70 MIPS | 16-bit dsPIC, 70 MIPS | 16-bit dsPIC, 70 MIPS | 16-bit dsPIC, 70 MIPS | 16-bit dsPIC, 70 MIPS |
| Flash Memory | 256 KB ECC | 256 KB ECC | 256 KB ECC | 256 KB ECC | 128 KB ECC | 256 KB ECC |
| RAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +125C (extended) | Restricted range (-H suffix) | -40C to +85C | -40C to +85C |
| Peripheral Set | Full GM10x: PWM, SENT, op amps | Full GM10x - same | Full GM10x - same | Full GM10x - same | Full GM10x - same | Reduced GM00x peripheral set |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Diferenciadores clave
- Full 256KB program memory at same package and pinout (frente a DSPIC33EV128GM106-I/MR)
- Extended temperature option in identical footprint (frente a DSPIC33EV256GM106-E/MR)
- Full GM10x peripheral complement including op amps and SENT (frente a DSPIC33EV256GM006-I/MR)
Notas de diseño
The 64-VQFN 9x9 exposed pad is the primary thermal and ground return path. Connect it to a solid ground plane through an array of thermal vias (typically 5x5 or similar per Microchip layout guidance in the family datasheet DS70005144H). Place one 100 nF ceramic decoupling capacitor at each VDD/VSS pin pair, plus bulk capacitance near the supply entry. Short, direct traces from the exposed pad to the plane reduce ground bounce during simultaneous PWM switching.
Use Peripheral Pin Select (PPS) deliberately: route analog-capable pins away from PWM and clock traces on the 9x9 mm footprint. Keep SENT and communication lines away from inverter gate-drive loops. Because PPS mapping is configured in software, lock the final mapping early and document it against the schematic to avoid pin-conflict bugs that only appear during bench bring-up.
The dsPIC33EV runs at 5V - do not connect 3.3V-only peripherals directly to digital I/O without level shifting, even though some pins tolerate reduced drive. Verify that the programming tool (ICSP) header is not shared with PPS-mapped peripherals at reset, as configuration at POR is fixed until firmware remaps. Also confirm configuration-bit settings for the ECC Flash and watchdog, since defaults differ between GM00x and GM10x family members.
Información de cumplimiento
The dsPIC33EV family is positioned by Microchip for harsh industrial and automotive environments and supports Functional Safety (FuSa); specific RoHS/REACH status for this suffix was not present in the provided data and must be confirmed from the Microchip product page.
